THROUGH HOLE MOUNT Image Sensors 1,002

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Part RoHS Manufacturer Sensors or Transducers Type Mounting Feature Output Type Package Shape or Style Output Range Pixel Size (um) Maximum Supply Voltage Screening Level Master Clock Body Length/Diameter Body Width Spectral Response (nm) Power Supplies (V) Optical Format (inch) Sub-Category Body Height Minimum Supply Voltage Maximum Operating Temperature Horizontal Pixel Minimum Operating Temperature Terminal Finish Termination Type Data Rate Output Interface Type Frame Rate Maximum Operating Current Array Type Additional Features Housing JESD-609 Code Dynamic Range Vertical Pixel

KAI-1020-ABB-JB-AE

Onsemi

IMAGE SENSOR,CCD

THROUGH HOLE MOUNT

ANALOG VOLTAGE

SQUARE

500mV

7.4X7.4

27.94 mm

27.94 inch

300-1000

3.42 mm

1000

SOLDER

40 Mbps

INTERLINE

SENSITIVITY 12 UV/ELECTRON, ELECTRONIC SHUTTER

58 dB

1000

KAI-1020-ABB-JB-BA

Onsemi

IMAGE SENSOR,CCD

THROUGH HOLE MOUNT

ANALOG VOLTAGE

SQUARE

500mV

7.4X7.4

27.94 mm

27.94 inch

300-1000

3.42 mm

1000

SOLDER

40 Mbps

INTERLINE

SENSITIVITY 12 UV/ELECTRON, ELECTRONIC SHUTTER

58 dB

1000

KAI-0340-ABA-CB-AA-DUAL

Onsemi

THROUGH HOLE MOUNT

2.4X7.4

15

CCD Image Sensors

70 Cel

640

-50 Cel

480

KAI-04050-PBA-JD-AE

Onsemi

IMAGE SENSOR,CCD

THROUGH HOLE MOUNT

RECTANGULAR

5.5X5.5

1

2336

SOLDER

INTERLINE

IT HAS OUTPUT SENSITIVITY OF 34 MICRO VOLT PER ELECTRON

64 dB

1752

KAI-16050-PXA-JD-AE

Onsemi

IMAGE SENSOR,CCD

THROUGH HOLE MOUNT

RECTANGULAR

5.5X5.5

47.24 mm

45.34 inch

70 Cel

4896

-50 Cel

SOLDER

INTERLINE

IT HAS A SENSITIVITY OF 34 MICRO VOLT PER ELECTRON, ELECTRONIC SHUTTER

64 dB

3264

KAI-08051-AXA-JP-AE

Onsemi

IMAGE SENSOR,CCD

THROUGH HOLE MOUNT

RECTANGULAR

5.5X5.5

15.5 V

40 mm

29 inch

4/3

14.5 V

70 Cel

3296

-50 Cel

SOLDER

INTERLINE

IT HAS A SENSITIVITY OF 39 MICRO VOLT PER ELECTRON

66 dB

2472

KAI-0340-AAA-CP-AE

Onsemi

IMAGE SENSOR,CCD

THROUGH HOLE MOUNT

ANALOG VOLTAGE

RECTANGULAR

7.4X7.4

15.25 V

15.87 mm

12.45 inch

1/3

5.15 mm

14.75 V

70 Cel

640

-50 Cel

SOLDER

2.5 mA

INTERLINE

CERAMIC, GLASS-SEALED

62 dB

480

NOIV1SN016KA-GDI

Onsemi

IMAGE SENSOR,CMOS

THROUGH HOLE MOUNT

CURRENT OUTPUT

RECTANGULAR

4.5X4.5

2 V

340 MHz

43.1 mm

36.1 inch

400-1000

CCD Image Sensors

1.6 V

85 Cel

4096

-40 Cel

SOLDER

4-WIRE INTERFACE

80 fps

370 mA

FRAME

IT ALSO OPERATES AT 3 TO 3.6 V SUPPLY VOLTAGE, GLOBAL SHUTTER, ROLLING SHUTTER

CERAMIC

56 dB

4096

KAF-16801E

Onsemi

