Part | RoHS | Manufacturer | Telecom IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Package Body Material | Applications | Surface Mount | No. of Functions | No. of Channels | Technology | Nominal Negative Supply Voltage | Maximum Supply Current | Nominal Supply Voltage | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Minimum Operating Temperature | Terminal Finish | Terminal Position | Data Rate | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Texas Instruments |
ATM/SONET/SDH TRANSCEIVER |
INDUSTRIAL |
GULL WING |
100 |
HTFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
2.5 V |
FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-PQFP-G100 |
1.2 mm |
14 mm |
Not Qualified |
14 mm |
||||||||||||||||
|
Texas Instruments |
ATM/SONET/SDH TRANSCEIVER |
INDUSTRIAL |
GULL WING |
100 |
HTFQFP |
SQUARE |
PLASTIC/EPOXY |
SDH; SONET |
YES |
1 |
2.5 V |
2.5 |
FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH |
TQFP100,.63SQ |
ATM/SONET/SDH ICs |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQFP-G100 |
3 |
1.2 mm |
14 mm |
Not Qualified |
e4 |
30 |
260 |
14 mm |
|||||||
|
Texas Instruments |
ATM/SONET/SDH TRANSCEIVER |
INDUSTRIAL |
GULL WING |
100 |
HTFQFP |
SQUARE |
PLASTIC/EPOXY |
SDH; SONET |
YES |
1 |
2.5 V |
2.5 |
FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH |
TQFP100,.63SQ |
ATM/SONET/SDH ICs |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQFP-G100 |
3 |
1.2 mm |
14 mm |
Not Qualified |
e4 |
30 |
260 |
14 mm |
|||||||
|
Texas Instruments |
ATM/SONET/SDH TRANSCEIVER |
INDUSTRIAL |
GULL WING |
100 |
HTFQFP |
SQUARE |
PLASTIC/EPOXY |
SDH; SONET |
YES |
1 |
CMOS |
2.5 V |
2.5 |
FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH |
TQFP100,.63SQ |
ATM/SONET/SDH ICs |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQFP-G100 |
3 |
1.2 mm |
14 mm |
Not Qualified |
e4 |
30 |
260 |
14 mm |
||||||
|
Texas Instruments |
ATM/SONET/SDH TRANSCEIVER |
INDUSTRIAL |
GULL WING |
100 |
HTFQFP |
SQUARE |
PLASTIC/EPOXY |
SDH; SONET |
YES |
1 |
CMOS |
2.5 V |
2.5 |
FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH |
TQFP100,.63SQ |
ATM/SONET/SDH ICs |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQFP-G100 |
3 |
1.2 mm |
14 mm |
Not Qualified |
e4 |
30 |
260 |
14 mm |
||||||
|
Texas Instruments |
ATM/SONET/SDH TRANSCEIVER |
INDUSTRIAL |
GULL WING |
100 |
HTFQFP |
SQUARE |
PLASTIC/EPOXY |
SDH; SONET |
YES |
1 |
2.5 V |
2.5 |
FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH |
TQFP100,.63SQ |
ATM/SONET/SDH ICs |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQFP-G100 |
3 |
1.2 mm |
14 mm |
Not Qualified |
e4 |
30 |
260 |
14 mm |
|||||||
Texas Instruments |
ATM/SONET/SDH TRANSCEIVER |
INDUSTRIAL |
GULL WING |
100 |
HTFQFP |
SQUARE |
PLASTIC/EPOXY |
SDH; SONET |
YES |
1 |
2.5 V |
2.5 |
FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH |
TQFP100,.63SQ |
ATM/SONET/SDH ICs |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-PQFP-G100 |
1.2 mm |
14 mm |
Not Qualified |
