Part | RoHS | Manufacturer | RF or Microwave Device Type | Mounting Feature | No. of Terminals | Package Body Material | Technology | Screening Level | Maximum Input Power (CW) | Maximum Voltage Standing Wave Ratio | Maximum Supply Current | Construction | Power Supplies (V) | Package Equivalence Code | Characteristic Impedance | Sub-Category | Maximum Operating Temperature | Minimum Operating Temperature | Terminal Finish | Maximum Conversion Loss | Additional Features | JESD-609 Code | Minimum Operating Frequency | Maximum Operating Frequency |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Analog Devices |
DOUBLE BALANCED |
SURFACE MOUNT |
12 |
CERAMIC |
GAAS |
25 dBm |
COMPONENT |
LCC12,.12SQ,20 |
50 ohm |
85 Cel |
-40 Cel |
10 dB |
6000 MHz |
14000 MHz |
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|
Analog Devices |
IMAGE REJECTION |
SURFACE MOUNT |
24 |
CERAMIC |
GAAS |
LCC24,.16SQ,20 |
RF/Microwave Mixers |
85 Cel |
-40 Cel |
||||||||||||||
|
Analog Devices |
DOUBLE BALANCED |
SURFACE MOUNT |
8 |
PLASTIC/EPOXY |
GAAS |
3 |
TSSOP8,.19 |
RF/Microwave Mixers |
85 Cel |
-40 Cel |
|||||||||||||
|
Analog Devices |
DOUBLE BALANCED |
SURFACE MOUNT |
24 |
CERAMIC |
GAAS |
20 dBm |
COMPONENT |
LCC24,.16SQ,20 |
50 ohm |
85 Cel |
-40 Cel |
11 dB |
4000 MHz |
8500 MHz |
|||||||||
|
Analog Devices |
SURFACE MOUNT |
24 |
CERAMIC |
GAAS |
LCC24,.16SQ,20 |
RF/Microwave Mixers |
85 Cel |
-55 Cel |
|||||||||||||||
|
Analog Devices |
DOUBLE BALANCED |
SURFACE MOUNT |
32 |
PLASTIC/EPOXY |
GAAS |
13 dBm |
COMPONENT |
LCC32,.2SQ,20 |
50 ohm |
RF/Microwave Mixers |
85 Cel |
-40 Cel |
MATTE TIN |
10 dB |
e3 |
1700 MHz |
4500 MHz |
||||||
|
Analog Devices |
DOUBLE BALANCED |
SURFACE MOUNT |
24 |
CERAMIC |
GAAS |
LCC24,.16SQ,20 |
RF/Microwave Mixers |
85 Cel |
-40 Cel |
Tungsten/Nickel/Gold (W/Ni/Au) |
|||||||||||||
|
Analog Devices |
IMAGE REJECTION |
SURFACE MOUNT |
24 |
CERAMIC |
GAAS |
LCC24,.16SQ,20 |
RF/Microwave Mixers |
85 Cel |
-55 Cel |
||||||||||||||
Analog Devices |
DOUBLE BALANCED |
SURFACE MOUNT |
8 |
PLASTIC/EPOXY |
GAAS |
TSSOP8,.19 |
RF/Microwave Mixers |
85 Cel |
-40 Cel |
|||||||||||||||
|
Analog Devices |
DOUBLE BALANCED |
SURFACE MOUNT |
24 |
GAAS |
13 dBm |
125 mA |
COMPONENT |
5 |
LCC24,.16SQ,20 |
50 ohm |
85 Cel |
-40 Cel |
GOLD OVER NICKEL |
13 dB |
e4 |
24000 MHz |
34000 MHz |
||||||
|
Analog Devices |
DOUBLE BALANCED |
GAAS |
DIE OR CHIP |
RF/Microwave Mixers |
85 Cel |
-55 Cel |
|||||||||||||||||
|
Analog Devices |
GAAS |
DIE OR CHIP |
RF/Microwave Mixers |
125 Cel |
-55 Cel |
||||||||||||||||||
|
Analog Devices |
DOUBLE BALANCED |
SURFACE MOUNT |
8 |
PLASTIC/EPOXY |
GAAS |
COMPONENT |
SOP8,.4 |
50 ohm |
RF/Microwave Mixers |
125 Cel |
-55 Cel |
Gold (Au) - with Nickel (Ni) barrier |
12 dB |
e4 |
1800 MHz |
5000 MHz |
|||||||
|
Analog Devices |
TRIPLE BALANCED |
SURFACE MOUNT |
12 |
PLASTIC/EPOXY |
GAAS |
26 dBm |
COMPONENT |
LCC12,.12SQ,20 |
50 ohm |
RF/Microwave Mixers |
85 Cel |
-40 Cel |
GOLD OVER NICKEL |
11.5 dB |
e4 |
3000 MHz |
10000 MHz |
||||||
|
Analog Devices |
TRIPLE BALANCED |
SURFACE MOUNT |
12 |
CERAMIC |
GAAS |
LCC12,.12SQ,20 |
