ATM/SONET/SDH NETWORK INTERFACE ATM/SONET/SDH Circuits 65

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Part RoHS Manufacturer Telecom IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material Applications Surface Mount No. of Functions No. of Channels Technology Nominal Negative Supply Voltage Maximum Supply Current Nominal Supply Voltage Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category Terminal Pitch Maximum Operating Temperature Minimum Operating Temperature Terminal Finish Terminal Position Data Rate JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length

LE88276DLCT

Microchip Technology

ATM/SONET/SDH NETWORK INTERFACE

INDUSTRIAL

GULL WING

80

HLQFP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

3.3 V

FLATPACK, HEAT SINK/SLUG, LOW PROFILE

QFP80,.6SQ

.65 mm

85 Cel

-40 Cel

QUAD

S-PQFP-G80

1.6 mm

14 mm

14 mm

ZL30108LDG1

Microchip Technology

ATM/SONET/SDH NETWORK INTERFACE

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

SDH; SONET

YES

1

43 mA

1.8 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.2SQ,20

.5 mm

85 Cel

-40 Cel

QUAD

S-XQCC-N32

1 mm

5 mm

5 mm

LE88276DLC

Microchip Technology

ATM/SONET/SDH NETWORK INTERFACE

INDUSTRIAL

GULL WING

80

HLQFP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

3.3 V

FLATPACK, HEAT SINK/SLUG, LOW PROFILE

QFP80,.6SQ

.65 mm

85 Cel

-40 Cel

QUAD

S-PQFP-G80

1.6 mm

14 mm

14 mm

DS3164DK

Analog Devices

ATM/SONET/SDH NETWORK INTERFACE

HMC706LC3C

Analog Devices

ATM/SONET/SDH NETWORK INTERFACE

INDUSTRIAL

NO LEAD

16

HQCCN

SQUARE

CERAMIC, METAL-SEALED COFIRED

YES

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG

.5 mm

85 Cel

-40 Cel

GOLD OVER NICKEL

QUAD

S-CQCC-N16

1.31 mm

3 mm

Not Qualified

e4

3 mm

AD6438-2

Analog Devices

ATM/SONET/SDH NETWORK INTERFACE

INDUSTRIAL

GULL WING

144

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

FLATPACK, LOW PROFILE, FINE PITCH

.5 mm

85 Cel

-40 Cel

QUAD

S-PQFP-G144

1.6 mm

20 mm

Not Qualified

20 mm

AD6438

Analog Devices

ATM/SONET/SDH NETWORK INTERFACE

INDUSTRIAL

GULL WING

144

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

FLATPACK, LOW PROFILE, FINE PITCH

.5 mm

85 Cel

-40 Cel

QUAD

S-PQFP-G144

1.6 mm

20 mm

Not Qualified

20 mm

HMC706LC3CTR

Analog Devices

ATM/SONET/SDH NETWORK INTERFACE

INDUSTRIAL

NO LEAD

16

QCCN

SQUARE

CERAMIC, METAL-SEALED COFIRED

YES

1

3.3 V

CHIP CARRIER

.5 mm

85 Cel

-40 Cel

QUAD

S-CQCC-N16

1.31 mm

3 mm

3 mm

DS3183N+

Analog Devices

ATM/SONET/SDH NETWORK INTERFACE

INDUSTRIAL

BALL

400

BGA

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

GRID ARRAY

1.27 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

S-PBGA-B400

2.54 mm

27 mm

Not Qualified

e1

27 mm

DS3163N+

Analog Devices

ATM/SONET/SDH NETWORK INTERFACE

INDUSTRIAL

BALL

400

BGA

SQUARE

PLASTIC/EPOXY

ATM; SDH; SONET

YES

1

.381 mA

3.3 V

3.3

GRID ARRAY

BGA400,20X20,50

ATM/SONET/SDH ICs

1.27 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

S-PBGA-B400

2.54 mm

27 mm