IMAGE SENSOR,CCD

THROUGH HOLE MOUNT

ANALOG VOLTAGE

RECTANGULAR

9X9

17 V

50.8 mm

51.05 inch

400-850

3.5 mm

14.5 V

4096

SOLDER

FULL FRAME

SENSITIVITY IS 12 MICRO V/ELECTRON

76 dB

4096

KAF-1001-AAA-CB-AE

Onsemi

IMAGE SENSOR,CCD

THROUGH HOLE MOUNT

SQUARE

24X24

17.5 V

35.56 mm

35.56 inch

300-1200

15 V

50 Cel

1024

-50 Cel

SOLDER

5 Mbps

FULL FRAME

IT HAS A SENSITIVITY OF 11 MICRO VOLT PER ELECTRON

CERAMIC

97 dB

1024

VS6552V015/T2

STMicroelectronics

IMAGE SENSOR,CMOS

THROUGH HOLE MOUNT

DIGITAL OUTPUT

RECTANGULAR

5.6X5.6

3.3 V

26 MHz

14 mm

8.5 inch

3

CCD Image Sensors

6.1 mm

2.5 V

70 Cel

644

-25 Cel

SOLDER

I2C INTERFACE

30 fps

2 mA

FRAME TRANSFER

60 dB

484

VS6552V02C/T2

STMicroelectronics

IMAGE SENSOR,CMOS

THROUGH HOLE MOUNT

DIGITAL OUTPUT

RECTANGULAR

5.6X5.6

3.3 V

26 MHz

14 mm

8.5 inch

3

CCD Image Sensors

6.1 mm

2.5 V

70 Cel

644

-25 Cel

SOLDER

I2C INTERFACE

30 fps

2 mA

FRAME TRANSFER

60 dB

484

VS6552V02D/T2

STMicroelectronics

IMAGE SENSOR,CMOS

THROUGH HOLE MOUNT

DIGITAL OUTPUT

RECTANGULAR

5.6X5.6

3.3 V

26 MHz

14 mm

8.5 inch

3

CCD Image Sensors

6.1 mm

2.5 V

70 Cel

644

-25 Cel

SOLDER

I2C INTERFACE

30 fps

2 mA

FRAME TRANSFER

60 dB

484

FTF3020-M/HG

NXP Semiconductors

IMAGE SENSOR,CCD

THROUGH HOLE MOUNT

ANALOG CURRENT

RECTANGULAR

12X12

52.7 mm

40 inch

4.1 mm

60 Cel

-40 Cel

SOLDER

FULL FRAME

ELECTRONIC SHUTTER

CERAMIC, GLASS-SEALED

72 dB

FTF3020-C/HG

NXP Semiconductors

IMAGE SENSOR,CCD

THROUGH HOLE MOUNT

ANALOG CURRENT

RECTANGULAR

12X12

52.7 mm

40 inch

CCD Image Sensors

4.1 mm

60 Cel

3120

-40 Cel

SOLDER

FULL FRAME

ELECTRONIC SHUTTER

CERAMIC, METAL-SEALED COFIRED

72 dB

2060

FTF3020-C/EG

NXP Semiconductors

IMAGE SENSOR,CCD

THROUGH HOLE MOUNT

ANALOG CURRENT

RECTANGULAR

12X12

52.7 mm

40 inch

CCD Image Sensors

4.1 mm

60 Cel

3120

-40 Cel

SOLDER

FULL FRAME

ELECTRONIC SHUTTER

CERAMIC, METAL-SEALED COFIRED

72 dB

2060

FT18/IG

NXP Semiconductors

IMAGE SENSOR,CCD

THROUGH HOLE MOUNT

ANALOG CURRENT

RECTANGULAR

7.5X7.5

29.4 mm

15.49 inch

2/3

2.98 mm

60 Cel

-40 Cel

TIN/NICKEL PALLADIUM

SOLDER

FRAME TRANSFER

ELECTRONIC SHUTTER

CERAMIC, GLASS-SEALED

e3/e4

60 dB

FT18/HG

NXP Semiconductors

IMAGE SENSOR,CCD

THROUGH HOLE MOUNT

ANALOG CURRENT

RECTANGULAR

7.5X7.5

29.4 mm

15.49 inch

2/3

2.98 mm

60 Cel

-40 Cel

TIN/NICKEL PALLADIUM

SOLDER

FRAME TRANSFER

ELECTRONIC SHUTTER

CERAMIC, GLASS-SEALED

e3/e4

60 dB

FTF3020-M/IG

NXP Semiconductors

