208 ATM/SONET/SDH Circuits 24

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Applications	Surface Mount	No. of Functions	Technology	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
PXB4110	Infineon Technologies	ATM/SONET/SDH SEGMENTATION AND REASSEMBLY DEVICE	INDUSTRIAL	GULL WING	208	FQFP	SQUARE	PLASTIC/EPOXY	ATM	YES	1	CMOS		3.3 V	3.3,5	FLATPACK, FINE PITCH	QFP208,1.2SQ,20	ATM/SONET/SDH ICs	.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-PQFP-G208		4.1 mm	28 mm	Not Qualified	e0			28 mm
TC35856AF	Toshiba	ATM/SONET/SDH SEGMENTATION AND REASSEMBLY DEVICE	COMMERCIAL	GULL WING	208	FQFP	SQUARE	PLASTIC/EPOXY		YES	1			3.3 V		FLATPACK, FINE PITCH			.5 mm	70 Cel	0 Cel		QUAD	S-PQFP-G208		4.45 mm	28 mm	Not Qualified				28 mm
TC35856BF	Toshiba	ATM/SONET/SDH SEGMENTATION AND REASSEMBLY DEVICE	COMMERCIAL	GULL WING	208	FQFP	SQUARE	PLASTIC/EPOXY		YES	1			3.3 V		FLATPACK, FINE PITCH			.5 mm	70 Cel	0 Cel		QUAD	S-PQFP-G208		4.45 mm	28 mm	Not Qualified				28 mm
UPD98401AGD-MML	Renesas Electronics	ATM/SONET/SDH SEGMENTATION AND REASSEMBLY DEVICE	COMMERCIAL	GULL WING	208	FQFP	SQUARE	PLASTIC/EPOXY	ATM	YES	1	CMOS		5 V	5	FLATPACK, FINE PITCH	QFP208,1.2SQ,20	ATM/SONET/SDH ICs	.5 mm	70 Cel	0 Cel	TIN LEAD	QUAD	S-PQFP-G208		3.8 mm	28 mm	Not Qualified	e0			28 mm
77V400S156DS	Renesas Electronics	ATM/SONET/SDH SUPPORT CIRCUIT	COMMERCIAL	GULL WING	208	FQFP	SQUARE	PLASTIC/EPOXY	ATM	YES	1		160 mA	3.3 V	3.3	FLATPACK, FINE PITCH	QFP208,1.2SQ,20	ATM/SONET/SDH ICs	.5 mm	70 Cel	0 Cel	TIN LEAD	QUAD	S-PQFP-G208	3	4.1 mm	28 mm	Not Qualified	e0	30	225	28 mm
UPD98401AGD-MML-A	Renesas Electronics	ATM/SONET/SDH SEGMENTATION AND REASSEMBLY DEVICE	COMMERCIAL EXTENDED	GULL WING	208	FQFP	SQUARE	PLASTIC/EPOXY	ATM	YES	1	CMOS		5 V	5	FLATPACK, FINE PITCH	QFP208,1.2SQ,20	ATM/SONET/SDH ICs	.5 mm	80 Cel	0 Cel	TIN BISMUTH	QUAD	S-PQFP-G208	3	3.8 mm	28 mm	Not Qualified	e6	10	250	28 mm
UPD98408GD-LML	Renesas Electronics	ATM/SONET/SDH NETWORK INTERFACE	COMMERCIAL	GULL WING	208	FQFP	SQUARE	PLASTIC/EPOXY	ATM; SONET	YES	1	CMOS	280 mA	3.3 V	3.3	FLATPACK, FINE PITCH	QFP208,1.2SQ,20	ATM/SONET/SDH ICs	.5 mm	70 Cel	0 Cel	TIN LEAD	QUAD	S-PQFP-G208		3.8 mm	28 mm	Not Qualified	e0			28 mm
UPD98408GD-LML-A	Renesas Electronics	ATM/SONET/SDH NETWORK INTERFACE	INDUSTRIAL	GULL WING	208	FQFP	SQUARE	PLASTIC/EPOXY	ATM	YES	1	MOS	.28 mA	3.3 V	3.3	FLATPACK, FINE PITCH	QFP208,1.2SQ,20	ATM/SONET/SDH ICs	.5 mm	85 Cel	-40 Cel	TIN BISMUTH	QUAD	S-PQFP-G208	3	3.8 mm	28 mm	Not Qualified	e6	10	250	28 mm
77V400S156DSI	Renesas Electronics	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	GULL WING	208	FQFP	SQUARE	PLASTIC/EPOXY	ATM	YES	1		180 mA	3.3 V	3.3	FLATPACK, FINE PITCH	QFP208,1.2SQ,20	ATM/SONET/SDH ICs	.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-PQFP-G208	3	4.1 mm	28 mm	Not Qualified	e0	30	225	28 mm
UPD98401GD-MML	Renesas Electronics	ATM/SONET/SDH SEGMENTATION AND REASSEMBLY DEVICE	COMMERCIAL	GULL WING	208	QFP	SQUARE	PLASTIC/EPOXY		YES		CMOS	570 mA	5 V	5	FLATPACK	QFP208,1.2SQ,20	ATM/SONET/SDH ICs	.5 mm	70 Cel	0 Cel	Tin/Lead (Sn/Pb)	QUAD	S-PQFP-G208				Not Qualified	e0
TMPR28051-3-SL5	Broadcom	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	GULL WING	208	FQFP	SQUARE	PLASTIC/EPOXY		YES	1			3.3 V		FLATPACK, FINE PITCH			.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-PQFP-G208		4.1 mm	28 mm	Not Qualified	e0	30	225	28 mm
L644360A2WV3E41FAA	Broadcom	ATM/SONET/SDH SEGMENTATION AND REASSEMBLY DEVICE	COMMERCIAL	GULL WING	208	QFP	SQUARE	METAL		YES		CMOS		5 V	5	FLATPACK	QFP208,1.2SQ,20	ATM/SONET/SDH ICs	.5 mm	70 Cel	0 Cel	Tin/Lead (Sn/Pb)	QUAD	S-MQFP-G208				Not Qualified	e0
TMUX03155	Broadcom	ATM/SONET/SDH MUX/DEMUX	INDUSTRIAL	GULL WING	208	FQFP	SQUARE	PLASTIC/EPOXY		YES	1			3.3 V		FLATPACK, FINE PITCH			.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-PQFP-G208		4.1 mm	28 mm	Not Qualified	e0	30	225	28 mm
TSWC03622	Broadcom	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	BALL	208	BGA	SQUARE	PLASTIC/EPOXY		YES	1			3.3 V		GRID ARRAY			1 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B208		2.12 mm	17 mm	Not Qualified	e0	30	225	17 mm
