INDUSTRIAL ATM/SONET/SDH Circuits 1,013

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Applications	Surface Mount	No. of Functions	Technology	Nominal Negative Supply Voltage	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
DS3106LN+	Maxim Integrated	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	SDH; SONET	YES	1			.185 mA	1.8 V	1.8,3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-PQFP-G64	3	1.6 mm	10 mm	Not Qualified	e3	30	260	10 mm
DS3164N+	Maxim Integrated	ATM/SONET/SDH NETWORK INTERFACE	INDUSTRIAL	BALL	400	BGA	SQUARE	PLASTIC/EPOXY	ATM; SDH; SONET	YES	1			.468 mA	3.3 V	3.3	GRID ARRAY	BGA400,20X20,50	ATM/SONET/SDH ICs	1.27 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B400	3	2.54 mm	27 mm	Not Qualified	e1			27 mm
DS31408GN	Maxim Integrated	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY		YES	1				1.8 V		GRID ARRAY				85 Cel	-40 Cel		BOTTOM	S-PBGA-B256
MAX4175BDEUK	Maxim Integrated		INDUSTRIAL	GULL WING	5	TSOP	RECTANGULAR	PLASTIC/EPOXY		YES		BIPOLAR		.00053 mA		3/5	SMALL OUTLINE, THIN PROFILE	TSOP5/6,.11,37	ATM/SONET/SDH ICs	.95 mm	85 Cel	-40 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDSO-G5				Not Qualified	e0
MAX4174BKEUK	Maxim Integrated		INDUSTRIAL	GULL WING	5	TSOP	RECTANGULAR	PLASTIC/EPOXY		YES		BIPOLAR		.00051 mA		3/5	SMALL OUTLINE, THIN PROFILE	TSOP5/6,.11,37	ATM/SONET/SDH ICs	.95 mm	85 Cel	-40 Cel	Tin/Lead (Sn85Pb15)	DUAL	R-PDSO-G5	1			Not Qualified	e0
MAX4175BLEUK	Maxim Integrated		INDUSTRIAL	GULL WING	5	TSOP	RECTANGULAR	PLASTIC/EPOXY		YES		BIPOLAR		.00053 mA		3/5	SMALL OUTLINE, THIN PROFILE	TSOP5/6,.11,37	ATM/SONET/SDH ICs	.95 mm	85 Cel	-40 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDSO-G5				Not Qualified	e0
DS3102GN+	Maxim Integrated	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	BALL	81	LBGA	SQUARE	PLASTIC/EPOXY	SDH; SONET	YES	1			.192 mA	1.8 V	1.8,3.3	GRID ARRAY, LOW PROFILE	BGA81,9X9,40	Other Telecom ICs	1 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B81	3	1.48 mm	10 mm	Not Qualified				10 mm
MAX4174ALEUK	Maxim Integrated		INDUSTRIAL	GULL WING	5	TSOP	RECTANGULAR	PLASTIC/EPOXY		YES		BIPOLAR		.00051 mA		3/5	SMALL OUTLINE, THIN PROFILE	TSOP5/6,.11,37	ATM/SONET/SDH ICs	.95 mm	85 Cel	-40 Cel	Tin/Lead (Sn85Pb15)	DUAL	R-PDSO-G5	1			Not Qualified	e0
MAX4175BBEUK	Maxim Integrated		INDUSTRIAL	GULL WING	5	TSOP	RECTANGULAR	PLASTIC/EPOXY		YES		BIPOLAR		.00053 mA		3/5	SMALL OUTLINE, THIN PROFILE	TSOP5/6,.11,37	ATM/SONET/SDH ICs	.95 mm	85 Cel	-40 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDSO-G5				Not Qualified	e0
MAX4174BMEUK	Maxim Integrated		INDUSTRIAL	GULL WING	5	TSOP	RECTANGULAR	PLASTIC/EPOXY		YES		BIPOLAR		.00051 mA		3/5	SMALL OUTLINE, THIN PROFILE	TSOP5/6,.11,37	ATM/SONET/SDH ICs	.95 mm	85 Cel	-40 Cel	Tin/Lead (Sn85Pb15)	DUAL	R-PDSO-G5	1			Not Qualified	e0
DS3100GN+	Maxim Integrated	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	SDH; SONET	YES	1			.146 mA	1.8 V	1.8,3.3	GRID ARRAY	BGA256,16X16,40	Other Telecom ICs	1 mm	85 Cel	-40 Cel	MATTE TIN	BOTTOM	S-PBGA-B256	3	1.77 mm	17 mm	Not Qualified	e3			17 mm