IMAGE SENSOR,CCD

THROUGH HOLE MOUNT

ANALOG CURRENT

RECTANGULAR

12X12

52.7 mm

40 inch

4.1 mm

60 Cel

-40 Cel

SOLDER

FULL FRAME

ELECTRONIC SHUTTER

CERAMIC, GLASS-SEALED

72 dB

FTF3020-C/TG

NXP Semiconductors

IMAGE SENSOR,CCD

THROUGH HOLE MOUNT

ANALOG CURRENT

RECTANGULAR

12X12

52.7 mm

40 inch

CCD Image Sensors

4.1 mm

60 Cel

3120

-40 Cel

SOLDER

FULL FRAME

ELECTRONIC SHUTTER

CERAMIC, METAL-SEALED COFIRED

72 dB

2060

FTT1010-M/IG

NXP Semiconductors

IMAGE SENSOR,CCD

THROUGH HOLE MOUNT

ANALOG CURRENT

RECTANGULAR

12X12

40 mm

40 inch

1

CCD Image Sensors

4.1 mm

60 Cel

1030

-40 Cel

SOLDER

FRAME TRANSFER

ELECTRONIC SHUTTER

CERAMIC, GLASS-SEALED

70 dB

1072

FTT1010-M/TG

NXP Semiconductors

IMAGE SENSOR,CCD

THROUGH HOLE MOUNT

ANALOG CURRENT

RECTANGULAR

12X12

40 mm

40 inch

1

CCD Image Sensors

4.1 mm

60 Cel

1030

-40 Cel

SOLDER

FRAME TRANSFER

ELECTRONIC SHUTTER

CERAMIC, GLASS-SEALED

70 dB

1072

FTF3020-M/EG

NXP Semiconductors

IMAGE SENSOR,CCD

THROUGH HOLE MOUNT

ANALOG CURRENT

RECTANGULAR

12X12

52.7 mm

40 inch

4.1 mm

60 Cel

-40 Cel

SOLDER

FULL FRAME

ELECTRONIC SHUTTER

CERAMIC, GLASS-SEALED

72 dB

FTT1010-M/HG

NXP Semiconductors

IMAGE SENSOR,CCD

THROUGH HOLE MOUNT

ANALOG CURRENT

RECTANGULAR

12X12

40 mm

40 inch

1

CCD Image Sensors

4.1 mm

60 Cel

1030

-40 Cel

SOLDER

FRAME TRANSFER

ELECTRONIC SHUTTER

CERAMIC, GLASS-SEALED

70 dB

1072

FTT1010-M/EG

NXP Semiconductors

IMAGE SENSOR,CCD

THROUGH HOLE MOUNT

ANALOG CURRENT

RECTANGULAR

12X12

40 mm

40 inch

1

CCD Image Sensors

4.1 mm

60 Cel

1030

-40 Cel

SOLDER

FRAME TRANSFER

ELECTRONIC SHUTTER

CERAMIC, GLASS-SEALED

70 dB

1072

FT18/TG

NXP Semiconductors

IMAGE SENSOR,CCD

THROUGH HOLE MOUNT

ANALOG CURRENT

RECTANGULAR

7.5X7.5

29.4 mm

15.49 inch

2/3

2.98 mm

60 Cel

-40 Cel

TIN/NICKEL PALLADIUM

SOLDER

FRAME TRANSFER

ELECTRONIC SHUTTER

CERAMIC, GLASS-SEALED

e3/e4

60 dB

FT18/SG

NXP Semiconductors

IMAGE SENSOR,CCD

THROUGH HOLE MOUNT

ANALOG CURRENT

RECTANGULAR

7.5X7.5

29.4 mm

15.49 inch

2/3

2.98 mm

60 Cel

-40 Cel

TIN/NICKEL PALLADIUM

SOLDER

FRAME TRANSFER

ELECTRONIC SHUTTER

CERAMIC, GLASS-SEALED

e3/e4

60 dB

FTF3020-M/TG

NXP Semiconductors

IMAGE SENSOR,CCD

THROUGH HOLE MOUNT

ANALOG CURRENT

RECTANGULAR

12X12

52.7 mm

40 inch

4.1 mm

60 Cel

-40 Cel

SOLDER

FULL FRAME

ELECTRONIC SHUTTER

CERAMIC, GLASS-SEALED

72 dB

FTF3020-C/IG

NXP Semiconductors

IMAGE SENSOR,CCD

THROUGH HOLE MOUNT

ANALOG CURRENT

RECTANGULAR

