BIPOLAR RF/Microwave Mixers 58

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Part	Manufacturer	RF or Microwave Device Type	Mounting Feature	No. of Terminals	Package Body Material	Technology	Screening Level	Maximum Input Power (CW)	Maximum Voltage Standing Wave Ratio	Maximum Supply Current	Construction	Power Supplies (V)	Package Equivalence Code	Characteristic Impedance	Sub-Category	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Additional Features	JESD-609 Code	Minimum Operating Frequency	Maximum Operating Frequency
AD8342ACPZ-REEL7	Analog Devices	DOUBLE BALANCED	SURFACE MOUNT	16	PLASTIC/EPOXY	BIPOLAR		12 dBm		113 mA	COMPONENT	5	LCC16,.12SQ,20	50 ohm	RF/Microwave Mixers	85 Cel	-40 Cel	MATTE TIN		e3	50 MHz	2400 MHz
AD8343ARUZ-REEL7	Analog Devices	DOUBLE BALANCED	SURFACE MOUNT	14	PLASTIC/EPOXY	BIPOLAR			2	75 mA	COMPONENT	5	TSSOP14,.25	50 ohm	RF/Microwave Mixers	85 Cel	-40 Cel	MATTE TIN		e3	0 MHz	2500 MHz
SA602AD/01-T	NXP Semiconductors		SURFACE MOUNT	8	PLASTIC/EPOXY	BIPOLAR				2.8 mA		6	SOP8,.25		RF/Microwave Mixers	85 Cel	-40 Cel	Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)		e4
IAM-82008	Agilent Technologies		SURFACE MOUNT	8	PLASTIC/EPOXY	BIPOLAR				65 mA		10	SOP8,.25		RF/Microwave Mixers	85 Cel	-40 Cel	Tin/Lead (Sn/Pb)		e0
AD831AP-REEL7	Analog Devices	DOUBLE BALANCED	SURFACE MOUNT	20	PLASTIC/EPOXY	BIPOLAR					MODULE	+-5	LDCC20,.4SQ	50 ohm	RF/Microwave Mixers	85 Cel	-40 Cel	TIN LEAD		e0
AD831APZ-REEL7	Analog Devices	DOUBLE BALANCED	SURFACE MOUNT	20	PLASTIC/EPOXY	BIPOLAR					MODULE	+-5	LDCC20,.4SQ	50 ohm	RF/Microwave Mixers	85 Cel	-40 Cel	MATTE TIN		e3
AD8343ARUZ	Analog Devices	DOUBLE BALANCED	SURFACE MOUNT	14	PLASTIC/EPOXY	BIPOLAR			2	75 mA	COMPONENT	5	TSSOP14,.25	50 ohm	RF/Microwave Mixers	85 Cel	-40 Cel	MATTE TIN		e3	0 MHz	2500 MHz
TL442CJ	Texas Instruments		THROUGH HOLE MOUNT	14	CERAMIC	BIPOLAR							DIP14,.3		RF/Microwave Mixers	70 Cel	0 Cel
TL442CJP4	Texas Instruments		THROUGH HOLE MOUNT	14	CERAMIC	BIPOLAR							DIP14,.3		RF/Microwave Mixers	70 Cel	0 Cel
TL442CNP3	Texas Instruments		THROUGH HOLE MOUNT	14	PLASTIC/EPOXY	BIPOLAR							DIP14,.3		RF/Microwave Mixers	70 Cel	0 Cel
TL442CN3	Texas Instruments		THROUGH HOLE MOUNT	14	PLASTIC/EPOXY	BIPOLAR							DIP14,.3		RF/Microwave Mixers	70 Cel	0 Cel