14 mm |
|||||||||||||
|
Texas Instruments |
ATM/SONET/SDH TRANSCEIVER |
INDUSTRIAL |
GULL WING |
100 |
HTFQFP |
SQUARE |
PLASTIC/EPOXY |
SDH; SONET |
YES |
1 |
CMOS |
2.5 V |
2.5 |
FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH |
TQFP100,.63SQ |
ATM/SONET/SDH ICs |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQFP-G100 |
3 |
1.2 mm |
14 mm |
Not Qualified |
e4 |
30 |
260 |
14 mm |
||||||
|
Texas Instruments |
ATM/SONET/SDH TRANSCEIVER |
INDUSTRIAL |
GULL WING |
100 |
HTFQFP |
SQUARE |
PLASTIC/EPOXY |
SDH; SONET |
YES |
1 |
2.5 V |
2.5 |
FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH |
TQFP100,.63SQ |
ATM/SONET/SDH ICs |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQFP-G100 |
3 |
1.2 mm |
14 mm |
Not Qualified |
e4 |
30 |
260 |
14 mm |
|||||||
Texas Instruments |
ATM/SONET/SDH TRANSCEIVER |
INDUSTRIAL |
GULL WING |
100 |
HTFQFP |
SQUARE |
PLASTIC/EPOXY |
SDH; SONET |
YES |
1 |
2.5 V |
2.5 |
FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH |
TQFP100,.63SQ |
ATM/SONET/SDH ICs |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-PQFP-G100 |
1.2 mm |
14 mm |
Not Qualified |
14 mm |
|||||||||||||
Texas Instruments |
ATM/SONET/SDH TRANSCEIVER |
INDUSTRIAL |
GULL WING |
100 |
HTFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
2.5 V |
FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-PQFP-G100 |
1.2 mm |
14 mm |
Not Qualified |
14 mm |
|||||||||||||||||
|
Texas Instruments |
ATM/SONET/SDH TRANSCEIVER |
INDUSTRIAL |
GULL WING |
100 |
HTFQFP |
SQUARE |
PLASTIC/EPOXY |
SDH; SONET |
YES |
1 |
2.5 V |
2.5 |
FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH |
TQFP100,.63SQ |
ATM/SONET/SDH ICs |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQFP-G100 |
3 |
1.2 mm |
14 mm |
Not Qualified |
e4 |
30 |
260 |
14 mm |
|||||||
Texas Instruments |
ATM/SONET/SDH TRANSCEIVER |
INDUSTRIAL |
GULL WING |
100 |
HTFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
2.5 V |
FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-PQFP-G100 |
1.2 mm |
14 mm |
Not Qualified |
14 mm |
||||||||||||||||
|
Texas Instruments |
ATM/SONET/SDH TRANSCEIVER |
INDUSTRIAL |
GULL WING |
100 |
HTFQFP |
SQUARE |
PLASTIC/EPOXY |
SDH; SONET |
YES |
1 |
CMOS |
2.5 V |
2.5 |
FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH |
TQFP100,.63SQ |
ATM/SONET/SDH ICs |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQFP-G100 |
3 |
1.2 mm |
14 mm |
Not Qualified |
e4 |
30 |
260 |
14 mm |
||||||
|
Texas Instruments |
ATM/SONET/SDH TRANSCEIVER |
INDUSTRIAL |
GULL WING |
100 |
HTFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
2.5 V |
FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQFP-G100 |
3 |
1.2 mm |
14 mm |
e4 |
30 |
260 |
14 mm |
||||||||||||
|
Texas Instruments |
ATM/SONET/SDH TRANSCEIVER |
INDUSTRIAL |
GULL WING |
100 |
HTFQFP |
SQUARE |
PLASTIC/EPOXY |
SDH; SONET |
YES |
1 |
CMOS |
2.5 V |
2.5 |
FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH |
TQFP100,.63SQ |
