TSSOP ATM/SONET/SDH Circuits 21

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Part RoHS Manufacturer Telecom IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material Applications Surface Mount No. of Functions No. of Channels Technology Nominal Negative Supply Voltage Maximum Supply Current Nominal Supply Voltage Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category Terminal Pitch Maximum Operating Temperature Minimum Operating Temperature Terminal Finish Terminal Position Data Rate JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length

MAX3665EUA

Maxim Integrated

ATM/SONET/SDH SUPPORT CIRCUIT

INDUSTRIAL

GULL WING

8

TSSOP

SQUARE

PLASTIC/EPOXY

SDH; SONET

YES

1

.03 mA

3.3 V

3.3

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP8,.19

Other Telecom ICs

.65 mm

85 Cel

-40 Cel

TIN LEAD

DUAL

S-PDSO-G8

1

1.1 mm

3 mm

Not Qualified

e0

3 mm

MAX3665EUA+

Analog Devices

ATM/SONET/SDH SUPPORT CIRCUIT

INDUSTRIAL

GULL WING

8

TSSOP

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.65 mm

85 Cel

-40 Cel

Matte Tin (Sn) - annealed

DUAL

S-PDSO-G8

1

1.1 mm

3 mm

Not Qualified

e3

30

260

3 mm

SY88993AVKG-TR

Microchip Technology

ATM/SONET/SDH SUPPORT CIRCUIT

INDUSTRIAL

GULL WING

10

TSSOP

SQUARE

PLASTIC/EPOXY

SDH; SONET

YES

1

65 mA

3.3 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP10,.19,20

.5 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

S-PDSO-G10

2

1.1 mm

3 mm

Not Qualified

e4

40

260

3 mm

MAX3747BEUB+

Analog Devices

ATM/SONET/SDH SUPPORT CIRCUIT

INDUSTRIAL

GULL WING

10

TSSOP

SQUARE

PLASTIC/EPOXY

YES

1

BIPOLAR

43 mA

3.3 V

3.3

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP10,.19,20

ATM/SONET/SDH ICs

.5 mm

85 Cel

-40 Cel

MATTE TIN

DUAL

S-PDSO-G10

1

1.1 mm

3 mm

Not Qualified

e3

30

260

3 mm

MAX3747BEUB+T

Analog Devices

INDUSTRIAL

GULL WING

10

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

BIPOLAR

43 mA

3.3 V

3.3

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP10,.19,20

ATM/SONET/SDH ICs

.5 mm

85 Cel

-40 Cel

MATTE TIN

DUAL

R-PDSO-G10

1

Not Qualified

e3

30

260

MAX3665EUA+T

Analog Devices

ATM/SONET/SDH SUPPORT CIRCUIT

INDUSTRIAL

GULL WING

8

TSSOP

SQUARE

PLASTIC/EPOXY

SDH; SONET

YES

1

3.3 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.65 mm

85 Cel

-40 Cel

MATTE TIN

DUAL

S-PDSO-G8

1

1.1 mm

3 mm

Not Qualified

e3

30

260

3 mm

MC10SX1127

Onsemi

INDUSTRIAL

GULL WING

16

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

ECL10K

-5.2 V

45 mA

-5.2

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP16,.25

ATM/SONET/SDH ICs

.635 mm

85 Cel

-40 Cel

Tin/Lead (Sn/Pb)

DUAL

R-PDSO-G16

Not Qualified

e0

STLVD112CTR

STMicroelectronics

ATM/SONET/SDH SUPPORT CIRCUIT

COMMERCIAL

GULL WING

48

TSSOP

RECTANGULAR

PLASTIC/EPOXY

SDH; SONET

YES

1

CMOS

3.3 V

3.3

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP48,.3,20

Other Telecom ICs

.5 mm

70 Cel

0 Cel

DUAL

R-PDSO-G48

1.2 mm

6.1 mm

Not Qualified

12.5 mm

STLVD112BTR

STMicroelectronics

ATM/SONET/SDH SUPPORT CIRCUIT

INDUSTRIAL

GULL WING

48

TSSOP

RECTANGULAR

PLASTIC/EPOXY

SDH; SONET

YES

1

CMOS

3.3 V

3.3

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP48,.3,20

Other Telecom ICs

.5 mm

85 Cel

-40 Cel

DUAL

R-PDSO-G48

1.2 mm

6.1 mm

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

12.5 mm

TZA3034TT-T

NXP Semiconductors

ATM/SONET/SDH SUPPORT CIRCUIT

INDUSTRIAL

GULL WING

16

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3.3 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.65 mm

85 Cel

-40 Cel

DUAL

R-PDSO-G16

1.1 mm

4.4 mm

Not Qualified

5 mm

TZA3034TT

NXP Semiconductors

ATM/SONET/SDH SUPPORT CIRCUIT

INDUSTRIAL

GULL WING

16

TSSOP

RECTANGULAR

PLASTIC/EPOXY

SDH; SONET

YES

1

ECL

.049 mA

3.3 V

3.3

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP16,.25

ATM/SONET/SDH ICs

.65 mm

85 Cel

-40 Cel

DUAL

R-PDSO-G16

1.1 mm

4.4 mm

Not Qualified

5 mm

FOA1251B1

Infineon Technologies

ATM/SONET/SDH SUPPORT CIRCUIT

OTHER

GULL WING

16

TSSOP

RECTANGULAR

PLASTIC/EPOXY

ATM; SDH; SONET

YES

1

BIPOLAR

41 mA

3.3 V

3.3

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP16,.25

Other Telecom ICs

.65 mm

105 Cel

-30 Cel

TIN LEAD

DUAL

R-PDSO-G16

1.2 mm

4.4 mm

Not Qualified

e0

5 mm

FOA1061A1

Infineon Technologies

ATM/SONET/SDH SUPPORT CIRCUIT

INDUSTRIAL

GULL WING

16

TSSOP

RECTANGULAR

PLASTIC/EPOXY

SDH; SONET

YES

1

BIPOLAR

.054 mA

5 V

5

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP16,.25

Other Telecom ICs

.65 mm

85 Cel

-40 Cel

Tin/Lead (Sn/Pb)

