BIPOLAR RF/Microwave Mixers 58

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Manufacturers
    • Agilent Technologies
    • Analog Devices
    • Broadcom
    • Infineon Technologies
    • L-3 Narda-miteq
    • M/a-com Technology Solutions
    • Maxim Integrated
    • Mini-circuits
    • Motorola
    • NXP Semiconductors
    • Onsemi
    • Psemi
    • Qorvo
    • Renesas Electronics
    • Skyworks Solutions
    • Texas Instruments
    • Toshiba
RF or Microwave Device Type
    • DOUBLE BALANCED
    • IMAGE REJECTION
    • SINGLE BALANCED
    • TRIPLE BALANCED
Mounting Feature
    • SURFACE MOUNT
    • THROUGH HOLE MOUNT
No. of Terminals
    • 10
    • 12
    • 14
    • 16
    • 20
    • 24
    • 28
    • 32
    • 36
    • 4
    • 40
    • 48
    • 5
    • 6
    • 7
    • 8
Package Body Material
    • CERAMIC
    • METAL
    • PLASTIC/EPOXY
Technology (1)
    • BIPOLAR
    • BICMOS
    • CMOS
    • ECL
    • GAAS
    • HYBRID
Screening Level
    • 38535Q/M;38534H;883B
    • 38535V;34K;Cls S
    • MIL-STD-883 Class B (Modified)
Maximum Input Power (CW)
    • -88 dBm
    • 10 dBm
    • 12 dBm
    • 13 dBm
    • 15 dBm
    • 15.5 dBm
    • 16 dBm
    • 17 dBm
    • 18 dBm
    • 19 dBm
    • 20 dBm
    • 21 dBm
    • 22 dBm
    • 23 dBm
    • 23.01 dBm
    • 24 dBm
    • 25 dBm
    • 26 dBm
    • 27 dBm
    • 28 dBm
    • 3 dBm
    • 30 dBm
    • 5 dBm
    • 7.5 dBm
Maximum Voltage Standing Wave Ratio
    • 1
    • 1.5
    • 1.53
    • 1.67
    • 1.79
    • 1.8
    • 1.87
    • 1.92
    • 1.96
    • 2
    • 2.16
    • 2.22
    • 2.25
    • 2.4
    • 2.5
    • 2.6
    • 2.61
    • 2.67
    • 2.7
    • 3
    • 3.01
    • 3.58
    • 4.18
    • 5.87
    • 6.15
    • 6.26
Maximum Supply Current
    • 105 mA
    • 110 mA
    • 112 mA
    • 113 mA
    • 125 mA
    • 13.1 mA
    • 140 mA
    • 145 mA
    • 15 mA
    • 150 mA
    • 16 mA
    • 168 mA
    • 185 mA
    • 195 mA
    • 2.1 mA
    • 2.2 mA
    • 2.5 mA
    • 2.8 mA
    • 2.9 mA
    • 200 mA
    • 210 mA
    • 215 mA
    • 220 mA
    • 26 mA
    • 265 mA
    • 3 mA
    • 3.9 mA
    • 30 mA
    • 300 mA
    • 33 mA
    • 345 mA
    • 4 mA
    • 4.3 mA
    • 40 mA
    • 420 mA
    • 450 mA
    • 46 mA
    • 50 mA
    • 57 mA
    • 60 mA
    • 65 mA
    • 7.5 mA
    • 70 mA
    • 75 mA
    • 8 mA
    • 8.5 mA
    • 95 mA
Construction
    • COAXIAL
    • COMPONENT
    • MODULE
Power Supplies (V)
    • +-5
    • 10
    • 12
    • 2.7/4.5
    • 2.8
    • 2/5
    • 3
    • 3.3
    • 3.3/5
    • 3/4
    • 3/5
    • 3/7
    • 4
    • 4.5
    • 5
    • 5,5/7
    • 6
Package Equivalence Code
    • CAN4,.3
    • DIE OR CHIP
    • DILCC6,.25
    • DIP14,.3
    • DIP8,.2,200
    • DIP8,.3
    • FL6,.07,25
    • FL6,.2,100
    • FL8,.2FL