ATM/SONET/SDH ICs |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQFP-G100 |
3 |
1.2 mm |
14 mm |
Not Qualified |
e4 |
30 |
260 |
14 mm |
||||||
|
Texas Instruments |
ATM/SONET/SDH TRANSCEIVER |
INDUSTRIAL |
GULL WING |
100 |
HTFQFP |
SQUARE |
PLASTIC/EPOXY |
SDH; SONET |
YES |
1 |
CMOS |
2.5 V |
2.5 |
FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH |
TQFP100,.63SQ |
ATM/SONET/SDH ICs |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQFP-G100 |
3 |
1.2 mm |
14 mm |
Not Qualified |
e4 |
30 |
260 |
14 mm |
||||||
|
Texas Instruments |
ATM/SONET/SDH TRANSCEIVER |
INDUSTRIAL |
GULL WING |
100 |
HTFQFP |
SQUARE |
PLASTIC/EPOXY |
SDH; SONET |
YES |
1 |
2.5 V |
2.5 |
FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH |
TQFP100,.63SQ |
ATM/SONET/SDH ICs |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQFP-G100 |
3 |
1.2 mm |
14 mm |
Not Qualified |
e4 |
30 |
260 |
14 mm |
|||||||
|
Analog Devices |
ATM/SONET/SDH SERIAL TO PARALLEL/PARALLEL TO SERIAL CONVERTER |
INDUSTRIAL |
GULL WING |
64 |
HTFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH |
.5 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
QUAD |
S-PQFP-G64 |
3 |
1.2 mm |
10 mm |
Not Qualified |
e3 |
10 mm |
|||||||||||||
|
Analog Devices |
ATM/SONET/SDH CLOCK RECOVERY CIRCUIT |
INDUSTRIAL |
GULL WING |
32 |
HTFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH |
.5 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
QUAD |
S-PQFP-G32 |
1.2 mm |
5 mm |
Not Qualified |
e3 |
5 mm |
||||||||||||||
|
Analog Devices |
ATM/SONET/SDH SERIAL TO PARALLEL/PARALLEL TO SERIAL CONVERTER |
INDUSTRIAL |
GULL WING |
64 |
HTFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH |
.5 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
QUAD |
S-PQFP-G64 |
3 |
1.2 mm |
10 mm |
Not Qualified |
e3 |
10 mm |
|||||||||||||
NXP Semiconductors |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
GULL WING |
32 |
HTFQFP |
SQUARE |
PLASTIC/EPOXY |
SDH; SONET |
YES |
1 |
3.3 V |
FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-PQFP-G32 |
1.2 mm |
5 mm |
Not Qualified |
5 mm |
||||||||||||||||
NXP Semiconductors |
ATM/SONET/SDH RECEIVER |
INDUSTRIAL |
GULL WING |
100 |
HTFQFP |
SQUARE |
PLASTIC/EPOXY |
SDH; SONET |
YES |
1 |
3.3 V |
FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH |
.5 mm |
85 Cel |
-40 Cel |
TIN |
QUAD |
S-PQFP-G100 |
1.2 mm |
14 mm |
Not Qualified |
e3 |
14 mm |
||||||||||||||
NXP Semiconductors |
ATM/SONET/SDH RECEIVER |
INDUSTRIAL |
GULL WING |
100 |
HTFQFP |
SQUARE |
PLASTIC/EPOXY |
SDH; SONET |
YES |
1 |
CMOS |
511 mA |
3.3 V |
3.3 |
FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH |
TQFP100,.63SQ |
Other Telecom ICs |
.5 mm |
85 Cel |
-40 Cel |
TIN |
QUAD |
S-PQFP-G100 |
1.2 mm |
14 mm |
Not Qualified |
e3 |
14 mm |
|||||||||
NXP Semiconductors |
ATM/SONET/SDH TRANSMITTER |
INDUSTRIAL |
GULL WING |
100 |
HTFQFP |
SQUARE |
PLASTIC/EPOXY |
SDH; SONET |
YES |
1 |
CMOS |
318 mA |
3.3 V |
3.3 |
FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH |
