PLASTIC/EPOXY RF/Microwave Mixers 250

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Part	Manufacturer	RF or Microwave Device Type	Mounting Feature	No. of Terminals	Package Body Material	Technology	Maximum Input Power (CW)	Maximum Voltage Standing Wave Ratio	Maximum Supply Current	Construction	Power Supplies (V)	Package Equivalence Code	Characteristic Impedance	Sub-Category	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Maximum Conversion Loss	Additional Features	JESD-609 Code	Minimum Operating Frequency	Maximum Operating Frequency
LTC5567IUF#PBF	Analog Devices	DOUBLE BALANCED	SURFACE MOUNT	16	PLASTIC/EPOXY	CMOS	15 dBm		105 mA	COMPONENT	3.3	LCC16,.16SQ,25	50 ohm		105 Cel	-40 Cel	MATTE TIN			e3	300 MHz	4000 MHz
LTC5576IUF#TRPBF	Analog Devices	DOUBLE BALANCED	SURFACE MOUNT	16	PLASTIC/EPOXY		15 dBm		112 mA	COMPONENT	3.3/5	LCC16,.16SQ,25	50 ohm		105 Cel	-40 Cel	MATTE TIN			e3	3000 MHz	8000 MHz
SPM5001	Onsemi		SURFACE MOUNT	6	PLASTIC/EPOXY							FL6,.07,25		RF/Microwave Mixers
TDA6403A	NXP Semiconductors		SURFACE MOUNT	28	PLASTIC/EPOXY	BIPOLAR					5	SSOP28,.3		RF/Microwave Mixers	85 Cel	-20 Cel
BGA2022	NXP Semiconductors	DOUBLE BALANCED	SURFACE MOUNT	6	PLASTIC/EPOXY	BIPOLAR	10 dBm	2	8 mA	COMPONENT	2.8	TSSOP6,.08	50 ohm	RF/Microwave Mixers			Tin (Sn)		HIGH ISOLATION	e3	880 MHz	2450 MHz
SA631DK	NXP Semiconductors	DOUBLE BALANCED	SURFACE MOUNT	20	PLASTIC/EPOXY	BICMOS	20 dBm				3	SSOP20,.25		RF/Microwave Mixers	85 Cel	-40 Cel					800 MHz	1000 MHz
NE602AN	NXP Semiconductors		THROUGH HOLE MOUNT	8	PLASTIC/EPOXY	BIPOLAR			2.8 mA		6	DIP8,.3		RF/Microwave Mixers	70 Cel	0 Cel	Tin/Lead (Sn/Pb)			e0
NE602AD	NXP Semiconductors		SURFACE MOUNT	8	PLASTIC/EPOXY	BIPOLAR			2.8 mA		6	SOP8,.25		RF/Microwave Mixers	70 Cel	0 Cel	Tin/Lead (Sn/Pb)			e0
TFF1013HN/N1,115	NXP Semiconductors		SURFACE MOUNT	16	PLASTIC/EPOXY						5	LCC16,.1X.14,20		RF/Microwave Mixers	85 Cel	-40 Cel
BGA2022,115	NXP Semiconductors	DOUBLE BALANCED	SURFACE MOUNT	6	PLASTIC/EPOXY	BIPOLAR	10 dBm	2	8 mA	COMPONENT	2.8	TSSOP6,.08	50 ohm	RF/Microwave Mixers			Tin (Sn)			e3	880 MHz	2450 MHz
TDA5745TS	NXP Semiconductors	DOUBLE BALANCED	SURFACE MOUNT	24	PLASTIC/EPOXY	BIPOLAR			65 mA		5	SSOP24,.3		RF/Microwave Mixers	85 Cel	-20 Cel
SA611DK	NXP Semiconductors	DOUBLE BALANCED	SURFACE MOUNT	20	PLASTIC/EPOXY		20 dBm			COMPONENT	3/5	SSOP20,.25		RF/Microwave Mixers	85 Cel	-40 Cel					800 MHz	1000 MHz
TDA5744TS	NXP Semiconductors	DOUBLE BALANCED	SURFACE MOUNT	24	PLASTIC/EPOXY	BIPOLAR			65 mA		5	SSOP24,.3		RF/Microwave Mixers	85 Cel	-20 Cel
NE602AD-T	NXP Semiconductors		SURFACE MOUNT	8	PLASTIC/EPOXY	BIPOLAR			2.8 mA		6	SOP8,.25		RF/Microwave Mixers	70 Cel	0 Cel	Tin/Lead (Sn/Pb)			e0
MC13142DR2	NXP Semiconductors		SURFACE MOUNT	16	PLASTIC/EPOXY	BIPOLAR			26 mA		3	SOP16,.25		RF/Microwave Mixers	85 Cel	-40 Cel
PMB2335	Infineon Technologies	TRIPLE BALANCED	SURFACE MOUNT	10	PLASTIC/EPOXY	BIPOLAR				COMPONENT	2.7/4.5	TSSOP10,.19,20	50 ohm	RF/Microwave Mixers	85 Cel	-40 Cel	Tin/Lead (Sn/Pb)		LOW NOISE	e0		3000 MHz