Not Qualified

e1

27 mm

DS3163+

Analog Devices

ATM/SONET/SDH NETWORK INTERFACE

COMMERCIAL

BALL

400

BGA

SQUARE

PLASTIC/EPOXY

ATM; SDH; SONET

YES

1

.381 mA

3.3 V

3.3

GRID ARRAY

BGA400,20X20,50

ATM/SONET/SDH ICs

1.27 mm

70 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

S-PBGA-B400

2.54 mm

27 mm

Not Qualified

e1

27 mm

DS3162N+

Analog Devices

ATM/SONET/SDH NETWORK INTERFACE

INDUSTRIAL

BALL

400

BGA

SQUARE

PLASTIC/EPOXY

ATM; SDH; SONET

YES

1

.3 mA

3.3 V

3.3

GRID ARRAY

BGA400,20X20,50

ATM/SONET/SDH ICs

1.27 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

S-PBGA-B400

2.54 mm

27 mm

Not Qualified

e1

27 mm

DS3161+

Analog Devices

ATM/SONET/SDH NETWORK INTERFACE

COMMERCIAL

BALL

400

BGA

SQUARE

PLASTIC/EPOXY

ATM; SDH; SONET

YES

1

.218 mA

3.3 V

3.3

GRID ARRAY

BGA400,20X20,50

ATM/SONET/SDH ICs

1.27 mm

70 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

S-PBGA-B400

2.54 mm

27 mm

Not Qualified

e1

27 mm

DS3162+

Analog Devices

ATM/SONET/SDH NETWORK INTERFACE

COMMERCIAL

BALL

400

BGA

SQUARE

PLASTIC/EPOXY

ATM; SDH; SONET

YES

1

.3 mA

3.3 V

3.3

GRID ARRAY

BGA400,20X20,50

ATM/SONET/SDH ICs

1.27 mm

70 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

S-PBGA-B400

2.54 mm

27 mm

Not Qualified

e1

27 mm

DS3161N+

Analog Devices

ATM/SONET/SDH NETWORK INTERFACE

INDUSTRIAL

BALL

400

BGA

SQUARE

PLASTIC/EPOXY

ATM; SDH; SONET

YES

1

.218 mA

3.3 V

3.3

GRID ARRAY

BGA400,20X20,50

ATM/SONET/SDH ICs

1.27 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

S-PBGA-B400

2.54 mm

27 mm

Not Qualified

e1

27 mm

DS3183+

Analog Devices

ATM/SONET/SDH NETWORK INTERFACE

COMMERCIAL

BALL

400

BGA

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

GRID ARRAY

1.27 mm

70 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

S-PBGA-B400

2.54 mm

27 mm

Not Qualified

e1

27 mm

DS3184DK

Analog Devices

ATM/SONET/SDH NETWORK INTERFACE

MC92500ZQ

NXP Semiconductors

ATM/SONET/SDH NETWORK INTERFACE

BALL

256

BGA

SQUARE

PLASTIC/EPOXY

ATM;SONET

YES

1

3.3 V

GRID ARRAY

BGA256,20X20,50

1.27 mm

70 Cel

0 Cel

BOTTOM

S-PBGA-B256

2.834 mm

27 mm

27 mm

DS3182N

Maxim Integrated

ATM/SONET/SDH NETWORK INTERFACE

INDUSTRIAL

BALL

400

BGA

SQUARE

PLASTIC/EPOXY

ATM; SDH; SONET

YES

1

.448 mA

3.3 V

3.3

GRID ARRAY

BGA400,20X20,50

ATM/SONET/SDH ICs

1.27 mm

85 Cel

-40 Cel

TIN LEAD

BOTTOM

S-PBGA-B400

2.54 mm

27 mm

Not Qualified

e0

27 mm

DS3163N

Maxim Integrated

ATM/SONET/SDH NETWORK INTERFACE

INDUSTRIAL

BALL

400

BGA

SQUARE

PLASTIC/EPOXY

ATM; SDH; SONET

YES

1

.381 mA

3.3 V

3.3

GRID ARRAY

BGA400,20X20,50

ATM/SONET/SDH ICs

1.27 mm

85 Cel

-40 Cel

TIN LEAD

BOTTOM

S-PBGA-B400

2.54 mm

27 mm

Not Qualified

e0

27 mm

DS3162

Maxim Integrated

ATM/SONET/SDH NETWORK INTERFACE

COMMERCIAL

BALL

400

BGA

SQUARE

PLASTIC/EPOXY

ATM; SDH; SONET

YES

1

.3 mA

3.3 V

3.3

GRID ARRAY

BGA400,20X20,50

ATM/SONET/SDH ICs

1.27 mm

70 Cel

0 Cel

TIN LEAD

BOTTOM

S-PBGA-B400

2.54 mm

27 mm

