456 ATM/SONET/SDH Circuits 8

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Applications	Surface Mount	No. of Functions	Technology	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
PXB4350E	Infineon Technologies	ATM/SONET/SDH SWITCHING CIRCUIT	INDUSTRIAL	BALL	456	BGA	SQUARE	PLASTIC/EPOXY	ATM	YES	1	CMOS	3.3 V	3.3	GRID ARRAY	BGA456,26X26,50	ATM/SONET/SDH ICs	1.27 mm	85 Cel	-45 Cel	TIN LEAD	BOTTOM	S-PBGA-B456	2.5 mm	35 mm	Not Qualified	e0			35 mm
PXF4336E	Infineon Technologies		INDUSTRIAL	BALL	456	BGA	SQUARE	PLASTIC/EPOXY		YES				1.8,3.3	GRID ARRAY	BGA456,26X26,50	ATM/SONET/SDH ICs	1.27 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B456			Not Qualified
PXB4350	Infineon Technologies	ATM/SONET/SDH SWITCHING CIRCUIT	COMMERCIAL	BALL	456	BGA	SQUARE	PLASTIC/EPOXY		YES	1	CMOS	3.3 V		GRID ARRAY			1.27 mm	70 Cel	0 Cel		BOTTOM	S-PBGA-B456	2.5 mm	35 mm	Not Qualified				35 mm
PXB4330	Infineon Technologies	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	BALL	456	BGA	SQUARE	PLASTIC/EPOXY		YES	1		1.8 V		GRID ARRAY			1.27 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B456	2.5 mm	35 mm	Not Qualified				35 mm
TMXL281553BAL-1-DB	Broadcom	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	BALL	456	BGA	SQUARE	PLASTIC/EPOXY		YES	1		3.3 V		GRID ARRAY			1.27 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B456	2.54 mm	35 mm	Not Qualified	e0	30	225	35 mm
TMXF281553BAL-C2-DB	Broadcom	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	BALL	456	BGA	SQUARE	PLASTIC/EPOXY		YES	1		3.3 V	3.3	GRID ARRAY	BGA456,26X26,50	Other Telecom ICs	1.27 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B456	2.54 mm	35 mm	Not Qualified	e0	30	225	35 mm
TMXF281553BAL-2-DB	Broadcom	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	BALL	456	BGA	SQUARE	PLASTIC/EPOXY		YES	1		3.3 V		GRID ARRAY			1.27 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B456	2.54 mm	35 mm	Not Qualified	e0	30	225	35 mm
TMXL28155BAL-1	Broadcom	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	BALL	456	BGA	SQUARE	PLASTIC/EPOXY		YES	1		3.3 V		GRID ARRAY			1.27 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B456	2.54 mm	35 mm	Not Qualified	e0	30	225	35 mm

ATM/SONET/SDH Circuits

ATM (Asynchronous Transfer Mode), SONET (Synchronous Optical Network), and SDH (Synchronous Digital Hierarchy) circuits are high-speed communication technologies used in telecommunications networks.

ATM is a cell-based network technology that enables high-speed data transfer, video and voice communication. It divides data into fixed-size cells and sends them across the network using time-division multiplexing (TDM).

SONET and SDH are both standard protocols for optical telecommunications transport. They use synchronous timing signals to enable high-speed communication over fiber optic networks. SONET is used primarily in North America, while SDH is used primarily in Europe and other regions.

ATM, SONET, and SDH circuits offer several advantages over other communication technologies. They provide high-speed communication with low latency, allowing for efficient data transfer and real-time voice and video communication. They also provide a high level of reliability and fault tolerance, making them ideal for use in mission-critical applications such as banking, healthcare, and defense.

However, these circuits also require specialized hardware and software, and can be more expensive to implement and maintain than other communication technologies. They also require a high level of expertise to configure and manage.