TSWC01622	Broadcom	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	BALL	208	BGA	SQUARE	PLASTIC/EPOXY		YES	1			3.3 V		GRID ARRAY			1 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B208		2.12 mm	17 mm	Not Qualified	e0	30	225	17 mm
L644360A3WV3E41FAA	Broadcom	ATM/SONET/SDH SEGMENTATION AND REASSEMBLY DEVICE	COMMERCIAL	GULL WING	208	QFP	SQUARE	METAL		YES		CMOS		5 V	5	FLATPACK	QFP208,1.2SQ,20	ATM/SONET/SDH ICs	.5 mm	70 Cel	0 Cel	Tin/Lead (Sn/Pb)	QUAD	S-MQFP-G208				Not Qualified	e0
TMPR28051-3-SL2	Broadcom	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	GULL WING	208	FQFP	SQUARE	PLASTIC/EPOXY		YES	1			3.3 V		FLATPACK, FINE PITCH			.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-PQFP-G208		4.1 mm	28 mm	Not Qualified	e0	30	225	28 mm
TMPR28051-SL	Broadcom	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	GULL WING	208	FQFP	SQUARE	PLASTIC/EPOXY		YES	1			5 V		FLATPACK, FINE PITCH			.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-PQFP-G208		4.1 mm	28 mm	Not Qualified	e0	30	225	28 mm
L644360A4WV3E41FAA	Broadcom	ATM/SONET/SDH SEGMENTATION AND REASSEMBLY DEVICE	COMMERCIAL	GULL WING	208	QFP	SQUARE	METAL		YES		CMOS		5 V	5	FLATPACK	QFP208,1.2SQ,20	ATM/SONET/SDH ICs	.5 mm	70 Cel	0 Cel	Tin/Lead (Sn/Pb)	QUAD	S-MQFP-G208				Not Qualified	e0
L644360A1WV3E41FAA	Broadcom	ATM/SONET/SDH SEGMENTATION AND REASSEMBLY DEVICE	COMMERCIAL	GULL WING	208	QFP	SQUARE	METAL		YES		CMOS		5 V	5	FLATPACK	QFP208,1.2SQ,20	ATM/SONET/SDH ICs	.5 mm	70 Cel	0 Cel	Tin/Lead (Sn/Pb)	QUAD	S-MQFP-G208				Not Qualified	e0
TSWC02622	Broadcom	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	BALL	208	BGA	SQUARE	PLASTIC/EPOXY		YES	1			3.3 V		GRID ARRAY			1 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B208		2.12 mm	17 mm	Not Qualified	e0	30	225	17 mm
TSYN03622	Broadcom	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	BALL	208	BGA	SQUARE	PLASTIC/EPOXY		YES	1			3.3 V		GRID ARRAY			1 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B208		2.12 mm	17 mm	Not Qualified	e0	30	225	17 mm
L64360	Broadcom	ATM/SONET/SDH SEGMENTATION AND REASSEMBLY DEVICE	COMMERCIAL	GULL WING	208	QFP	SQUARE	PLASTIC/EPOXY		YES			750 mA	5 V	5	FLATPACK	QFP208,1.2SQ,20	ATM/SONET/SDH ICs	.5 mm	50 Cel	0 Cel	Tin/Lead (Sn/Pb)	QUAD	S-PQFP-G208				Not Qualified	e0
TSYN01622	Broadcom	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	BALL	208	BGA	SQUARE	PLASTIC/EPOXY		YES	1			3.3 V		GRID ARRAY			1 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B208		2.12 mm	17 mm	Not Qualified	e0	30	225	17 mm

ATM/SONET/SDH Circuits

ATM (Asynchronous Transfer Mode), SONET (Synchronous Optical Network), and SDH (Synchronous Digital Hierarchy) circuits are high-speed communication technologies used in telecommunications networks.

ATM is a cell-based network technology that enables high-speed data transfer, video and voice communication. It divides data into fixed-size cells and sends them across the network using time-division multiplexing (TDM).

SONET and SDH are both standard protocols for optical telecommunications transport. They use synchronous timing signals to enable high-speed communication over fiber optic networks. SONET is used primarily in North America, while SDH is used primarily in Europe and other regions.

ATM, SONET, and SDH circuits offer several advantages over other communication technologies. They provide high-speed communication with low latency, allowing for efficient data transfer and real-time voice and video communication. They also provide a high level of reliability and fault tolerance, making them ideal for use in mission-critical applications such as banking, healthcare, and defense.

However, these circuits also require specialized hardware and software, and can be more expensive to implement and maintain than other communication technologies. They also require a high level of expertise to configure and manage.