TL442MJ	Texas Instruments		THROUGH HOLE MOUNT	14	CERAMIC	BIPOLAR							DIP14,.3		RF/Microwave Mixers	125 Cel	-55 Cel
TL442CJ4	Texas Instruments		THROUGH HOLE MOUNT	14	CERAMIC	BIPOLAR							DIP14,.3		RF/Microwave Mixers	70 Cel	0 Cel
TL442MJ/883B	Texas Instruments		THROUGH HOLE MOUNT	14	CERAMIC	BIPOLAR	MIL-STD-883 Class B (Modified)						DIP14,.3		RF/Microwave Mixers	125 Cel	-55 Cel
TL442CN	Texas Instruments		THROUGH HOLE MOUNT	14	PLASTIC/EPOXY	BIPOLAR							DIP14,.3		RF/Microwave Mixers	70 Cel	0 Cel
AD8344ACPZ-REEL7	Analog Devices	DOUBLE BALANCED	SURFACE MOUNT	16	PLASTIC/EPOXY	BIPOLAR		12 dBm		95 mA	COMPONENT	5	LCC16,.12SQ,20	50 ohm	RF/Microwave Mixers	85 Cel	-40 Cel	MATTE TIN		e3	400 MHz	1200 MHz
AD8344ACPZ-WP	Analog Devices	DOUBLE BALANCED	SURFACE MOUNT	16	PLASTIC/EPOXY	BIPOLAR		12 dBm		95 mA	COMPONENT	5	LCC16,.12SQ,20	50 ohm	RF/Microwave Mixers	85 Cel	-40 Cel	MATTE TIN		e3	400 MHz	1200 MHz
AD8343ARU-REEL	Analog Devices	DOUBLE BALANCED	SURFACE MOUNT	14	PLASTIC/EPOXY	BIPOLAR			2	75 mA	COMPONENT	5	TSSOP14,.25	50 ohm	RF/Microwave Mixers	85 Cel	-40 Cel	Tin/Lead (Sn85Pb15)		e0	0 MHz	2500 MHz
AD8343ARU-REEL7	Analog Devices	DOUBLE BALANCED	SURFACE MOUNT	14	PLASTIC/EPOXY	BIPOLAR			2	75 mA	COMPONENT	5	TSSOP14,.25	50 ohm	RF/Microwave Mixers	85 Cel	-40 Cel	Tin/Lead (Sn85Pb15)		e0	0 MHz	2500 MHz
AD831APZ	Analog Devices	DOUBLE BALANCED	SURFACE MOUNT	20	PLASTIC/EPOXY	BIPOLAR					MODULE	+-5	LDCC20,.4SQ	50 ohm	RF/Microwave Mixers	85 Cel	-40 Cel	MATTE TIN		e3
AD8343ARU	Analog Devices	DOUBLE BALANCED	SURFACE MOUNT	14	PLASTIC/EPOXY	BIPOLAR			2	75 mA	COMPONENT	5	TSSOP14,.25	50 ohm	RF/Microwave Mixers	85 Cel	-40 Cel	Tin/Lead (Sn85Pb15)		e0	0 MHz	2500 MHz
AD831AP	Analog Devices	DOUBLE BALANCED	SURFACE MOUNT	20	PLASTIC/EPOXY	BIPOLAR					MODULE	+-5	LDCC20,.4SQ	50 ohm	RF/Microwave Mixers	85 Cel	-40 Cel	TIN LEAD		e0
AD8343ARUZ-REEL	Analog Devices	DOUBLE BALANCED	SURFACE MOUNT	14	PLASTIC/EPOXY	BIPOLAR			2	75 mA	COMPONENT	5	TSSOP14,.25	50 ohm	RF/Microwave Mixers	85 Cel	-40 Cel	MATTE TIN		e3	0 MHz	2500 MHz
AD8344ACPZ	Analog Devices		SURFACE MOUNT	16	PLASTIC/EPOXY	BIPOLAR						5	LCC16,.12SQ,20		RF/Microwave Mixers	85 Cel	-40 Cel
AD8342ACPZ-R2	Analog Devices	DOUBLE BALANCED	SURFACE MOUNT	16	PLASTIC/EPOXY	BIPOLAR		12 dBm		113 mA	COMPONENT	5	LCC16,.12SQ,20	50 ohm	RF/Microwave Mixers	85 Cel	-40 Cel	MATTE TIN		e3	50 MHz	2400 MHz