MAX4174BGEUK	Maxim Integrated		INDUSTRIAL	GULL WING	5	TSOP	RECTANGULAR	PLASTIC/EPOXY		YES		BIPOLAR		.00051 mA		3/5	SMALL OUTLINE, THIN PROFILE	TSOP5/6,.11,37	ATM/SONET/SDH ICs	.95 mm	85 Cel	-40 Cel	Tin/Lead (Sn85Pb15)	DUAL	R-PDSO-G5	1			Not Qualified	e0
DS3184N	Maxim Integrated	ATM/SONET/SDH NETWORK INTERFACE	INDUSTRIAL	BALL	400	BGA	SQUARE	PLASTIC/EPOXY	ATM; SDH; SONET	YES	1			.85 mA	3.3 V	3.3	GRID ARRAY	BGA400,20X20,50	ATM/SONET/SDH ICs	1.27 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B400		2.54 mm	27 mm	Not Qualified	e0			27 mm
MAX4175BNEUK	Maxim Integrated		INDUSTRIAL	GULL WING	5	TSOP	RECTANGULAR	PLASTIC/EPOXY		YES		BIPOLAR		.00053 mA		3/5	SMALL OUTLINE, THIN PROFILE	TSOP5/6,.11,37	ATM/SONET/SDH ICs	.95 mm	85 Cel	-40 Cel	Tin/Lead (Sn85Pb15)	DUAL	R-PDSO-G5	1			Not Qualified	e0
MAX4175ALEUK	Maxim Integrated		INDUSTRIAL	GULL WING	5	TSOP	RECTANGULAR	PLASTIC/EPOXY		YES		BIPOLAR		.00053 mA		3/5	SMALL OUTLINE, THIN PROFILE	TSOP5/6,.11,37	ATM/SONET/SDH ICs	.95 mm	85 Cel	-40 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDSO-G5				Not Qualified	e0
MAX4174BAEUK	Maxim Integrated		INDUSTRIAL	GULL WING	5	TSOP	RECTANGULAR	PLASTIC/EPOXY		YES		BIPOLAR		.00051 mA		3/5	SMALL OUTLINE, THIN PROFILE	TSOP5/6,.11,37	ATM/SONET/SDH ICs	.95 mm	85 Cel	-40 Cel	Tin/Lead (Sn85Pb15)	DUAL	R-PDSO-G5	1			Not Qualified	e0
MAX4174BJEUK	Maxim Integrated		INDUSTRIAL	GULL WING	5	TSOP	RECTANGULAR	PLASTIC/EPOXY		YES		BIPOLAR		.00051 mA		3/5	SMALL OUTLINE, THIN PROFILE	TSOP5/6,.11,37	ATM/SONET/SDH ICs	.95 mm	85 Cel	-40 Cel	Tin/Lead (Sn85Pb15)	DUAL	R-PDSO-G5	1			Not Qualified	e0
DS3166N	Maxim Integrated	ATM/SONET/SDH TRANSCEIVER	INDUSTRIAL	BALL	676	BGA	SQUARE	PLASTIC/EPOXY	ATM; SDH; SONET	YES	1				1.8 V		GRID ARRAY			1 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B676		2.41 mm	27 mm	Not Qualified	e0			27 mm
DS31612N	Maxim Integrated	ATM/SONET/SDH TRANSCEIVER	INDUSTRIAL	BALL	676	BGA	SQUARE	PLASTIC/EPOXY	ATM; SDH; SONET	YES	1				1.8 V		GRID ARRAY			1 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B676		2.41 mm	27 mm	Not Qualified	e0			27 mm
78P2351-IGT/F	Maxim Integrated	ATM/SONET/SDH TRANSCEIVER	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	SDH	YES	1	CMOS		.212 mA	3.3 V	3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	Digital Transmission Interfaces	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-PQFP-G100	3	1.6 mm	14 mm	Not Qualified	e3	30	260	14 mm
DS3101GN	Maxim Integrated	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY	SDH; SONET	YES	1			.12 mA	1.8 V	1.8,3.3	GRID ARRAY, LOW PROFILE	BGA256,16X16,40	Other Telecom ICs	1 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B256		1.26 mm	17 mm	Not Qualified	e0			17 mm
MAX4174AOEUK	Maxim Integrated		INDUSTRIAL	GULL WING	5	TSOP	RECTANGULAR	PLASTIC/EPOXY		YES		BIPOLAR		.00051 mA		3/5	SMALL OUTLINE, THIN PROFILE	TSOP5/6,.11,37	ATM/SONET/SDH ICs	.95 mm	85 Cel	-40 Cel	Tin/Lead (Sn85Pb15)	DUAL	R-PDSO-G5	1			Not Qualified	e0