    • GWDIP6,.4
    • LCC10,.08SQ,20
    • LCC12,.08X.12,20
    • LCC12,.12SQ,20
    • LCC12,.2SQ
    • LCC16,.12SQ,20
    • LCC16,.16SQ,25
    • LCC16,.1X.14,20
    • LCC20,.16SQ,20
    • LCC20,.20SQ,25
    • LCC24,.16SQ,20
    • LCC24,.16X.2,20
    • LCC32,.2SQ,20
    • LCC32,.32SQ,32
    • LCC36,.25SQ,20
    • LCC40,.24SQ,20
    • LCC6(UNSPEC)
    • LCC6,.2SQ,40
    • LCC6/8,.37X.5,170
    • LCC8,.2SQ,28
    • LDCC20,.4SQ
    • SMDIP6,.3
    • SMDIP6,.4
    • SMDIP8,.3
    • SMSIP4H,.4
    • SO7,.28
    • SOLCC8,.08,20
    • SOP14(UNSPEC)
    • SOP14,.25
    • SOP16,.25
    • SOP20,.4
    • SOP28,.4
    • SOP8,.25
    • SOP8,.3
    • SOP8,.4
    • SSOP20,.25
    • SSOP24,.3
    • SSOP28,.3
    • TQFP48,.35SQ
    • TSOP5/6,.11,37
    • TSOP8,.19
    • TSSOP10,.19,20
    • TSSOP14,.25
    • TSSOP16,.25
    • TSSOP6,.08
    • TSSOP8,.1
    • TSSOP8,.16
    • TSSOP8,.19
Characteristic Impedance
    • 200 ohm
    • 300 ohm
    • 50 ohm
Sub-Category
    • RF/Microwave Mixers
    • RF/Microwave Up/Down Converters
Maximum Operating Temperature
    • 100 Cel
    • 105 Cel
    • 125 Cel
    • 140 Cel
    • 70 Cel
    • 80 Cel
    • 85 Cel
Minimum Operating Temperature
    • -10 Cel
    • -15 Cel
    • -20 Cel
    • -25 Cel
    • -30 Cel
    • -40 Cel
    • -50 Cel
    • -54 Cel
    • -55 Cel
    • 0 Cel
Terminal Finish
    • Bright Tin (Sn)
    • GOLD
    • GOLD OVER NICKEL
    • Gold (Au)
    • Gold (Au) - with Nickel (Ni) barrier
    • Gold Flash (Au) - with Nickel (Ni) barrier
    • Gold/Nickel (Au/Ni)
    • MATTE TIN
    • Matte Tin (Sn)
    • Matte Tin (Sn) - annealed
    • Nickel/Palladium/Gold (Ni/Pd/Au)
    • Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)
    • TIN
    • TIN LEAD
    • TIN OVER NICKEL
    • TUNGSTEN NICKEL GOLD
    • Tin (Sn)
    • Tin (Sn) - with Nickel (Ni) barrier
    • Tin/Bismuth (Sn/Bi)
    • Tin/Lead (Sn/Pb)
    • Tin/Lead (Sn85Pb15)
    • Tungsten/Nickel/Gold (W/Ni/Au)
Maximum Conversion Loss
    • 10 dB
    • 10.5 dB
    • 11 dB
    • 11.5 dB
    • 12 dB
    • 12.5 dB
    • 13 dB
    • 13.5 dB
    • 14 dB
    • 14.5 dB
    • 15 dB
    • 15.5 dB
    • 16 dB
    • 18 dB
    • 6 dB
    • 6.2 dB
    • 6.9 dB
    • 7 dB
    • 7.5 dB
    • 8 dB
    • 8.2 dB
    • 8.4 dB
    • 8.5 dB
    • 8.9 dB
    • 9 dB
    • 9.1 dB
    • 9.2 dB
    • 9.4 dB
    • 9.5 dB
    • 9.7 dB
    • 9.8 dB
Additional Features
    • 2.92 MM; SMA
    • CMOS COMPATIBLE
    • HIGH DYNAMIC RANGE
    • HIGH ISOLATION
    • HIGH RELIABILITY
    • HIGH RELIABILITY, HIGH DYNAMIC RANGE
    • I/P POWER-MAX (PEAK)=23DBM
    • IMAGE REJECTION
    • LOW NOISE
    • SMA
    • SMA, I/P POWER-MAX (PEAK)=26DBM
    • SMA-F
    • USABLE TO 3 GHZ
    • USABLE TO 42 GHZ
JESD-609 Code
    • e0
    • e3