Not Qualified

e0

27 mm

DS26102

Maxim Integrated

ATM/SONET/SDH NETWORK INTERFACE

INDUSTRIAL

BALL

256

LBGA

SQUARE

PLASTIC/EPOXY

ATM

YES

1

3.3 V

GRID ARRAY, LOW PROFILE

1 mm

85 Cel

-40 Cel

TIN LEAD

BOTTOM

S-PBGA-B256

1.5 mm

17 mm

Not Qualified

e0

17 mm

DS3164N

Maxim Integrated

ATM/SONET/SDH NETWORK INTERFACE

INDUSTRIAL

BALL

400

BGA

SQUARE

PLASTIC/EPOXY

ATM; SDH; SONET

YES

1

.468 mA

3.3 V

3.3

GRID ARRAY

BGA400,20X20,50

ATM/SONET/SDH ICs

1.27 mm

85 Cel

-40 Cel

TIN LEAD

BOTTOM

S-PBGA-B400

2.54 mm

27 mm

Not Qualified

e0

27 mm

DS3183

Maxim Integrated

ATM/SONET/SDH NETWORK INTERFACE

COMMERCIAL

BALL

400

BGA

SQUARE

PLASTIC/EPOXY

ATM; SDH; SONET

YES

1

.61 mA

3.3 V

3.3

GRID ARRAY

BGA400,20X20,50

ATM/SONET/SDH ICs

1.27 mm

70 Cel

0 Cel

TIN LEAD

BOTTOM

S-PBGA-B400

2.54 mm

27 mm

Not Qualified

e0

27 mm

DS3161N

Maxim Integrated

ATM/SONET/SDH NETWORK INTERFACE

INDUSTRIAL

BALL

400

BGA

SQUARE

PLASTIC/EPOXY

ATM; SDH; SONET

YES

1

.218 mA

3.3 V

3.3

GRID ARRAY

BGA400,20X20,50

ATM/SONET/SDH ICs

1.27 mm

85 Cel

-40 Cel

TIN LEAD

BOTTOM

S-PBGA-B400

2.54 mm

27 mm

Not Qualified

e0

27 mm

DS3184

Maxim Integrated

ATM/SONET/SDH NETWORK INTERFACE

COMMERCIAL

BALL

400

BGA

SQUARE

PLASTIC/EPOXY

ATM; SDH; SONET

YES

1

.85 mA

3.3 V

3.3

GRID ARRAY

BGA400,20X20,50

ATM/SONET/SDH ICs

1.27 mm

70 Cel

0 Cel

TIN LEAD

BOTTOM

S-PBGA-B400

2.54 mm

27 mm

Not Qualified

e0

27 mm

DS3164+

Maxim Integrated

ATM/SONET/SDH NETWORK INTERFACE

COMMERCIAL

BALL

400

BGA

SQUARE

PLASTIC/EPOXY

ATM; SDH; SONET

YES

1

.468 mA

3.3 V

3.3

GRID ARRAY

BGA400,20X20,50

ATM/SONET/SDH ICs

1.27 mm

70 Cel

0 Cel

BOTTOM

S-PBGA-B400

3

2.54 mm

27 mm

Not Qualified

27 mm

DS26101N

Maxim Integrated

ATM/SONET/SDH NETWORK INTERFACE

INDUSTRIAL

BALL

256

LBGA

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

GRID ARRAY, LOW PROFILE

1 mm

85 Cel

-40 Cel

TIN LEAD

BOTTOM

S-PBGA-B256

1.5 mm

17 mm

Not Qualified

e0

17 mm

DS3181+

Maxim Integrated

ATM/SONET/SDH NETWORK INTERFACE

COMMERCIAL

BALL

400

BGA

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

GRID ARRAY

1.27 mm

70 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

S-PBGA-B400

3

2.54 mm

27 mm

Not Qualified

e1

27 mm

DS3183N

Maxim Integrated

ATM/SONET/SDH NETWORK INTERFACE

INDUSTRIAL

BALL

400

BGA

SQUARE

PLASTIC/EPOXY

ATM; SDH; SONET

YES

1

.61 mA

3.3 V

3.3

GRID ARRAY

BGA400,20X20,50

ATM/SONET/SDH ICs

1.27 mm

85 Cel

-40 Cel

TIN LEAD

BOTTOM

S-PBGA-B400

2.54 mm

27 mm

Not Qualified

e0

27 mm

DS3182N+

Maxim Integrated

ATM/SONET/SDH NETWORK INTERFACE

INDUSTRIAL

BALL

400

BGA

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

GRID ARRAY

1.27 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

S-PBGA-B400

3

2.54 mm

27 mm

Not Qualified

e1

27 mm

DS26101

Maxim Integrated

ATM/SONET/SDH NETWORK INTERFACE

INDUSTRIAL

BALL

256

LBGA

SQUARE

PLASTIC/EPOXY

ATM

YES

1

3.3 V

3.3

GRID ARRAY, LOW PROFILE

BGA256,16X16,40