TQFP100,.63SQ |
Other Telecom ICs |
.5 mm |
85 Cel |
-40 Cel |
TIN |
QUAD |
S-PQFP-G100 |
1.2 mm |
14 mm |
Not Qualified |
e3 |
14 mm |
|||||||||
NXP Semiconductors |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
GULL WING |
32 |
HTFQFP |
SQUARE |
PLASTIC/EPOXY |
SDH; SONET |
YES |
1 |
3.3 V |
FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-PQFP-G32 |
1.2 mm |
5 mm |
Not Qualified |
5 mm |
||||||||||||||||
NXP Semiconductors |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
GULL WING |
32 |
HTFQFP |
SQUARE |
PLASTIC/EPOXY |
SDH; SONET |
YES |
1 |
3.3 V |
FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-PQFP-G32 |
1.2 mm |
5 mm |
Not Qualified |
5 mm |
||||||||||||||||
|
NXP Semiconductors |
ATM/SONET/SDH RECEIVER |
INDUSTRIAL |
GULL WING |
100 |
HTFQFP |
SQUARE |
PLASTIC/EPOXY |
SDH; SONET |
YES |
1 |
3.3 V |
FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH |
.5 mm |
85 Cel |
-40 Cel |
Tin (Sn) |
QUAD |
S-PQFP-G100 |
1.2 mm |
14 mm |
Not Qualified |
e3 |
14 mm |
|||||||||||||
NXP Semiconductors |
ATM/SONET/SDH TRANSCEIVER |
INDUSTRIAL |
GULL WING |
100 |
HTFQFP |
SQUARE |
PLASTIC/EPOXY |
SDH; SONET |
YES |
1 |
3.3 V |
FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH |
.5 mm |
85 Cel |
-40 Cel |
TIN |
QUAD |
S-PQFP-G100 |
1.2 mm |
14 mm |
Not Qualified |
e3 |
14 mm |
||||||||||||||
NXP Semiconductors |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
GULL WING |
32 |
HTFQFP |
SQUARE |
PLASTIC/EPOXY |
SDH; SONET |
YES |
1 |
3.3 V |
FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-PQFP-G32 |
1.2 mm |
5 mm |
Not Qualified |
5 mm |
||||||||||||||||
NXP Semiconductors |
ATM/SONET/SDH TRANSMITTER |
INDUSTRIAL |
GULL WING |
100 |
HTFQFP |
SQUARE |
PLASTIC/EPOXY |
SDH; SONET |
YES |
1 |
410 mA |
3.3 V |
3.3 |
FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH |
HQFP100,.63SQ,20 |
Other Telecom ICs |
.5 mm |
85 Cel |
-40 Cel |
TIN |
QUAD |
S-PQFP-G100 |
1.2 mm |
14 mm |
Not Qualified |
e3 |
14 mm |
||||||||||
Maxim Integrated |
ATM/SONET/SDH CLOCK RECOVERY CIRCUIT |
INDUSTRIAL |
GULL WING |
64 |
HTFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
BIPOLAR |
3.3 V |
FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
QUAD |
S-PQFP-G64 |
3 |
1.2 mm |
10 mm |
Not Qualified |
e0 |
10 mm |
|||||||||||||
|
Maxim Integrated |
ATM/SONET/SDH SERIAL TO PARALLEL/PARALLEL TO SERIAL CONVERTER |
INDUSTRIAL |
GULL WING |
64 |
HTFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH |
.5 mm |
85 Cel |
-40 Cel |
TIN |
QUAD |
S-PQFP-G64 |
3 |
1.2 mm |
10 mm |
Not Qualified |
e3 |
10 mm |
|||||||||||||
Maxim Integrated |
ATM/SONET/SDH MUX/DEMUX |
OTHER |
GULL WING |
64 |
HTFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH |
.5 mm |
85 Cel |
0 Cel |
TIN LEAD |
QUAD |
S-PQFP-G64 |
3 |
1.2 mm |
10 mm |
Not Qualified |
e0 |
10 mm |
||||||||||||||
Maxim Integrated |
ATM/SONET/SDH MUX/DEMUX |
OTHER |
GULL WING |
64 |
HTFQFP |
SQUARE |
PLASTIC/EPOXY |
ATM; SDH; SONET |
