NXP Semiconductors - 602/BPA

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602/BPA by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number 602/BPA
Description RF/Microwave Mixers; Mounting Feature: THROUGH HOLE MOUNT; No. of Terminals: 8; Package Body Material: CERAMIC; Technology: BIPOLAR; Screening Level: 38535Q/M;38534H;883B;
Datasheet 602/BPA Datasheet
In Stock193
NAME DESCRIPTION
Package Body Material: CERAMIC
Sub-Category: RF/Microwave Mixers
Maximum Supply Current: 4 mA
Terminal Finish: Tin/Lead (Sn/Pb)
JESD-609 Code: e0
Minimum Operating Temperature: -55 Cel
Mounting Feature: THROUGH HOLE MOUNT
No. of Terminals: 8
Package Equivalence Code: DIP8,.3
Screening Level: 38535Q/M;38534H;883B
Technology: BIPOLAR
Maximum Operating Temperature: 125 Cel
Power Supplies (V): 6
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