ATM/SONET/SDH ICs

1 mm

85 Cel

-40 Cel

TIN LEAD

BOTTOM

S-PBGA-B256

1.5 mm

17 mm

Not Qualified

e0

17 mm

DS3162N

Maxim Integrated

ATM/SONET/SDH NETWORK INTERFACE

INDUSTRIAL

BALL

400

BGA

SQUARE

PLASTIC/EPOXY

ATM; SDH; SONET

YES

1

.3 mA

3.3 V

3.3

GRID ARRAY

BGA400,20X20,50

ATM/SONET/SDH ICs

1.27 mm

85 Cel

-40 Cel

TIN LEAD

BOTTOM

S-PBGA-B400

2.54 mm

27 mm

Not Qualified

e0

27 mm

DS3181N+

Maxim Integrated

ATM/SONET/SDH NETWORK INTERFACE

INDUSTRIAL

BALL

400

BGA

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

GRID ARRAY

1.27 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

S-PBGA-B400

3

2.54 mm

27 mm

Not Qualified

e1

27 mm

DS3181

Maxim Integrated

ATM/SONET/SDH NETWORK INTERFACE

COMMERCIAL

BALL

400

BGA

SQUARE

PLASTIC/EPOXY

ATM; SDH; SONET

YES

1

.28 mA

3.3 V

3.3

GRID ARRAY

BGA400,20X20,50

ATM/SONET/SDH ICs

1.27 mm

70 Cel

0 Cel

TIN LEAD

BOTTOM

S-PBGA-B400

2.54 mm

27 mm

Not Qualified

e0

27 mm

DS3161

Maxim Integrated

ATM/SONET/SDH NETWORK INTERFACE

COMMERCIAL

BALL

400

BGA

SQUARE

PLASTIC/EPOXY

ATM; SDH; SONET

YES

1

.218 mA

3.3 V

3.3

GRID ARRAY

BGA400,20X20,50

ATM/SONET/SDH ICs

1.27 mm

70 Cel

0 Cel

TIN LEAD

BOTTOM

S-PBGA-B400

2.54 mm

27 mm

Not Qualified

e0

27 mm

DS3164N+

Maxim Integrated

ATM/SONET/SDH NETWORK INTERFACE

INDUSTRIAL

BALL

400

BGA

SQUARE

PLASTIC/EPOXY

ATM; SDH; SONET

YES

1

.468 mA

3.3 V

3.3

GRID ARRAY

BGA400,20X20,50

ATM/SONET/SDH ICs

1.27 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

S-PBGA-B400

3

2.54 mm

27 mm

Not Qualified

e1

27 mm

DS3163

Maxim Integrated

ATM/SONET/SDH NETWORK INTERFACE

COMMERCIAL

BALL

400

BGA

SQUARE

PLASTIC/EPOXY

ATM; SDH; SONET

YES

1

.381 mA

3.3 V

3.3

GRID ARRAY

BGA400,20X20,50

ATM/SONET/SDH ICs

1.27 mm

70 Cel

0 Cel

TIN LEAD

BOTTOM

S-PBGA-B400

2.54 mm

27 mm

Not Qualified

e0

27 mm

DS3184+

Maxim Integrated

ATM/SONET/SDH NETWORK INTERFACE

COMMERCIAL

BALL

400

BGA

SQUARE

PLASTIC/EPOXY

ATM; SDH; SONET

YES

1

.85 mA

3.3 V

3.3

GRID ARRAY

BGA400,20X20,50

ATM/SONET/SDH ICs

1.27 mm

70 Cel

0 Cel

MATTE TIN

BOTTOM

S-PBGA-B400

3

2.54 mm

27 mm

Not Qualified

e3

27 mm

DS3184N

Maxim Integrated

ATM/SONET/SDH NETWORK INTERFACE

INDUSTRIAL

BALL

400

BGA

SQUARE

PLASTIC/EPOXY

ATM; SDH; SONET

YES

1

.85 mA

3.3 V

3.3

GRID ARRAY

BGA400,20X20,50

ATM/SONET/SDH ICs

1.27 mm

85 Cel

-40 Cel

TIN LEAD

BOTTOM

S-PBGA-B400

2.54 mm

27 mm

Not Qualified

e0

27 mm

DS3182

Maxim Integrated

ATM/SONET/SDH NETWORK INTERFACE

COMMERCIAL

BALL

400

BGA

SQUARE

PLASTIC/EPOXY

ATM; SDH; SONET

YES

1

.448 mA

3.3 V

3.3

GRID ARRAY

BGA400,20X20,50

ATM/SONET/SDH ICs

1.27 mm

70 Cel

0 Cel

TIN LEAD

BOTTOM

S-PBGA-B400

2.54 mm

27 mm

Not Qualified

e0

27 mm

DS3182+

Maxim Integrated

ATM/SONET/SDH NETWORK INTERFACE

COMMERCIAL

BALL

400

BGA

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

GRID ARRAY

1.27 mm

70 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

S-PBGA-B400

3

2.54 mm

27 mm

