ATM/SONET/SDH NETWORK INTERFACE ATM/SONET/SDH Circuits 65

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Applications	Surface Mount	No. of Functions	Technology	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
IDT77V1254L25PG	Renesas Electronics	ATM/SONET/SDH NETWORK INTERFACE	COMMERCIAL	GULL WING	144	QFP	SQUARE	PLASTIC/EPOXY	ATM	YES	1	CMOS	.14 mA	3.3 V	3.3	FLATPACK	QFP144,1.2SQ	ATM/SONET/SDH ICs	.65 mm	70 Cel	0 Cel	TIN LEAD	QUAD	S-PQFP-G144		4.07 mm	28 mm	Not Qualified	e0			28 mm
IDT77V1254L25PUI	Renesas Electronics	ATM/SONET/SDH NETWORK INTERFACE	INDUSTRIAL	GULL WING	144	QFP	SQUARE	PLASTIC/EPOXY		YES	1	CMOS		3.3 V		FLATPACK			.65 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-PQFP-G144		4.07 mm	28 mm	Not Qualified	e0			28 mm
IDT77903	Renesas Electronics	ATM/SONET/SDH NETWORK INTERFACE		UNSPECIFIED	37		UNSPECIFIED	UNSPECIFIED		NO	1					MICROELECTRONIC ASSEMBLY						TIN LEAD	UNSPECIFIED	X-XXMA-X37				Not Qualified	e0
IDT77V126L200TF8	Renesas Electronics	ATM/SONET/SDH NETWORK INTERFACE	COMMERCIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY		YES	1	CMOS		3.3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	70 Cel	0 Cel	TIN LEAD	QUAD	S-PQFP-G64		1.6 mm	10 mm	Not Qualified	e0			10 mm
IDT77V1254L25PU	Renesas Electronics	ATM/SONET/SDH NETWORK INTERFACE	COMMERCIAL	GULL WING	144	QFP	SQUARE	PLASTIC/EPOXY		YES	1	CMOS		3.3 V		FLATPACK			.65 mm	70 Cel	0 Cel	TIN LEAD	QUAD	S-PQFP-G144		4.07 mm	28 mm	Not Qualified	e0			28 mm
IDT77V1254L25PG8	Renesas Electronics	ATM/SONET/SDH NETWORK INTERFACE	COMMERCIAL	GULL WING	144	QFP	SQUARE	PLASTIC/EPOXY		YES	1	CMOS		3.3 V		FLATPACK			.65 mm	70 Cel	0 Cel	TIN LEAD	QUAD	S-PQFP-G144		4.07 mm	28 mm	Not Qualified	e0			28 mm
IDT77101L25STQFP	Renesas Electronics	ATM/SONET/SDH NETWORK INTERFACE	COMMERCIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY		YES	1	CMOS		5 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	70 Cel	0 Cel	TIN LEAD	QUAD	S-PQFP-G64		1.6 mm	10 mm	Not Qualified	e0			10 mm
IDT77010PQF	Renesas Electronics	ATM/SONET/SDH NETWORK INTERFACE	COMMERCIAL	GULL WING	80	LFQFP	SQUARE	PLASTIC/EPOXY		YES	1			3.3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	70 Cel	0 Cel	TIN LEAD	QUAD	S-PQFP-G80		1.7 mm	12 mm	Not Qualified	e0			12 mm
UPD98408GD-LML	Renesas Electronics	ATM/SONET/SDH NETWORK INTERFACE	COMMERCIAL	GULL WING	208	FQFP	SQUARE	PLASTIC/EPOXY	ATM; SONET	YES	1	CMOS	280 mA	3.3 V	3.3	FLATPACK, FINE PITCH	QFP208,1.2SQ,20	ATM/SONET/SDH ICs	.5 mm	70 Cel	0 Cel	TIN LEAD	QUAD	S-PQFP-G208		3.8 mm	28 mm	Not Qualified	e0			28 mm
IDT77101L25TF8	Renesas Electronics	ATM/SONET/SDH NETWORK INTERFACE	COMMERCIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY		YES	1	CMOS		5 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	70 Cel	0 Cel	TIN LEAD	QUAD	S-PQFP-G64	3	1.6 mm	10 mm	Not Qualified	e0			10 mm
UPD98408GD-LML-A	Renesas Electronics	ATM/SONET/SDH NETWORK INTERFACE	INDUSTRIAL	GULL WING	208	FQFP	SQUARE	PLASTIC/EPOXY	ATM	YES	1	MOS	.28 mA	3.3 V	3.3	FLATPACK, FINE PITCH	QFP208,1.2SQ,20	ATM/SONET/SDH ICs	.5 mm	85 Cel	-40 Cel	TIN BISMUTH	QUAD	S-PQFP-G208	3	3.8 mm	28 mm	Not Qualified	e6	10	250	28 mm