    • e4
    • e6
Minimum Operating Frequency
    • .03 MHz
    • .15 MHz
    • .5 MHz
    • 0 MHz
    • 1 MHz
    • 10 MHz
    • 100 MHz
    • 1000 MHz
    • 10000 MHz
    • 11000 MHz
    • 1200 MHz
    • 1300 MHz
    • 14000 MHz
    • 14500 MHz
    • 1500 MHz
    • 15000 MHz
    • 1600 MHz
    • 16000 MHz
    • 1700 MHz
    • 17000 MHz
    • 17700 MHz
    • 1800 MHz
    • 18000 MHz
    • 19000 MHz
    • 2 MHz
    • 20 MHz
    • 200 MHz
    • 2000 MHz
    • 20000 MHz
    • 21000 MHz
    • 22000 MHz
    • 2250 MHz
    • 2300 MHz
    • 23000 MHz
    • 2400 MHz
    • 24000 MHz
    • 2500 MHz
    • 25000 MHz
    • 26000 MHz
    • 300 MHz
    • 3000 MHz
    • 30000 MHz
    • 3100 MHz
    • 33000 MHz
    • 3500 MHz
    • 35000 MHz
    • 3700 MHz
    • 3800 MHz
    • 390 MHz
    • 400 MHz
    • 4000 MHz
    • 450 MHz
    • 4500 MHz
    • 5 MHz
    • 50 MHz
    • 500 MHz
    • 5000 MHz
    • 54000 MHz
    • 5500 MHz
    • 5900 MHz
    • 600 MHz
    • 6000 MHz
    • 700 MHz
    • 7000 MHz
    • 70000 MHz
    • 71000 MHz
    • 800 MHz
    • 8000 MHz
    • 81000 MHz
    • 8500 MHz
    • 880 MHz
    • 9000 MHz
Maximum Operating Frequency
    • 100 MHz
    • 1000 MHz
    • 10000 MHz
    • 1100 MHz
    • 11000 MHz
    • 1200 MHz
    • 12000 MHz
    • 1300 MHz
    • 13500 MHz
    • 1400 MHz
    • 14000 MHz
    • 1500 MHz
    • 15000 MHz
    • 16000 MHz
    • 1700 MHz
    • 1800 MHz
    • 18000 MHz
    • 19500 MHz
    • 2000 MHz
    • 20000 MHz
    • 21000 MHz
    • 2200 MHz
    • 2300 MHz
    • 23000 MHz
    • 23600 MHz
    • 2400 MHz
    • 2450 MHz
    • 2500 MHz
    • 25000 MHz
    • 26000 MHz
    • 26500 MHz
    • 2700 MHz
    • 27000 MHz
    • 28000 MHz
    • 2900 MHz
    • 3000 MHz
    • 30000 MHz
    • 31000 MHz
    • 32000 MHz
    • 33000 MHz
    • 33500 MHz
    • 34000 MHz
    • 3500 MHz
    • 36000 MHz
    • 37000 MHz
    • 3800 MHz
    • 38000 MHz
    • 3900 MHz
    • 400 MHz
    • 4000 MHz
    • 40000 MHz
    • 4200 MHz
    • 42000 MHz
    • 43000 MHz
    • 4500 MHz
    • 45000 MHz
    • 500 MHz
    • 5000 MHz
    • 50000 MHz
    • 6000 MHz
    • 64000 MHz
    • 7000 MHz
    • 750 MHz
    • 77 MHz
    • 8000 MHz
    • 8500 MHz
    • 86000 MHz
    • 9000 MHz
    • 90000 MHz
Reset All
Part RoHS Manufacturer RF or Microwave Device Type Mounting Feature No. of Terminals Package Body Material Technology Screening Level Maximum Input Power (CW) Maximum Voltage Standing Wave Ratio Maximum Supply Current Construction Power Supplies (V) Package Equivalence Code Characteristic Impedance Sub-Category Maximum Operating Temperature Minimum Operating Temperature Terminal Finish Maximum Conversion Loss Additional Features JESD-609 Code Minimum Operating Frequency Maximum Operating Frequency