TDA6130-5X4	Infineon Technologies	DOUBLE BALANCED	SURFACE MOUNT	14	PLASTIC/EPOXY	BIPOLAR			2.1 mA	COMPONENT	6	SOP14,.25		RF/Microwave Mixers	70 Cel	0 Cel	Tin/Lead (Sn/Pb)			e0
PMB2330	Infineon Technologies		SURFACE MOUNT	8	PLASTIC/EPOXY	BIPOLAR					3/7	SOP8,.25		RF/Microwave Mixers	85 Cel	-40 Cel	Tin/Lead (Sn/Pb)			e0
CMY90	Infineon Technologies		SURFACE MOUNT	7	PLASTIC/EPOXY	GAAS			2.5 mA		3.3/5	SO7,.28		RF/Microwave Mixers			Tin/Lead (Sn/Pb)			e0
TDA6131XS	Infineon Technologies	TRIPLE BALANCED	SURFACE MOUNT	16	PLASTIC/EPOXY	BIPOLAR			13.1 mA	COMPONENT	2.7/4.5	TSSOP16,.25		RF/Microwave Mixers	85 Cel	-40 Cel			LOW NOISE			3000 MHz
PMB2331	Infineon Technologies	TRIPLE BALANCED	SURFACE MOUNT	8	PLASTIC/EPOXY	BIPOLAR				COMPONENT	2.7/4.5	SOP8,.25	50 ohm	RF/Microwave Mixers	85 Cel	-40 Cel	Tin/Lead (Sn/Pb)		LOW NOISE	e0		2000 MHz
PMB2210T	Infineon Technologies		SURFACE MOUNT	20	PLASTIC/EPOXY						5,5/7	SOP20,.4		RF/Microwave Mixers	70 Cel	0 Cel	Tin/Lead (Sn/Pb)			e0
TDA6130X4	Infineon Technologies		SURFACE MOUNT	14	PLASTIC/EPOXY	BIPOLAR					6	SOP14,.25		RF/Microwave Mixers	70 Cel	0 Cel	Tin/Lead (Sn/Pb)			e0
TBB042G	Infineon Technologies		SURFACE MOUNT	14	PLASTIC/EPOXY	BIPOLAR			2.9 mA		12	SOP14,.25		RF/Microwave Mixers	70 Cel	-15 Cel	Tin/Lead (Sn/Pb)			e0
TBB204G	Infineon Technologies		SURFACE MOUNT	14	PLASTIC/EPOXY				3.9 mA		5	SOP14,.25		RF/Microwave Mixers	85 Cel	-40 Cel	Tin/Lead (Sn/Pb)			e0
TUA6010X	Infineon Technologies	DOUBLE BALANCED	SURFACE MOUNT	28	PLASTIC/EPOXY	BIPOLAR			33 mA		5	SOP28,.4		RF/Microwave Mixers	80 Cel	-20 Cel	Tin/Lead (Sn/Pb)			e0
MAX19757ETX+T	Maxim Integrated	DOUBLE BALANCED	SURFACE MOUNT	36	PLASTIC/EPOXY	BICMOS			420 mA		5	LCC36,.25SQ,20		RF/Microwave Up/Down Converters
MAX19757ETX+	Maxim Integrated	DOUBLE BALANCED	SURFACE MOUNT	36	PLASTIC/EPOXY	BICMOS			420 mA		5	LCC36,.25SQ,20		RF/Microwave Up/Down Converters			MATTE TIN			e3
MAX9995ETX-T	Maxim Integrated	DOUBLE BALANCED	SURFACE MOUNT	36	PLASTIC/EPOXY	BICMOS	20 dBm	1.5	110 mA	COMPONENT	5	LCC36,.25SQ,20	50 ohm	RF/Microwave Up/Down Converters	85 Cel	-40 Cel	Tin/Lead (Sn/Pb)			e0	1700 MHz	2200 MHz
MAX9995ETX	Maxim Integrated	DOUBLE BALANCED	SURFACE MOUNT	36	PLASTIC/EPOXY	BICMOS	20 dBm	1.5	110 mA	COMPONENT	5	LCC36,.25SQ,20	50 ohm	RF/Microwave Up/Down Converters	85 Cel	-40 Cel	TIN LEAD			e0	1700 MHz	2200 MHz
TA4101F(TE85L)	Toshiba		SURFACE MOUNT	8	PLASTIC/EPOXY	BIPOLAR			7.5 mA		5	TSSOP8,.1		RF/Microwave Mixers	85 Cel	-40 Cel
TA4101F	Toshiba	DOUBLE BALANCED	SURFACE MOUNT	8	PLASTIC/EPOXY	BIPOLAR			7.5 mA	COMPONENT	5	TSSOP8,.16		RF/Microwave Mixers	85 Cel	-40 Cel
TA4101F(TE85L,F)	Toshiba		SURFACE MOUNT	8	PLASTIC/EPOXY	BIPOLAR			7.5 mA		5	TSSOP8,.1		RF/Microwave Mixers	85 Cel	-40 Cel
UPC8002GR-E1-A	Renesas Electronics		SURFACE MOUNT	20	PLASTIC/EPOXY	BIPOLAR			2.2 mA		3	SSOP20,.25		RF/Microwave Mixers	85 Cel	-30 Cel
UPC8001GR	Renesas Electronics		SURFACE MOUNT	14	PLASTIC/EPOXY	BIPOLAR			4.3 mA		3	SOP14(UNSPEC)		RF/Microwave Mixers	85 Cel	-30 Cel	Tin/Lead (Sn/Pb)			e0
