LQFP ATM/SONET/SDH Circuits 15

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Applications	Surface Mount	No. of Functions	Technology	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
AD6816KST	Analog Devices	ATM/SONET/SDH TRANSCEIVER	COMMERCIAL	GULL WING	44	LQFP	SQUARE	PLASTIC/EPOXY	ATM; SDH; SONET	YES	1	BIPOLAR	95 mA	5 V	5	FLATPACK, LOW PROFILE	QFP44,.47SQ,32	ATM/SONET/SDH ICs	.8 mm	70 Cel	0 Cel		QUAD	S-PQFP-G44		1.6 mm	10 mm	Not Qualified				10 mm
MAX3691ECJ	Maxim Integrated	ATM/SONET/SDH SERIAL TO PARALLEL/PARALLEL TO SERIAL CONVERTER	INDUSTRIAL	GULL WING	32	LQFP	SQUARE	PLASTIC/EPOXY	ATM; SDH; SONET	YES	1	BIPOLAR	100 mA	3.3 V	3.3	FLATPACK, LOW PROFILE	QFP32,.35SQ,32	ATM/SONET/SDH ICs	.8 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-PQFP-G32	1	1.6 mm	7 mm	Not Qualified	e0			7 mm
MAX3693ECJ+	Maxim Integrated	ATM/SONET/SDH SERIAL TO PARALLEL/PARALLEL TO SERIAL CONVERTER	INDUSTRIAL	GULL WING	32	LQFP	SQUARE	PLASTIC/EPOXY	ATM; SDH; SONET	YES	1	BIPOLAR	.1 mA	3.3 V	3.3	FLATPACK, LOW PROFILE	QFP32,.35SQ,32	ATM/SONET/SDH ICs	.8 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-PQFP-G32	1	1.6 mm	7 mm	Not Qualified	e3	30	260	7 mm
MAX3690ECJ+T	Maxim Integrated	ATM/SONET/SDH SERIAL TO PARALLEL/PARALLEL TO SERIAL CONVERTER	INDUSTRIAL	GULL WING	32	LQFP	SQUARE	PLASTIC/EPOXY	ATM; SDH; SONET	YES	1	BIPOLAR	.1 mA	3.3 V	3.3	FLATPACK, LOW PROFILE	QFP32,.35SQ,32	ATM/SONET/SDH ICs	.8 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-PQFP-G32	1	1.6 mm	7 mm	Not Qualified	e3	30	260	7 mm
MAX3690ECJ+	Maxim Integrated	ATM/SONET/SDH SERIAL TO PARALLEL/PARALLEL TO SERIAL CONVERTER	INDUSTRIAL	GULL WING	32	LQFP	SQUARE	PLASTIC/EPOXY	ATM; SDH; SONET	YES	1	BIPOLAR	.1 mA	3.3 V	3.3	FLATPACK, LOW PROFILE	QFP32,.35SQ,32	ATM/SONET/SDH ICs	.8 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-PQFP-G32	1	1.6 mm	7 mm	Not Qualified	e3	30	260	7 mm
MAX3690ECJ-T	Maxim Integrated	ATM/SONET/SDH SERIAL TO PARALLEL/PARALLEL TO SERIAL CONVERTER	INDUSTRIAL	GULL WING	32	LQFP	SQUARE	PLASTIC/EPOXY	ATM; SDH; SONET	YES	1	BIPOLAR	.1 mA	3.3 V	3.3	FLATPACK, LOW PROFILE	QFP32,.35SQ,32	ATM/SONET/SDH ICs	.8 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-PQFP-G32	1	1.6 mm	7 mm	Not Qualified	e0			7 mm
MAX3693ECJ+T	Maxim Integrated	ATM/SONET/SDH SERIAL TO PARALLEL/PARALLEL TO SERIAL CONVERTER	INDUSTRIAL	GULL WING	32	LQFP	SQUARE	PLASTIC/EPOXY	ATM; SDH; SONET	YES	1	BIPOLAR	.1 mA	3.3 V	3.3	FLATPACK, LOW PROFILE	QFP32,.35SQ,32	ATM/SONET/SDH ICs	.8 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-PQFP-G32	1	1.6 mm	7 mm	Not Qualified	e3	30	260	7 mm
MAX3691ECJ+	Maxim Integrated	ATM/SONET/SDH SERIAL TO PARALLEL/PARALLEL TO SERIAL CONVERTER	INDUSTRIAL	GULL WING	32	LQFP	SQUARE	PLASTIC/EPOXY	ATM; SDH; SONET	YES	1	BIPOLAR	100 mA	3.3 V	3.3	FLATPACK, LOW PROFILE	QFP32,.35SQ,32	ATM/SONET/SDH ICs	.8 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-PQFP-G32	1	1.6 mm	7 mm	Not Qualified	e3	30	255	7 mm
MAX3691ECJ+T	Maxim Integrated	ATM/SONET/SDH SERIAL TO PARALLEL/PARALLEL TO SERIAL CONVERTER	INDUSTRIAL	GULL WING	32	LQFP	SQUARE	PLASTIC/EPOXY	ATM; SDH; SONET	YES	1		100 mA	3.3 V		FLATPACK, LOW PROFILE			.8 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-PQFP-G32	1	1.6 mm	7 mm	Not Qualified	e3			7 mm