IDT77V1253L25PG8	Renesas Electronics	ATM/SONET/SDH NETWORK INTERFACE	COMMERCIAL	GULL WING	144	QFP	SQUARE	PLASTIC/EPOXY		YES	1	CMOS		3.3 V		FLATPACK			.65 mm	70 Cel	0 Cel	TIN LEAD	QUAD	S-PQFP-G144		4.07 mm	28 mm	Not Qualified	e0			28 mm
LUC4AU01	Broadcom	ATM/SONET/SDH NETWORK INTERFACE		GULL WING	240	QFP	SQUARE	PLASTIC/EPOXY		YES	1	CMOS		3.3 V		FLATPACK						TIN LEAD	QUAD	S-PQFP-G240				Not Qualified	e0	NOT SPECIFIED	NOT SPECIFIED
T-8208---BAL2-DB	Broadcom	ATM/SONET/SDH NETWORK INTERFACE	INDUSTRIAL	BALL	272	BGA	SQUARE	PLASTIC/EPOXY		YES	1			3.3 V	3.3	GRID ARRAY	BGA272,20X20,50	ATM/SONET/SDH ICs	1.27 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B272		2.54 mm	27 mm	Not Qualified	e0	30	225	27 mm
T-8207---BAL-DT	Broadcom	ATM/SONET/SDH NETWORK INTERFACE	INDUSTRIAL	BALL	272	BGA	SQUARE	PLASTIC/EPOXY		YES	1			3.3 V		GRID ARRAY			1.27 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B272		2.54 mm	27 mm	Not Qualified	e0	30	225	27 mm
T-8207---BAL-DB	Broadcom	ATM/SONET/SDH NETWORK INTERFACE	INDUSTRIAL	BALL	272	BGA	SQUARE	PLASTIC/EPOXY		YES	1			3.3 V		GRID ARRAY			1.27 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B272		2.54 mm	27 mm	Not Qualified	e0	30	225	27 mm
T-8208---BAL2-DT	Broadcom	ATM/SONET/SDH NETWORK INTERFACE	INDUSTRIAL	BALL	272	BGA	SQUARE	PLASTIC/EPOXY		YES	1			3.3 V	3.3	GRID ARRAY	BGA272,20X20,50	ATM/SONET/SDH ICs	1.27 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B272		2.54 mm	27 mm	Not Qualified	e0	30	225	27 mm

ATM/SONET/SDH Circuits

ATM (Asynchronous Transfer Mode), SONET (Synchronous Optical Network), and SDH (Synchronous Digital Hierarchy) circuits are high-speed communication technologies used in telecommunications networks.

ATM is a cell-based network technology that enables high-speed data transfer, video and voice communication. It divides data into fixed-size cells and sends them across the network using time-division multiplexing (TDM).

SONET and SDH are both standard protocols for optical telecommunications transport. They use synchronous timing signals to enable high-speed communication over fiber optic networks. SONET is used primarily in North America, while SDH is used primarily in Europe and other regions.

ATM, SONET, and SDH circuits offer several advantages over other communication technologies. They provide high-speed communication with low latency, allowing for efficient data transfer and real-time voice and video communication. They also provide a high level of reliability and fault tolerance, making them ideal for use in mission-critical applications such as banking, healthcare, and defense.

However, these circuits also require specialized hardware and software, and can be more expensive to implement and maintain than other communication technologies. They also require a high level of expertise to configure and manage.