AD8342ACPZ-WP	Analog Devices	DOUBLE BALANCED	SURFACE MOUNT	16	PLASTIC/EPOXY	BIPOLAR		12 dBm		113 mA	COMPONENT	5	LCC16,.12SQ,20	50 ohm	RF/Microwave Mixers	85 Cel	-40 Cel	MATTE TIN		e3	50 MHz	2400 MHz
ADL5801XCPZ-R7	Analog Devices		SURFACE MOUNT	24	PLASTIC/EPOXY	BIPOLAR						5	LCC24,.16SQ,20		RF/Microwave Mixers	85 Cel	-40 Cel
TDA6403A	NXP Semiconductors		SURFACE MOUNT	28	PLASTIC/EPOXY	BIPOLAR						5	SSOP28,.3		RF/Microwave Mixers	85 Cel	-20 Cel
SA602AFE	NXP Semiconductors		THROUGH HOLE MOUNT	8	CERAMIC	BIPOLAR				2.8 mA		6	DIP8,.3		RF/Microwave Mixers	85 Cel	-40 Cel	Tin/Lead (Sn/Pb)		e0
NE602AFE	NXP Semiconductors		THROUGH HOLE MOUNT	8	CERAMIC	BIPOLAR				2.8 mA		6	DIP8,.3		RF/Microwave Mixers	70 Cel	0 Cel	Tin/Lead (Sn/Pb)		e0
BGA2022	NXP Semiconductors	DOUBLE BALANCED	SURFACE MOUNT	6	PLASTIC/EPOXY	BIPOLAR		10 dBm	2	8 mA	COMPONENT	2.8	TSSOP6,.08	50 ohm	RF/Microwave Mixers			Tin (Sn)	HIGH ISOLATION	e3	880 MHz	2450 MHz
NE602AN	NXP Semiconductors		THROUGH HOLE MOUNT	8	PLASTIC/EPOXY	BIPOLAR				2.8 mA		6	DIP8,.3		RF/Microwave Mixers	70 Cel	0 Cel	Tin/Lead (Sn/Pb)		e0
NE602AD	NXP Semiconductors		SURFACE MOUNT	8	PLASTIC/EPOXY	BIPOLAR				2.8 mA		6	SOP8,.25		RF/Microwave Mixers	70 Cel	0 Cel	Tin/Lead (Sn/Pb)		e0
BGA2022,115	NXP Semiconductors	DOUBLE BALANCED	SURFACE MOUNT	6	PLASTIC/EPOXY	BIPOLAR		10 dBm	2	8 mA	COMPONENT	2.8	TSSOP6,.08	50 ohm	RF/Microwave Mixers			Tin (Sn)		e3	880 MHz	2450 MHz
TDA5745TS	NXP Semiconductors	DOUBLE BALANCED	SURFACE MOUNT	24	PLASTIC/EPOXY	BIPOLAR				65 mA		5	SSOP24,.3		RF/Microwave Mixers	85 Cel	-20 Cel
602/BPA	NXP Semiconductors		THROUGH HOLE MOUNT	8	CERAMIC	BIPOLAR	38535Q/M;38534H;883B			4 mA		6	DIP8,.3		RF/Microwave Mixers	125 Cel	-55 Cel	Tin/Lead (Sn/Pb)		e0
TDA5744TS	NXP Semiconductors	DOUBLE BALANCED	SURFACE MOUNT	24	PLASTIC/EPOXY	BIPOLAR				65 mA		5	SSOP24,.3		RF/Microwave Mixers	85 Cel	-20 Cel
NE602AD-T	NXP Semiconductors		SURFACE MOUNT	8	PLASTIC/EPOXY	BIPOLAR				2.8 mA		6	SOP8,.25		RF/Microwave Mixers	70 Cel	0 Cel	Tin/Lead (Sn/Pb)		e0
MC13142DR2	NXP Semiconductors		SURFACE MOUNT	16	PLASTIC/EPOXY	BIPOLAR				26 mA		3	SOP16,.25		RF/Microwave Mixers	85 Cel	-40 Cel
PMB2335	Infineon Technologies	TRIPLE BALANCED	SURFACE MOUNT	10	PLASTIC/EPOXY	BIPOLAR					COMPONENT	2.7/4.5	TSSOP10,.19,20	50 ohm	RF/Microwave Mixers	85 Cel	-40 Cel	Tin/Lead (Sn/Pb)	LOW NOISE	e0		3000 MHz