12X12

52.7 mm

40 inch

CCD Image Sensors

4.1 mm

60 Cel

3120

-40 Cel

SOLDER

FULL FRAME

ELECTRONIC SHUTTER

CERAMIC, METAL-SEALED COFIRED

72 dB

2060

LUPA-1300-C

Infineon Technologies

IMAGE SENSOR,CMOS

THROUGH HOLE MOUNT

14X14

5

CCD Image Sensors

60 Cel

1280

0 Cel

1024

CYIL2SM1300AA-GZWC

Infineon Technologies

IMAGE SENSOR,CMOS

THROUGH HOLE MOUNT

14X14

2.5

CCD Image Sensors

70 Cel

1280

0 Cel

1024

TCD2703ADG

Toshiba

THROUGH HOLE MOUNT

9.325X9.325

11

CCD Image Sensors

60 Cel

7500

0 Cel

3

TCD2704D

Toshiba

IMAGE SENSOR,CCD

THROUGH HOLE MOUNT

ANALOG VOLTAGE

RECTANGULAR

5-7V

5X5

13 V

53.6 mm

10.16 inch

12

CCD Image Sensors

3.9 mm

11.4 V

60 Cel

7500

0 Cel

Tin/Lead (Sn/Pb)

SOLDER

LINEAR

SENSITIVITY FOR RED 4.60 V/LX.S, RED 5.40 V/LX.S, GREEN 2.80 V/LX.S

CERAMIC, METAL-SEALED COFIRED

e0

4

TCD2000P

Toshiba

IMAGE SENSOR,CCD

THROUGH HOLE MOUNT

15

CCD Image Sensors

60 Cel

160

0 Cel

Tin/Lead (Sn/Pb)

e0

3

TCD2557D

Toshiba

IMAGE SENSOR,CCD

THROUGH HOLE MOUNT

ANALOG VOLTAGE

RECTANGULAR

3.50-7.50V

7X7

13 V

53.6 mm

10.16 inch

12

CCD Image Sensors

3.2 mm

11.4 V

60 Cel

5340

0 Cel

SOLDER

LINEAR

SENSITIVITY FOR RED 9.30 V/LX.S, GREEN 9.90 V/LX.S, BLUE 5.40 V/LX.S

CERAMIC, METAL-SEALED COFIRED

3

TCD2712DG

Toshiba

IMAGE SENSOR,CCD

THROUGH HOLE MOUNT

VOLTAGE OUTPUT

RECTANGULAR

4-6V

9.32X9.32

10.5 V

98 mm

10.16 inch

7 mm

9.5 V

60 Cel

0 Cel

SOLDER

LINEAR

CERAMIC

TCD2252AD

Toshiba

THROUGH HOLE MOUNT

8X8

12

CCD Image Sensors

60 Cel

2700

0 Cel

3

TCD2713DG

Toshiba

IMAGE SENSOR,CCD

THROUGH HOLE MOUNT

DIGITAL VOLTAGE

RECTANGULAR

4-6V

9.32X9.32

10.5 V

105 mm

10.16 inch

400-1200

10

CCD Image Sensors

7 mm

9.5 V

60 Cel

7500

0 Cel

SOLDER

LINEAR

CERAMIC

4

TCD2503C

Toshiba

IMAGE SENSOR,CCD

THROUGH HOLE MOUNT

ANALOG VOLTAGE

RECTANGULAR

4.50-7.50V

14X14

13 V

90 mm

15 inch

CCD Image Sensors

5.13 mm

10.5 V

60 Cel

5000

0 Cel

Tin/Lead (Sn/Pb)

SOLDER

LINEAR

SENSITIVITY FOR RED 17.30 V/LX.S, GREEN 21.70 V/LX.S, BLUE 7.20 V/LX.S

CERAMIC, METAL-SEALED COFIRED

e0

3

TCD2901D

Toshiba

IMAGE SENSOR,CCD

THROUGH HOLE MOUNT

ANALOG VOLTAGE

RECTANGULAR

4-6V

4X4

13 V

53.6 mm

10.16 inch

12

CCD Image Sensors

3.2 mm

11.4 V

60 Cel

10550

0 Cel

SOLDER

FRAME TRANSFER

SENSITIVITY FOR RED 2.50 V/LX.S, GREEN 2.40 V/LX.S, BLUE 1.40 V/LX.S

CERAMIC, METAL-SEALED COFIRED

3

TCD5241BD

Toshiba

THROUGH HOLE MOUNT

9.6X7.5

CCD Image Sensors

60 Cel

514

-20 Cel

Tin/Lead (Sn/Pb)

