Infineon Technologies - FOA1251B1

FOA1251B1 by Infineon Technologies

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Manufacturer Infineon Technologies
Manufacturer's Part Number FOA1251B1
Description ATM/SONET/SDH SUPPORT CIRCUIT; Temperature Grade: OTHER; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: TSSOP; Package Shape: RECTANGULAR;
Datasheet FOA1251B1 Datasheet
In Stock2
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 3.3 V
Maximum Seated Height: 1.2 mm
Sub-Category: Other Telecom ICs
Surface Mount: YES
Maximum Supply Current: 41 mA
Terminal Finish: TIN LEAD
No. of Terminals: 16
Terminal Position: DUAL
Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Technology: BIPOLAR
JESD-30 Code: R-PDSO-G16
Package Shape: RECTANGULAR
Terminal Form: GULL WING
Maximum Operating Temperature: 105 Cel
Package Code: TSSOP
Width: 4.4 mm
Telecom IC Type: ATM/SONET/SDH SUPPORT CIRCUIT
Applications: ATM; SDH; SONET
JESD-609 Code: e0
Minimum Operating Temperature: -30 Cel
No. of Functions: 1
Qualification: Not Qualified
Package Equivalence Code: TSSOP16,.25
Length: 5 mm
Terminal Pitch: .65 mm
Temperature Grade: OTHER
Power Supplies (V): 3.3
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