RF/Microwave Mixers |
85 Cel |
-40 Cel |
||||||||||||||
|
Analog Devices |
DOUBLE BALANCED |
SURFACE MOUNT |
12 |
PLASTIC/EPOXY |
GAAS |
15 dBm |
COMPONENT |
LCC12,.2SQ |
50 ohm |
RF/Microwave Mixers |
85 Cel |
-40 Cel |
Gold (Au) - with Nickel (Ni) barrier |
13 dB |
HIGH RELIABILITY |
e4 |
6000 MHz |
20000 MHz |
|||||
|
Analog Devices |
GAAS |
DIE OR CHIP |
RF/Microwave Mixers |
125 Cel |
-55 Cel |
||||||||||||||||||
|
Analog Devices |
IMAGE REJECTION |
SURFACE MOUNT |
40 |
GAAS |
COMPONENT |
DIE OR CHIP |
50 ohm |
85 Cel |
-55 Cel |
81000 MHz |
86000 MHz |
||||||||||||
|
Analog Devices |
DOUBLE BALANCED |
SURFACE MOUNT |
8 |
CERAMIC |
GAAS |
SOP8,.3 |
RF/Microwave Mixers |
85 Cel |
-55 Cel |
||||||||||||||
|
Analog Devices |
DOUBLE BALANCED |
GAAS |
15 dBm |
COMPONENT |
DIE OR CHIP |
50 ohm |
RF/Microwave Mixers |
85 Cel |
-55 Cel |
Gold (Au) |
12 dB |
e4 |
5000 MHz |
20000 MHz |
|||||||||
|
Analog Devices |
DOUBLE BALANCED |
SURFACE MOUNT |
8 |
PLASTIC/EPOXY |
GAAS |
COMPONENT |
SOP8,.4 |
50 ohm |
RF/Microwave Mixers |
125 Cel |
-55 Cel |
Gold (Au) - with Nickel (Ni) barrier |
10 dB |
e4 |
4000 MHz |
8000 MHz |
|||||||
|
Analog Devices |
GAAS |
5 |
DIE OR CHIP |
RF/Microwave Mixers |
125 Cel |
-55 Cel |
|||||||||||||||||
|
Analog Devices |
DOUBLE BALANCED |
SURFACE MOUNT |
24 |
CERAMIC |
GAAS |
15 dBm |
COMPONENT |
LCC24,.16SQ,20 |
50 ohm |
RF/Microwave Mixers |
85 Cel |
-40 Cel |
Gold Flash (Au) - with Nickel (Ni) barrier |
9 dB |
4000 MHz |
8000 MHz |
|||||||
|
Analog Devices |
GAAS |
5 |
DIE OR CHIP |
RF/Microwave Mixers |
125 Cel |
-55 Cel |
|||||||||||||||||
|
Analog Devices |
DOUBLE BALANCED |
GAAS |
COMPONENT |
DIE OR CHIP |
50 ohm |
RF/Microwave Mixers |
85 Cel |
-55 Cel |
Gold (Au) |
9 dB |
e4 |
6000 MHz |
11000 MHz |
||||||||||
|
Analog Devices |
IMAGE REJECTION |
SURFACE MOUNT |
24 |
CERAMIC |
GAAS |
LCC24,.16SQ,20 |
RF/Microwave Mixers |
85 Cel |
-40 Cel |
||||||||||||||
|
Analog Devices |
IMAGE REJECTION |
SURFACE MOUNT |
24 |
CERAMIC |
GAAS |
LCC24,.16SQ,20 |
RF/Microwave Mixers |
85 Cel |
-40 Cel |
||||||||||||||
|
Analog Devices |
GAAS |
5 |
DIE OR CHIP |
RF/Microwave Mixers |
125 Cel |
-55 Cel |
|||||||||||||||||
|
Analog Devices |
DOUBLE BALANCED |
SURFACE MOUNT |
24 |
CERAMIC |
GAAS |
LCC24,.16X.2,20 |
RF/Microwave Mixers |
85 Cel |
-40 Cel |
||||||||||||||
|
Analog Devices |
IMAGE REJECTION |
SURFACE MOUNT |
40 |
GAAS |
COMPONENT |
DIE OR CHIP |
50 ohm |
85 Cel |
-55 Cel |
81000 MHz |
86000 MHz |
||||||||||||
|
Analog Devices |
TRIPLE BALANCED |
SURFACE MOUNT |
12 |
PLASTIC/EPOXY |
GAAS |
LCC12,.12SQ,20 |
RF/Microwave Mixers |
85 Cel |
-40 Cel |
||||||||||||||
|
Analog Devices |
DOUBLE BALANCED |
SURFACE MOUNT |
32 |
CERAMIC |
GAAS |
5 |
LCC32,.2SQ,20 |
RF/Microwave Up/Down Converters |
85 Cel |
-40 Cel |
|||||||||||||
|
Analog Devices |
DOUBLE BALANCED |
SURFACE MOUNT |
24 |
CERAMIC |
GAAS |
15 dBm |
COMPONENT |
LCC24,.16SQ,20 |
50 ohm |
RF/Microwave Mixers |
85 Cel |
-40 Cel |
Gold (Au) - with Nickel (Ni) barrier |
9 dB |
e4 |
4000 MHz |
8000 MHz |
||||||
|
Analog Devices |
DOUBLE BALANCED |
GAAS |
210 mA |
3 |
DIE OR CHIP |
RF/Microwave Mixers |