MAX3691ECJ-T	Maxim Integrated	ATM/SONET/SDH SERIAL TO PARALLEL/PARALLEL TO SERIAL CONVERTER	INDUSTRIAL	GULL WING	32	LQFP	SQUARE	PLASTIC/EPOXY	ATM; SDH; SONET	YES	1		100 mA	3.3 V		FLATPACK, LOW PROFILE			.8 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-PQFP-G32	1	1.6 mm	7 mm	Not Qualified	e0			7 mm
MAX3693ECJ-T	Maxim Integrated	ATM/SONET/SDH SERIAL TO PARALLEL/PARALLEL TO SERIAL CONVERTER	INDUSTRIAL	GULL WING	32	LQFP	SQUARE	PLASTIC/EPOXY	ATM; SDH; SONET	YES	1	BIPOLAR	.1 mA	3.3 V	3.3	FLATPACK, LOW PROFILE	QFP32,.35SQ,32	ATM/SONET/SDH ICs	.8 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-PQFP-G32	1	1.6 mm	7 mm	Not Qualified	e0			7 mm
MAX3693ECJ	Maxim Integrated	ATM/SONET/SDH SERIAL TO PARALLEL/PARALLEL TO SERIAL CONVERTER	INDUSTRIAL	GULL WING	32	LQFP	SQUARE	PLASTIC/EPOXY	ATM; SDH; SONET	YES	1	BIPOLAR	.1 mA	3.3 V	3.3	FLATPACK, LOW PROFILE	QFP32,.35SQ,32	ATM/SONET/SDH ICs	.8 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-PQFP-G32	1	1.6 mm	7 mm	Not Qualified	e0			7 mm
MAX3690ECJ	Maxim Integrated	ATM/SONET/SDH SERIAL TO PARALLEL/PARALLEL TO SERIAL CONVERTER	INDUSTRIAL	GULL WING	32	LQFP	SQUARE	PLASTIC/EPOXY	ATM; SDH; SONET	YES	1	BIPOLAR	.1 mA	3.3 V	3.3	FLATPACK, LOW PROFILE	QFP32,.35SQ,32	ATM/SONET/SDH ICs	.8 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-PQFP-G32	1	1.6 mm	7 mm	Not Qualified	e0			7 mm
LG1605DXB-FLP	Broadcom	ATM/SONET/SDH SUPPORT CIRCUIT	COMMERCIAL	GULL WING	16	LQFP	SQUARE	CERAMIC, GLASS-SEALED		YES	1					FLATPACK, LOW PROFILE			.762 mm	70 Cel	0 Cel	TIN LEAD	QUAD	S-GQFP-G16		1.3716 mm	5.842 mm	Not Qualified	e0	30	240	5.842 mm
LG1605DXB-TR16	Broadcom	ATM/SONET/SDH SUPPORT CIRCUIT	COMMERCIAL	GULL WING	16	LQFP	SQUARE	CERAMIC, GLASS-SEALED		YES	1					FLATPACK, LOW PROFILE			.762 mm	70 Cel	0 Cel	TIN LEAD	QUAD	S-GQFP-G16		1.3716 mm	5.842 mm	Not Qualified	e0	30	240	5.842 mm

ATM/SONET/SDH Circuits

ATM (Asynchronous Transfer Mode), SONET (Synchronous Optical Network), and SDH (Synchronous Digital Hierarchy) circuits are high-speed communication technologies used in telecommunications networks.

ATM is a cell-based network technology that enables high-speed data transfer, video and voice communication. It divides data into fixed-size cells and sends them across the network using time-division multiplexing (TDM).

SONET and SDH are both standard protocols for optical telecommunications transport. They use synchronous timing signals to enable high-speed communication over fiber optic networks. SONET is used primarily in North America, while SDH is used primarily in Europe and other regions.

ATM, SONET, and SDH circuits offer several advantages over other communication technologies. They provide high-speed communication with low latency, allowing for efficient data transfer and real-time voice and video communication. They also provide a high level of reliability and fault tolerance, making them ideal for use in mission-critical applications such as banking, healthcare, and defense.

However, these circuits also require specialized hardware and software, and can be more expensive to implement and maintain than other communication technologies. They also require a high level of expertise to configure and manage.