HTFQFP ATM/SONET/SDH Circuits 68

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Part RoHS Manufacturer Telecom IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material Applications Surface Mount No. of Functions No. of Channels Technology Nominal Negative Supply Voltage Maximum Supply Current Nominal Supply Voltage Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category Terminal Pitch Maximum Operating Temperature Minimum Operating Temperature Terminal Finish Terminal Position Data Rate JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length

MAX3891ECB-D

Maxim Integrated

ATM/SONET/SDH SERIAL TO PARALLEL/PARALLEL TO SERIAL CONVERTER

INDUSTRIAL

GULL WING

64

HTFQFP

SQUARE

PLASTIC/EPOXY

YES

1

BIPOLAR

3.3 V

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

.5 mm

85 Cel

-40 Cel

TIN LEAD

QUAD

S-PQFP-G64

3

1.2 mm

10 mm

Not Qualified

e0

10 mm

MAX3891ECB+D

Maxim Integrated

ATM/SONET/SDH SERIAL TO PARALLEL/PARALLEL TO SERIAL CONVERTER

INDUSTRIAL

GULL WING

64

HTFQFP

SQUARE

PLASTIC/EPOXY

YES

1

BIPOLAR

3.3 V

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

.5 mm

85 Cel

-40 Cel

TIN

QUAD

S-PQFP-G64

3

1.2 mm

10 mm

Not Qualified

e3

10 mm

MAX3890ECB-D

Maxim Integrated

ATM/SONET/SDH SERIAL TO PARALLEL/PARALLEL TO SERIAL CONVERTER

INDUSTRIAL

GULL WING

64

HTFQFP

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

.5 mm

85 Cel

-40 Cel

TIN LEAD

QUAD

S-PQFP-G64

3

1.2 mm

10 mm

Not Qualified

e0

10 mm

MAX3890ECB

Maxim Integrated

ATM/SONET/SDH SERIAL TO PARALLEL/PARALLEL TO SERIAL CONVERTER

INDUSTRIAL

GULL WING

64

HTFQFP

SQUARE

PLASTIC/EPOXY

ATM; SDH; SONET

YES

1

BIPOLAR

.23 mA

3.3 V

3.3

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

TQFP64,.47SQ

ATM/SONET/SDH ICs

.5 mm

85 Cel

-40 Cel

TIN LEAD

QUAD

S-PQFP-G64

3

1.2 mm

10 mm

Not Qualified

e0

10 mm

MAX3881ECB-T

Maxim Integrated

ATM/SONET/SDH CLOCK RECOVERY CIRCUIT

INDUSTRIAL

GULL WING

64

HTFQFP

SQUARE

PLASTIC/EPOXY

YES

1

BIPOLAR

3.3 V

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

.5 mm

85 Cel

-40 Cel

TIN LEAD

QUAD

S-PQFP-G64

3

1.2 mm

10 mm

Not Qualified

e0

10 mm

MAX3890ECB-T

Maxim Integrated

ATM/SONET/SDH SERIAL TO PARALLEL/PARALLEL TO SERIAL CONVERTER

INDUSTRIAL

GULL WING

64

HTFQFP

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

.5 mm

85 Cel

-40 Cel

TIN LEAD

QUAD

S-PQFP-G64

3

1.2 mm

10 mm

Not Qualified

e0

10 mm

MAX3880ECB+

Maxim Integrated

ATM/SONET/SDH SERIAL TO PARALLEL/PARALLEL TO SERIAL CONVERTER

INDUSTRIAL

GULL WING

64

HTFQFP

SQUARE

PLASTIC/EPOXY

SDH; SONET

YES

1

.38 mA

3.3 V

3.3

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

TQFP64,.47SQ

ATM/SONET/SDH ICs

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-PQFP-G64

3

1.2 mm

10 mm

Not Qualified

e3

10 mm

MAX3881ECB+TD

Maxim Integrated

ATM/SONET/SDH CLOCK RECOVERY CIRCUIT

INDUSTRIAL

GULL WING

64

HTFQFP

SQUARE

PLASTIC/EPOXY

YES

1

BIPOLAR

3.3 V

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

.5 mm

85 Cel

-40 Cel

TIN

QUAD

S-PQFP-G64

3

1.2 mm

10 mm

Not Qualified

e3

10 mm

MAX3822UCM-T

Maxim Integrated

ATM/SONET/SDH SUPPORT CIRCUIT

OTHER

GULL WING

48

HTFQFP

SQUARE

PLASTIC/EPOXY

ATM

YES

1

BIPOLAR

3.3 V

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

.5 mm

85 Cel

0 Cel

TIN LEAD

QUAD

S-PQFP-G48

1

1.2 mm

7 mm

Not Qualified

e0

7 mm

MAX3832UCB-TD

Maxim Integrated

ATM/SONET/SDH MUX/DEMUX

OTHER

GULL WING

64

HTFQFP

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

.5 mm

85 Cel

0 Cel

QUAD

S-PQFP-G64

1.2 mm

10 mm

NOT SPECIFIED

NOT SPECIFIED

10 mm

MAX3881ECB

Maxim Integrated

ATM/SONET/SDH CLOCK RECOVERY CIRCUIT

INDUSTRIAL

GULL WING

64

HTFQFP

SQUARE

PLASTIC/EPOXY

SDH; SONET

YES

1

BIPOLAR

3.3 V

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

.5 mm

85 Cel

-40 Cel

TIN LEAD

QUAD

S-PQFP-G64

1

1.2 mm

10 mm

Not Qualified

e0

10 mm

MAX3831UCB-T

Maxim Integrated

ATM/SONET/SDH MUX/DEMUX

OTHER

GULL WING

64

HTFQFP