TA4101F

Toshiba

DOUBLE BALANCED

SURFACE MOUNT

8

PLASTIC/EPOXY

BIPOLAR

7.5 mA

COMPONENT

5

TSSOP8,.16

RF/Microwave Mixers

85 Cel

-40 Cel

TA4101F(TE85L,F)

Toshiba

SURFACE MOUNT

8

PLASTIC/EPOXY

BIPOLAR

7.5 mA

5

TSSOP8,.1

RF/Microwave Mixers

85 Cel

-40 Cel

UPC8002GR-E1-A

Renesas Electronics

SURFACE MOUNT

20

PLASTIC/EPOXY

BIPOLAR

2.2 mA

3

SSOP20,.25

RF/Microwave Mixers

85 Cel

-30 Cel

UPC8001GR

Renesas Electronics

SURFACE MOUNT

14

PLASTIC/EPOXY

BIPOLAR

4.3 mA

3

SOP14(UNSPEC)

RF/Microwave Mixers

85 Cel

-30 Cel

Tin/Lead (Sn/Pb)

e0

UPC8002GR-E2-A

Renesas Electronics

SURFACE MOUNT

20

PLASTIC/EPOXY

BIPOLAR

2.2 mA

3

SSOP20,.25

RF/Microwave Mixers

85 Cel

-30 Cel

UPC2753GR-E1

Renesas Electronics

SURFACE MOUNT

20

PLASTIC/EPOXY

BIPOLAR

8.5 mA

3

SSOP20,.25

RF/Microwave Mixers

85 Cel

-40 Cel

Tin/Lead (Sn/Pb)

e0

UPC8002GR

Renesas Electronics

SURFACE MOUNT

20

PLASTIC/EPOXY

BIPOLAR

2.2 mA

3

SSOP20,.25

RF/Microwave Mixers

85 Cel

-30 Cel

Tin/Lead (Sn/Pb)

e0

UPC8217TU-E2-A

Renesas Electronics

SURFACE MOUNT

8

PLASTIC/EPOXY

BIPOLAR

15 mA

3

SOLCC8,.08,20

RF/Microwave Mixers

70 Cel

-30 Cel

UPC8002GR-A

Renesas Electronics

SURFACE MOUNT

20

PLASTIC/EPOXY

BIPOLAR

2.2 mA

3

SSOP20,.25

RF/Microwave Mixers

85 Cel

-30 Cel

UPC2753GR-E2

Renesas Electronics

SURFACE MOUNT

20

PLASTIC/EPOXY

BIPOLAR

8.5 mA

3

SSOP20,.25

RF/Microwave Mixers

85 Cel

-40 Cel

Tin/Lead (Sn/Pb)

e0

RF/Microwave Mixers

RF/microwave mixers are electronic devices used in radio frequency (RF) and microwave systems to convert one frequency to another. They perform frequency translation by multiplying two input signals, a local oscillator (LO) signal and a radio frequency (RF) or intermediate frequency (IF) signal, to produce an output signal that has the sum and difference frequencies of the inputs.

RF/microwave mixers are commonly used in a variety of applications, including frequency conversion, phase detection, modulation and demodulation, and signal generation. They are widely used in telecommunications, radar systems, navigation systems, and satellite communication systems.

RF/microwave mixers are available in various types, including diode mixers, transistor mixers, and monolithic microwave integrated circuit (MMIC) mixers. The choice of mixer depends on the application requirements, such as the desired frequency range, signal bandwidth, conversion gain, and noise figure.