YES |
1 |
3.3 V |
FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH |
.5 mm |
85 Cel |
0 Cel |
TIN LEAD |
QUAD |
S-PQFP-G64 |
1 |
1.2 mm |
10 mm |
Not Qualified |
e0 |
10 mm |
|||||||||||||
Maxim Integrated |
ATM/SONET/SDH SERIAL TO PARALLEL/PARALLEL TO SERIAL CONVERTER |
INDUSTRIAL |
GULL WING |
64 |
HTFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
BIPOLAR |
3.3 V |
FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
QUAD |
S-PQFP-G64 |
3 |
1.2 mm |
10 mm |
Not Qualified |
e0 |
10 mm |
|||||||||||||
|
Maxim Integrated |
ATM/SONET/SDH SERIAL TO PARALLEL/PARALLEL TO SERIAL CONVERTER |
INDUSTRIAL |
GULL WING |
64 |
HTFQFP |
SQUARE |
PLASTIC/EPOXY |
SDH; SONET |
YES |
1 |
.38 mA |
3.3 V |
3.3 |
FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH |
TQFP64,.47SQ |
ATM/SONET/SDH ICs |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-PQFP-G64 |
3 |
1.2 mm |
10 mm |
Not Qualified |
e3 |
10 mm |
||||||||
Maxim Integrated |
ATM/SONET/SDH MUX/DEMUX |
OTHER |
GULL WING |
64 |
HTFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH |
.5 mm |
85 Cel |
0 Cel |
TIN LEAD |
QUAD |
S-PQFP-G64 |
3 |
1.2 mm |
10 mm |
Not Qualified |
e0 |
10 mm |
||||||||||||||
|
Maxim Integrated |
ATM/SONET/SDH SUPPORT CIRCUIT |
OTHER |
GULL WING |
48 |
HTFQFP |
SQUARE |
PLASTIC/EPOXY |
ATM |
YES |
1 |
BIPOLAR |
3.3 V |
FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH |
.5 mm |
85 Cel |
0 Cel |
MATTE TIN |
QUAD |
S-PQFP-G48 |
1 |
1.2 mm |
7 mm |
Not Qualified |
e3 |
7 mm |
|||||||||||
Maxim Integrated |
ATM/SONET/SDH SERIAL TO PARALLEL/PARALLEL TO SERIAL CONVERTER |
INDUSTRIAL |
GULL WING |
64 |
HTFQFP |
SQUARE |
PLASTIC/EPOXY |
SDH; SONET |
YES |
1 |
.38 mA |
3.3 V |
3.3 |
FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH |
TQFP64,.47SQ |
ATM/SONET/SDH ICs |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
QUAD |
S-PQFP-G64 |
3 |
1.2 mm |
10 mm |
Not Qualified |
e0 |
10 mm |
|||||||||
Maxim Integrated |
ATM/SONET/SDH SUPPORT CIRCUIT |
OTHER |
GULL WING |
48 |
HTFQFP |
SQUARE |
PLASTIC/EPOXY |
ATM |
YES |
1 |
BIPOLAR |
.265 mA |
3.3 V |
3.3 |
FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH |
TQFP48,.35SQ |
ATM/SONET/SDH ICs |
.5 mm |
85 Cel |
0 Cel |
Tin/Lead (Sn85Pb15) |
QUAD |
S-PQFP-G48 |
3 |
1.2 mm |
7 mm |
Not Qualified |
e0 |
20 |
240 |
7 mm |
||||||
Maxim Integrated |
ATM/SONET/SDH MUX/DEMUX |
OTHER |
GULL WING |
64 |
HTFQFP |
SQUARE |
PLASTIC/EPOXY |
ATM; SDH; SONET |
YES |
1 |
3.3 V |
FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH |
.5 mm |
85 Cel |
0 Cel |
TIN LEAD |
QUAD |
S-PQFP-G64 |
1 |
1.2 mm |
10 mm |
Not Qualified |
e0 |
10 mm |
|||||||||||||
Maxim Integrated |
ATM/SONET/SDH CLOCK RECOVERY CIRCUIT |
INDUSTRIAL |
GULL WING |
64 |
HTFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
BIPOLAR |
3.3 V |
FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
QUAD |
S-PQFP-G64 |
3 |
1.2 mm |
10 mm |
Not Qualified |
e0 |
10 mm |
|||||||||||||
|
Maxim Integrated |