Not Qualified

e1

27 mm

DS3181N

Maxim Integrated

ATM/SONET/SDH NETWORK INTERFACE

INDUSTRIAL

BALL

400

BGA

SQUARE

PLASTIC/EPOXY

ATM; SDH; SONET

YES

1

.28 mA

3.3 V

3.3

GRID ARRAY

BGA400,20X20,50

ATM/SONET/SDH ICs

1.27 mm

85 Cel

-40 Cel

TIN LEAD

BOTTOM

S-PBGA-B400

2.54 mm

27 mm

Not Qualified

e0

27 mm

DS3184N+

Maxim Integrated

ATM/SONET/SDH NETWORK INTERFACE

INDUSTRIAL

BALL

400

BGA

SQUARE

PLASTIC/EPOXY

ATM; SDH; SONET

YES

1

.85 mA

3.3 V

3.3

GRID ARRAY

BGA400,20X20,50

ATM/SONET/SDH ICs

1.27 mm

85 Cel

-40 Cel

MATTE TIN

BOTTOM

S-PBGA-B400

3

2.54 mm

27 mm

Not Qualified

e3

27 mm

DS3164

Maxim Integrated

ATM/SONET/SDH NETWORK INTERFACE

COMMERCIAL

BALL

400

BGA

SQUARE

PLASTIC/EPOXY

ATM; SDH; SONET

YES

1

.468 mA

3.3 V

3.3

GRID ARRAY

BGA400,20X20,50

ATM/SONET/SDH ICs

1.27 mm

70 Cel

0 Cel

TIN LEAD

BOTTOM

S-PBGA-B400

2.54 mm

27 mm

Not Qualified

e0

27 mm

TC35821F

Toshiba

ATM/SONET/SDH NETWORK INTERFACE

COMMERCIAL

GULL WING

144

QFP

SQUARE

PLASTIC/EPOXY

ATM; SDH; SONET

YES

1

CMOS

5 V

FLATPACK

70 Cel

0 Cel

Tin/Lead (Sn/Pb)

QUAD

S-PQFP-G144

Not Qualified

e0

TC35823F

Toshiba

ATM/SONET/SDH NETWORK INTERFACE

COMMERCIAL

GULL WING

240

FQFP

SQUARE

PLASTIC/EPOXY

YES

4

CMOS

5 V

FLATPACK, FINE PITCH

.5 mm

70 Cel

0 Cel

QUAD

S-PQFP-G240

4.45 mm

32.2 mm

Not Qualified

32.2 mm

77010L155PQF

Renesas Electronics

ATM/SONET/SDH NETWORK INTERFACE

COMMERCIAL

GULL WING

80

LFQFP

SQUARE

PLASTIC/EPOXY

ATM

YES

1

CMOS

60 mA

5 V

3.3,5

FLATPACK, LOW PROFILE, FINE PITCH

QFP80,.55SQ,20

ATM/SONET/SDH ICs

.5 mm

70 Cel

0 Cel

TIN LEAD

QUAD

S-PQFP-G80

1.7 mm

12 mm

Not Qualified

e0

12 mm

ATM/SONET/SDH Circuits

ATM (Asynchronous Transfer Mode), SONET (Synchronous Optical Network), and SDH (Synchronous Digital Hierarchy) circuits are high-speed communication technologies used in telecommunications networks.

ATM is a cell-based network technology that enables high-speed data transfer, video and voice communication. It divides data into fixed-size cells and sends them across the network using time-division multiplexing (TDM).

SONET and SDH are both standard protocols for optical telecommunications transport. They use synchronous timing signals to enable high-speed communication over fiber optic networks. SONET is used primarily in North America, while SDH is used primarily in Europe and other regions.

ATM, SONET, and SDH circuits offer several advantages over other communication technologies. They provide high-speed communication with low latency, allowing for efficient data transfer and real-time voice and video communication. They also provide a high level of reliability and fault tolerance, making them ideal for use in mission-critical applications such as banking, healthcare, and defense.

However, these circuits also require specialized hardware and software, and can be more expensive to implement and maintain than other communication technologies. They also require a high level of expertise to configure and manage.