UPC8002GR-E2-A	Renesas Electronics		SURFACE MOUNT	20	PLASTIC/EPOXY	BIPOLAR			2.2 mA		3	SSOP20,.25		RF/Microwave Mixers	85 Cel	-30 Cel
F1763NBGI	Renesas Electronics		SURFACE MOUNT	20	PLASTIC/EPOXY				215 mA		5	LCC20,.20SQ,25		RF/Microwave Mixers			TIN			e3
UPC2753GR-E1	Renesas Electronics		SURFACE MOUNT	20	PLASTIC/EPOXY	BIPOLAR			8.5 mA		3	SSOP20,.25		RF/Microwave Mixers	85 Cel	-40 Cel	Tin/Lead (Sn/Pb)			e0
UPC8002GR	Renesas Electronics		SURFACE MOUNT	20	PLASTIC/EPOXY	BIPOLAR			2.2 mA		3	SSOP20,.25		RF/Microwave Mixers	85 Cel	-30 Cel	Tin/Lead (Sn/Pb)			e0
UPC8217TU-E2-A	Renesas Electronics		SURFACE MOUNT	8	PLASTIC/EPOXY	BIPOLAR			15 mA		3	SOLCC8,.08,20		RF/Microwave Mixers	70 Cel	-30 Cel
UPC8002GR-A	Renesas Electronics		SURFACE MOUNT	20	PLASTIC/EPOXY	BIPOLAR			2.2 mA		3	SSOP20,.25		RF/Microwave Mixers	85 Cel	-30 Cel
UPC2753GR-E2	Renesas Electronics		SURFACE MOUNT	20	PLASTIC/EPOXY	BIPOLAR			8.5 mA		3	SSOP20,.25		RF/Microwave Mixers	85 Cel	-40 Cel	Tin/Lead (Sn/Pb)			e0
F1178NBGI	Renesas Electronics		SURFACE MOUNT	36	PLASTIC/EPOXY				345 mA		5	LCC36,.25SQ,20		RF/Microwave Mixers			TIN			e3
UPC1685G	Renesas Electronics		SURFACE MOUNT	8	PLASTIC/EPOXY						5	SOP8,.25		RF/Microwave Mixers	70 Cel	-20 Cel	Tin/Lead (Sn/Pb)			e0
AMMP-6546-TR2G	Broadcom	TRIPLE BALANCED	SURFACE MOUNT	8	PLASTIC/EPOXY		25 dBm			COMPONENT		LCC8,.2SQ,28	50 ohm	RF/Microwave Mixers				12 dB			18000 MHz	40000 MHz
AMMP-6546-BLKG	Broadcom	TRIPLE BALANCED	SURFACE MOUNT	8	PLASTIC/EPOXY		25 dBm			COMPONENT		LCC8,.2SQ,28	50 ohm	RF/Microwave Mixers				12 dB			18000 MHz	40000 MHz
IAM-92516-TR1	Broadcom	TRIPLE BALANCED	SURFACE MOUNT	16	PLASTIC/EPOXY	GAAS	30 dBm		30 mA	COMPONENT	5	LCC16,.12SQ,20	50 ohm	RF/Microwave Mixers			Matte Tin (Sn)	6.9 dB		e3	400 MHz	3500 MHz
IAM-93516-TR1	Broadcom	TRIPLE BALANCED	SURFACE MOUNT	16	PLASTIC/EPOXY	GAAS	30 dBm		125 mA	COMPONENT	5	LCC16,.12SQ,20	50 ohm	RF/Microwave Mixers			Matte Tin (Sn)			e3	400 MHz	3000 MHz

RF/Microwave Mixers

RF/microwave mixers are electronic devices used in radio frequency (RF) and microwave systems to convert one frequency to another. They perform frequency translation by multiplying two input signals, a local oscillator (LO) signal and a radio frequency (RF) or intermediate frequency (IF) signal, to produce an output signal that has the sum and difference frequencies of the inputs.

RF/microwave mixers are commonly used in a variety of applications, including frequency conversion, phase detection, modulation and demodulation, and signal generation. They are widely used in telecommunications, radar systems, navigation systems, and satellite communication systems.

RF/microwave mixers are available in various types, including diode mixers, transistor mixers, and monolithic microwave integrated circuit (MMIC) mixers. The choice of mixer depends on the application requirements, such as the desired frequency range, signal bandwidth, conversion gain, and noise figure.