ATM/SONET/SDH CLOCK RECOVERY CIRCUIT |
INDUSTRIAL |
GULL WING |
64 |
HTFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
BIPOLAR |
3.3 V |
FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH |
.5 mm |
85 Cel |
-40 Cel |
TIN |
QUAD |
S-PQFP-G64 |
3 |
1.2 mm |
10 mm |
Not Qualified |
e3 |
10 mm |
||||||||||||
Maxim Integrated |
ATM/SONET/SDH MUX/DEMUX |
OTHER |
GULL WING |
64 |
HTFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH |
.5 mm |
85 Cel |
0 Cel |
TIN LEAD |
QUAD |
S-PQFP-G64 |
3 |
1.2 mm |
10 mm |
Not Qualified |
e0 |
10 mm |
||||||||||||||
Maxim Integrated |
ATM/SONET/SDH SERIAL TO PARALLEL/PARALLEL TO SERIAL CONVERTER |
INDUSTRIAL |
GULL WING |
64 |
HTFQFP |
SQUARE |
PLASTIC/EPOXY |
SDH; SONET |
YES |
1 |
.38 mA |
3.3 V |
3.3 |
FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH |
TQFP64,.47SQ |
ATM/SONET/SDH ICs |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
QUAD |
S-PQFP-G64 |
1 |
1.2 mm |
10 mm |
Not Qualified |
e0 |
10 mm |
|||||||||
Maxim Integrated |
ATM/SONET/SDH SERIAL TO PARALLEL/PARALLEL TO SERIAL CONVERTER |
INDUSTRIAL |
GULL WING |
64 |
HTFQFP |
SQUARE |
PLASTIC/EPOXY |
SDH; SONET |
YES |
1 |
BIPOLAR |
.23 mA |
3.3 V |
3.3 |
FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH |
TQFP64,.47SQ |
ATM/SONET/SDH ICs |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
QUAD |
S-PQFP-G64 |
3 |
1.2 mm |
10 mm |
Not Qualified |
e0 |
10 mm |
||||||||
Maxim Integrated |
ATM/SONET/SDH SERIAL TO PARALLEL/PARALLEL TO SERIAL CONVERTER |
INDUSTRIAL |
GULL WING |
64 |
HTFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-PQFP-G64 |
1.2 mm |
10 mm |
NOT SPECIFIED |
NOT SPECIFIED |
10 mm |
ATM (Asynchronous Transfer Mode), SONET (Synchronous Optical Network), and SDH (Synchronous Digital Hierarchy) circuits are high-speed communication technologies used in telecommunications networks.
ATM is a cell-based network technology that enables high-speed data transfer, video and voice communication. It divides data into fixed-size cells and sends them across the network using time-division multiplexing (TDM).
SONET and SDH are both standard protocols for optical telecommunications transport. They use synchronous timing signals to enable high-speed communication over fiber optic networks. SONET is used primarily in North America, while SDH is used primarily in Europe and other regions.
ATM, SONET, and SDH circuits offer several advantages over other communication technologies. They provide high-speed communication with low latency, allowing for efficient data transfer and real-time voice and video communication. They also provide a high level of reliability and fault tolerance, making them ideal for use in mission-critical applications such as banking, healthcare, and defense.
However, these circuits also require specialized hardware and software, and can be more expensive to implement and maintain than other communication technologies. They also require a high level of expertise to configure and manage.