DUAL

R-PDSO-G16

1.2 mm

4.4 mm

Not Qualified

e0

5 mm

FOA1121A1

Infineon Technologies

ATM/SONET/SDH SUPPORT CIRCUIT

INDUSTRIAL

GULL WING

16

TSSOP

RECTANGULAR

PLASTIC/EPOXY

SONET

YES

1

BIPOLAR

.056 mA

5 V

5

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP16,.25

Other Telecom ICs

.65 mm

85 Cel

-40 Cel

TIN LEAD

DUAL

R-PDSO-G16

1.2 mm

4.4 mm

Not Qualified

e0

5 mm

FOA1251A1

Infineon Technologies

ATM/SONET/SDH SUPPORT CIRCUIT

INDUSTRIAL

GULL WING

16

TSSOP

RECTANGULAR

PLASTIC/EPOXY

ATM; SDH; SONET

YES

1

BIPOLAR

.057 mA

5 V

5

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP16,.25

Other Telecom ICs

.65 mm

85 Cel

-40 Cel

Tin/Lead (Sn/Pb)

DUAL

R-PDSO-G16

1.2 mm

4.4 mm

Not Qualified

e0

5 mm

PT7C4050LE

Diodes Incorporated

ATM/SONET/SDH CLOCK RECOVERY CIRCUIT

INDUSTRIAL

GULL WING

28

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

60 mA

3.3/5

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP28,.25

ATM/SONET/SDH ICs

.635 mm

85 Cel

-40 Cel

DUAL

R-PDSO-G28

Not Qualified

MAX3664EUA

Maxim Integrated

ATM/SONET/SDH SUPPORT CIRCUIT

INDUSTRIAL

GULL WING

8

TSSOP

SQUARE

PLASTIC/EPOXY

SDH; SONET

YES

1

.035 mA

3.3 V

3.3

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP8,.19

Other Telecom ICs

.65 mm

85 Cel

-40 Cel

TIN LEAD

DUAL

S-PDSO-G8

1

1.1 mm

3 mm

Not Qualified

e0

3 mm

MAX3665EUA-T

Maxim Integrated

ATM/SONET/SDH SUPPORT CIRCUIT

INDUSTRIAL

GULL WING

8

TSSOP

SQUARE

PLASTIC/EPOXY

SDH; SONET

YES

1

.03 mA

3.3 V

3.3

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP8,.19

Other Telecom ICs

.65 mm

85 Cel

-40 Cel

TIN LEAD

DUAL

S-PDSO-G8

1

1.1 mm

3 mm

Not Qualified

e0

3 mm

MAX3664EUA-T

Maxim Integrated

ATM/SONET/SDH SUPPORT CIRCUIT

INDUSTRIAL

GULL WING

8

TSSOP

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.65 mm

85 Cel

-40 Cel

TIN LEAD

DUAL

S-PDSO-G8

1

1.1 mm

3 mm

Not Qualified

e0

3 mm

894D115BGI-01LFT

Renesas Electronics

MULTI-PROTOCOL CLOCK AND DATA RECOVERY CIRCUIT

GULL WING

20

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

80 mA

3.3 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP20,.25

.65 mm

85 Cel

-40 Cel

TIN

DUAL

R-PDSO-G20

1

1.2 mm

4.4 mm

e3

260

6.5 mm

894D115BGI-01LF

Renesas Electronics

MULTI-PROTOCOL CLOCK AND DATA RECOVERY CIRCUIT

GULL WING

20

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

80 mA

3.3 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP20,.25

.65 mm

85 Cel

-40 Cel

TIN

DUAL

R-PDSO-G20

1

1.2 mm

4.4 mm

e3

260

6.5 mm

ATM/SONET/SDH Circuits

ATM (Asynchronous Transfer Mode), SONET (Synchronous Optical Network), and SDH (Synchronous Digital Hierarchy) circuits are high-speed communication technologies used in telecommunications networks.

ATM is a cell-based network technology that enables high-speed data transfer, video and voice communication. It divides data into fixed-size cells and sends them across the network using time-division multiplexing (TDM).

SONET and SDH are both standard protocols for optical telecommunications transport. They use synchronous timing signals to enable high-speed communication over fiber optic networks. SONET is used primarily in North America, while SDH is used primarily in Europe and other regions.

ATM, SONET, and SDH circuits offer several advantages over other communication technologies. They provide high-speed communication with low latency, allowing for efficient data transfer and real-time voice and video communication. They also provide a high level of reliability and fault tolerance, making them ideal for use in mission-critical applications such as banking, healthcare, and defense.

However, these circuits also require specialized hardware and software, and can be more expensive to implement and maintain than other communication technologies. They also require a high level of expertise to configure and manage.