TDA6130-5X4	Infineon Technologies	DOUBLE BALANCED	SURFACE MOUNT	14	PLASTIC/EPOXY	BIPOLAR				2.1 mA	COMPONENT	6	SOP14,.25		RF/Microwave Mixers	70 Cel	0 Cel	Tin/Lead (Sn/Pb)		e0
PMB2330	Infineon Technologies		SURFACE MOUNT	8	PLASTIC/EPOXY	BIPOLAR						3/7	SOP8,.25		RF/Microwave Mixers	85 Cel	-40 Cel	Tin/Lead (Sn/Pb)		e0
TDA6131XS	Infineon Technologies	TRIPLE BALANCED	SURFACE MOUNT	16	PLASTIC/EPOXY	BIPOLAR				13.1 mA	COMPONENT	2.7/4.5	TSSOP16,.25		RF/Microwave Mixers	85 Cel	-40 Cel		LOW NOISE			3000 MHz
PMB2331	Infineon Technologies	TRIPLE BALANCED	SURFACE MOUNT	8	PLASTIC/EPOXY	BIPOLAR					COMPONENT	2.7/4.5	SOP8,.25	50 ohm	RF/Microwave Mixers	85 Cel	-40 Cel	Tin/Lead (Sn/Pb)	LOW NOISE	e0		2000 MHz
TDA6130X4	Infineon Technologies		SURFACE MOUNT	14	PLASTIC/EPOXY	BIPOLAR						6	SOP14,.25		RF/Microwave Mixers	70 Cel	0 Cel	Tin/Lead (Sn/Pb)		e0
TBB042G	Infineon Technologies		SURFACE MOUNT	14	PLASTIC/EPOXY	BIPOLAR				2.9 mA		12	SOP14,.25		RF/Microwave Mixers	70 Cel	-15 Cel	Tin/Lead (Sn/Pb)		e0
TUA6010X	Infineon Technologies	DOUBLE BALANCED	SURFACE MOUNT	28	PLASTIC/EPOXY	BIPOLAR				33 mA		5	SOP28,.4		RF/Microwave Mixers	80 Cel	-20 Cel	Tin/Lead (Sn/Pb)		e0
TA4101F(TE85L)	Toshiba		SURFACE MOUNT	8	PLASTIC/EPOXY	BIPOLAR				7.5 mA		5	TSSOP8,.1		RF/Microwave Mixers	85 Cel	-40 Cel

RF/Microwave Mixers

RF/microwave mixers are electronic devices used in radio frequency (RF) and microwave systems to convert one frequency to another. They perform frequency translation by multiplying two input signals, a local oscillator (LO) signal and a radio frequency (RF) or intermediate frequency (IF) signal, to produce an output signal that has the sum and difference frequencies of the inputs.

RF/microwave mixers are commonly used in a variety of applications, including frequency conversion, phase detection, modulation and demodulation, and signal generation. They are widely used in telecommunications, radar systems, navigation systems, and satellite communication systems.

RF/microwave mixers are available in various types, including diode mixers, transistor mixers, and monolithic microwave integrated circuit (MMIC) mixers. The choice of mixer depends on the application requirements, such as the desired frequency range, signal bandwidth, conversion gain, and noise figure.