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

.5 mm

85 Cel

0 Cel

TIN LEAD

QUAD

S-PQFP-G64

3

1.2 mm

10 mm

Not Qualified

e0

10 mm

MAX3890ECB+TD

Maxim Integrated

ATM/SONET/SDH SERIAL TO PARALLEL/PARALLEL TO SERIAL CONVERTER

INDUSTRIAL

GULL WING

64

HTFQFP

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

.5 mm

85 Cel

-40 Cel

TIN

QUAD

S-PQFP-G64

3

1.2 mm

10 mm

Not Qualified

e3

10 mm

MAX3891ECB+TD

Maxim Integrated

ATM/SONET/SDH SERIAL TO PARALLEL/PARALLEL TO SERIAL CONVERTER

INDUSTRIAL

GULL WING

64

HTFQFP

SQUARE

PLASTIC/EPOXY

YES

1

BIPOLAR

3.3 V

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

.5 mm

85 Cel

-40 Cel

TIN

QUAD

S-PQFP-G64

3

1.2 mm

10 mm

Not Qualified

e3

10 mm

MAX3880ECB+D

Maxim Integrated

ATM/SONET/SDH SERIAL TO PARALLEL/PARALLEL TO SERIAL CONVERTER

INDUSTRIAL

GULL WING

64

HTFQFP

SQUARE

PLASTIC/EPOXY

SDH; SONET

YES

1

.38 mA

3.3 V

3.3

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

TQFP64,.47SQ

ATM/SONET/SDH ICs

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-PQFP-G64

3

1.2 mm

10 mm

Not Qualified

e3

10 mm

MAX3822UCM+

Maxim Integrated

ATM/SONET/SDH SUPPORT CIRCUIT

OTHER

GULL WING

48

HTFQFP

SQUARE

PLASTIC/EPOXY

ATM

YES

1

BIPOLAR

.265 mA

3.3 V

3.3

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

TQFP48,.35SQ

ATM/SONET/SDH ICs

.5 mm

85 Cel

0 Cel

MATTE TIN

QUAD

S-PQFP-G48

3

1.2 mm

7 mm

Not Qualified

e3

30

260

7 mm

MAX3880ECB-D

Maxim Integrated

ATM/SONET/SDH SERIAL TO PARALLEL/PARALLEL TO SERIAL CONVERTER

INDUSTRIAL

GULL WING

64

HTFQFP

SQUARE

PLASTIC/EPOXY

SDH; SONET

YES

1

.38 mA

3.3 V

3.3

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

TQFP64,.47SQ

ATM/SONET/SDH ICs

.5 mm

85 Cel

-40 Cel

TIN LEAD

QUAD

S-PQFP-G64

3

1.2 mm

10 mm

Not Qualified

e0

10 mm

MAX3832UCB-D

Maxim Integrated

ATM/SONET/SDH MUX/DEMUX

OTHER

GULL WING

64

HTFQFP

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

.5 mm

85 Cel

0 Cel

QUAD

S-PQFP-G64

1.2 mm

10 mm

NOT SPECIFIED

NOT SPECIFIED

10 mm

MAX3880ECB-T

Maxim Integrated

ATM/SONET/SDH SERIAL TO PARALLEL/PARALLEL TO SERIAL CONVERTER

INDUSTRIAL

GULL WING

64

HTFQFP

SQUARE

PLASTIC/EPOXY

SDH; SONET

YES

1

.38 mA

3.3 V

3.3

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

TQFP64,.47SQ

ATM/SONET/SDH ICs

.5 mm

85 Cel

-40 Cel

TIN LEAD

QUAD

S-PQFP-G64

1

1.2 mm

10 mm

Not Qualified

e0

10 mm

MAX3890ECB-TD

Maxim Integrated

ATM/SONET/SDH SERIAL TO PARALLEL/PARALLEL TO SERIAL CONVERTER

INDUSTRIAL

GULL WING

64

HTFQFP

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

.5 mm

85 Cel

-40 Cel

TIN LEAD

QUAD

S-PQFP-G64

3

1.2 mm

10 mm

Not Qualified

e0

10 mm

ATM/SONET/SDH Circuits

ATM (Asynchronous Transfer Mode), SONET (Synchronous Optical Network), and SDH (Synchronous Digital Hierarchy) circuits are high-speed communication technologies used in telecommunications networks.

ATM is a cell-based network technology that enables high-speed data transfer, video and voice communication. It divides data into fixed-size cells and sends them across the network using time-division multiplexing (TDM).

SONET and SDH are both standard protocols for optical telecommunications transport. They use synchronous timing signals to enable high-speed communication over fiber optic networks. SONET is used primarily in North America, while SDH is used primarily in Europe and other regions.

ATM, SONET, and SDH circuits offer several advantages over other communication technologies. They provide high-speed communication with low latency, allowing for efficient data transfer and real-time voice and video communication. They also provide a high level of reliability and fault tolerance, making them ideal for use in mission-critical applications such as banking, healthcare, and defense.

However, these circuits also require specialized hardware and software, and can be more expensive to implement and maintain than other communication technologies. They also require a high level of expertise to configure and manage.