85 Cel |
-55 Cel |
|||||||||||||||
|
Analog Devices |
GAAS |
DIE OR CHIP |
RF/Microwave Mixers |
125 Cel |
-55 Cel |
||||||||||||||||||
|
Analog Devices |
DOUBLE BALANCED |
GAAS |
COMPONENT |
DIE OR CHIP |
50 ohm |
RF/Microwave Mixers |
85 Cel |
-55 Cel |
Gold (Au) |
10 dB |
e4 |
1800 MHz |
5000 MHz |
||||||||||
|
Analog Devices |
GAAS |
5 |
DIE OR CHIP |
RF/Microwave Mixers |
125 Cel |
-55 Cel |
|||||||||||||||||
|
Analog Devices |
TRIPLE BALANCED |
SURFACE MOUNT |
16 |
CERAMIC |
GAAS |
LCC16,.12SQ,20 |
RF/Microwave Mixers |
85 Cel |
-55 Cel |
||||||||||||||
|
Analog Devices |
SURFACE MOUNT |
24 |
CERAMIC |
GAAS |
LCC24,.16X.2,20 |
RF/Microwave Mixers |
85 Cel |
-40 Cel |
|||||||||||||||
|
Analog Devices |
GAAS |
DIE OR CHIP |
RF/Microwave Mixers |
125 Cel |
-55 Cel |
||||||||||||||||||
|
Analog Devices |
DOUBLE BALANCED |
GAAS |
COMPONENT |
DIE OR CHIP |
RF/Microwave Mixers |
125 Cel |
-55 Cel |
12 dB |
1000 MHz |
2000 MHz |
|||||||||||||
Infineon Technologies |
GAAS |
DIE OR CHIP |
RF/Microwave Mixers |
|||||||||||||||||||||
Infineon Technologies |
SURFACE MOUNT |
7 |
PLASTIC/EPOXY |
GAAS |
2.5 mA |
3.3/5 |
SO7,.28 |
RF/Microwave Mixers |
Tin/Lead (Sn/Pb) |
e0 |
||||||||||||||
|
Broadcom |
TRIPLE BALANCED |
SURFACE MOUNT |
16 |
PLASTIC/EPOXY |
GAAS |
30 dBm |
30 mA |
COMPONENT |
5 |
LCC16,.12SQ,20 |
50 ohm |
RF/Microwave Mixers |
Matte Tin (Sn) |
6.9 dB |
e3 |
400 MHz |
3500 MHz |
||||||
|
Broadcom |
TRIPLE BALANCED |
SURFACE MOUNT |
16 |
PLASTIC/EPOXY |
GAAS |
30 dBm |
125 mA |
COMPONENT |
5 |
LCC16,.12SQ,20 |
50 ohm |
RF/Microwave Mixers |
Matte Tin (Sn) |
e3 |
400 MHz |
3000 MHz |
|||||||
|
Broadcom |
TRIPLE BALANCED |
SURFACE MOUNT |
16 |
PLASTIC/EPOXY |
GAAS |
30 dBm |
30 mA |
COMPONENT |
5 |
LCC16,.12SQ,20 |
50 ohm |
RF/Microwave Mixers |
Matte Tin (Sn) |
6.9 dB |
e3 |
400 MHz |
3500 MHz |
||||||
Broadcom |
DOUBLE BALANCED |
GAAS |
4.5 |
DIE OR CHIP |
RF/Microwave Mixers |
70 Cel |
-55 Cel |
|||||||||||||||||
|
Broadcom |
TRIPLE BALANCED |
SURFACE MOUNT |
16 |
PLASTIC/EPOXY |
GAAS |
30 dBm |
125 mA |
COMPONENT |
5 |
LCC16,.12SQ,20 |
50 ohm |
RF/Microwave Mixers |
Matte Tin (Sn) |
e3 |
400 MHz |
3000 MHz |
RF/microwave mixers are electronic devices used in radio frequency (RF) and microwave systems to convert one frequency to another. They perform frequency translation by multiplying two input signals, a local oscillator (LO) signal and a radio frequency (RF) or intermediate frequency (IF) signal, to produce an output signal that has the sum and difference frequencies of the inputs.
RF/microwave mixers are commonly used in a variety of applications, including frequency conversion, phase detection, modulation and demodulation, and signal generation. They are widely used in telecommunications, radar systems, navigation systems, and satellite communication systems.
RF/microwave mixers are available in various types, including diode mixers, transistor mixers, and monolithic microwave integrated circuit (MMIC) mixers. The choice of mixer depends on the application requirements, such as the desired frequency range, signal bandwidth, conversion gain, and noise figure.