e0

490

TCD2561D

Toshiba

IMAGE SENSOR,CCD

THROUGH HOLE MOUNT

ANALOG VOLTAGE

RECTANGULAR

5-7V

7X7

13 V

53.6 mm

10.16 inch

12

CCD Image Sensors

3.89 mm

11.4 V

60 Cel

5340

0 Cel

Tin/Lead (Sn/Pb)

SOLDER

LINEAR

SENSITIVITY FOR RED 9 V/LX.S, GREEN 10.50 V/LX.S, RED 5.50 V/LX.S

CERAMIC, METAL-SEALED COFIRED

e0

4

TCD201C

Toshiba

THROUGH HOLE MOUNT

50X50

8

CCD Image Sensors

60 Cel

14

-25 Cel

Tin/Lead (Sn/Pb)

e0

40

TCD2558D

Toshiba

IMAGE SENSOR,CCD

THROUGH HOLE MOUNT

ANALOG VOLTAGE

RECTANGULAR

5-7V

7X7

13 V

53.6 mm

10.16 inch

12

CCD Image Sensors

4.17 mm

11.4 V

60 Cel

5340

0 Cel

Tin/Lead (Sn/Pb)

SOLDER

LINEAR

SENSITIVITY FOR RED 9.30 V/LX.S, GREEN 9.90 V/LX.S, BLUE 5.40 V/LX.S

CERAMIC, GLASS-SEALED

e0

3

TCD2711DG

Toshiba

IMAGE SENSOR,CCD

THROUGH HOLE MOUNT

VOLTAGE OUTPUT

RECTANGULAR

3.50-6.50V

9.325X9.325

10.5 V

105 mm

10.16 inch

400-700

7 mm

9.5 V

60 Cel

0 Cel

SOLDER

LINEAR

SENSITIITY FOR RED 18.9 V/LX.S, BLUE 13.4 V/LX.S

CERAMIC

TCD5250D

Toshiba

THROUGH HOLE MOUNT

9.6X6.4

CCD Image Sensors

60 Cel

514

-20 Cel

Tin/Lead (Sn/Pb)

e0

579

TCD2950D

Toshiba

IMAGE SENSOR,CCD

THROUGH HOLE MOUNT

ANALOG VOLTAGE

RECTANGULAR

5-7V

4X4

13 V

53.6 mm

10.16 inch

12

CCD Image Sensors

4.17 mm

11.4 V

60 Cel

10680

0 Cel

Tin/Lead (Sn/Pb)

SOLDER

FRAME TRANSFER

SENSITIVITY FOR RED 1.40 V/LX.S, GREEN 1.90 V/LX.S, 1.30 V/LX.S

CERAMIC, METAL-SEALED COFIRED

e0

3

TCD2716DG

Toshiba

IMAGE SENSOR,CCD

THROUGH HOLE MOUNT

RECTANGULAR

4.7X4.7

7450

SOLDER

LINEAR

CERAMIC

3

Image Sensors

Image sensors are electronic devices that capture images and convert them into digital signals that can be processed and stored in electronic devices such as cameras, smartphones, and security systems. They are a critical component of digital imaging technology and have revolutionized the way we capture and store visual information.

Image sensors work by detecting and converting light into electrical signals. They typically consist of a grid of millions of tiny photodiodes, each of which generates an electrical charge in response to the amount of light it receives. When light enters the sensor, it is absorbed by the photodiodes, which generate a corresponding electrical signal. The signals from each photodiode are then combined to form a digital image.

There are two main types of image sensors: charge-coupled devices (CCDs) and complementary metal-oxide-semiconductor (CMOS) sensors. CCDs are the older of the two technologies and are characterized by their high image quality, low noise, and low power consumption. CMOS sensors, on the other hand, are more modern and are known for their high-speed performance, low power consumption, and lower cost.

Image sensors are widely used in a variety of applications, including digital cameras, smartphones, security systems, and medical imaging. They have also enabled the development of new technologies such as virtual and augmented reality, self-driving cars, and facial recognition.