MAX4174AGEUK	Maxim Integrated		INDUSTRIAL	GULL WING	5	TSOP	RECTANGULAR	PLASTIC/EPOXY		YES		BIPOLAR		.00051 mA		3/5	SMALL OUTLINE, THIN PROFILE	TSOP5/6,.11,37	ATM/SONET/SDH ICs	.95 mm	85 Cel	-40 Cel	Tin/Lead (Sn85Pb15)	DUAL	R-PDSO-G5	1			Not Qualified	e0
DS3177N+	Maxim Integrated	ATM/SONET/SDH TRANSCEIVER	INDUSTRIAL	BALL	100	LBGA	SQUARE	PLASTIC/EPOXY		YES	1				3.3 V		GRID ARRAY, LOW PROFILE			1 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B100	3	1.5 mm	11 mm					11 mm
DS3181N	Maxim Integrated	ATM/SONET/SDH NETWORK INTERFACE	INDUSTRIAL	BALL	400	BGA	SQUARE	PLASTIC/EPOXY	ATM; SDH; SONET	YES	1			.28 mA	3.3 V	3.3	GRID ARRAY	BGA400,20X20,50	ATM/SONET/SDH ICs	1.27 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B400		2.54 mm	27 mm	Not Qualified	e0			27 mm
DS3184N+	Maxim Integrated	ATM/SONET/SDH NETWORK INTERFACE	INDUSTRIAL	BALL	400	BGA	SQUARE	PLASTIC/EPOXY	ATM; SDH; SONET	YES	1			.85 mA	3.3 V	3.3	GRID ARRAY	BGA400,20X20,50	ATM/SONET/SDH ICs	1.27 mm	85 Cel	-40 Cel	MATTE TIN	BOTTOM	S-PBGA-B400	3	2.54 mm	27 mm	Not Qualified	e3			27 mm
DS3100GN#	Maxim Integrated	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY		YES	1				1.8 V		GRID ARRAY			1 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B256		1.77 mm	17 mm	Not Qualified				17 mm
DS31408GN+	Maxim Integrated	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY		YES	1				1.8 V		GRID ARRAY				85 Cel	-40 Cel		BOTTOM	S-PBGA-B256						NOT SPECIFIED	NOT SPECIFIED
MAX4174AKEUK+	Maxim Integrated		INDUSTRIAL	GULL WING	5	TSOP	RECTANGULAR	PLASTIC/EPOXY		YES		BIPOLAR		.51 mA		3/5	SMALL OUTLINE, THIN PROFILE	TSOP5/6,.11,37	ATM/SONET/SDH ICs	.95 mm	85 Cel	-40 Cel	MATTE TIN	DUAL	R-PDSO-G5	1			Not Qualified	e3	30	260
DS3101GN+	Maxim Integrated	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY	SDH; SONET	YES	1			.12 mA	1.8 V	1.8,3.3	GRID ARRAY, LOW PROFILE	BGA256,16X16,40	Other Telecom ICs	1 mm	85 Cel	-40 Cel	MATTE TIN	BOTTOM	S-PBGA-B256	3	1.26 mm	17 mm	Not Qualified	e3			17 mm
MAX3881ECB-TD	Maxim Integrated	ATM/SONET/SDH CLOCK RECOVERY CIRCUIT	INDUSTRIAL	GULL WING	64	HTFQFP	SQUARE	PLASTIC/EPOXY		YES	1	BIPOLAR			3.3 V		FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-PQFP-G64	3	1.2 mm	10 mm	Not Qualified	e0			10 mm
MAX3272AEGP	Maxim Integrated	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	ATM; SDH; SONET	YES	1	BIPOLAR		.044 mA	3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC20,.16SQ,20	ATM/SONET/SDH ICs	.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-XQCC-N20	1	1 mm	4 mm	Not Qualified	e0			4 mm
MAX3876EHJ-T	Maxim Integrated	ATM/SONET/SDH CLOCK RECOVERY CIRCUIT	INDUSTRIAL	GULL WING	32	TFQFP	SQUARE	PLASTIC/EPOXY		YES	1				3.3 V		FLATPACK, THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-PQFP-G32	1	1.2 mm	5 mm	Not Qualified	e0			5 mm
MAX3872EGJ-T	Maxim Integrated	ATM/SONET/SDH CLOCK RECOVERY CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	SDH; SONET	YES	1	BIPOLAR		.215 mA	3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	ATM/SONET/SDH ICs	.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-XQCC-N32	1	1 mm	5 mm	Not Qualified	e0			5 mm
MAX3876E/D	Maxim Integrated	ATM/SONET/SDH CLOCK RECOVERY CIRCUIT	INDUSTRIAL	NO LEAD	33	DIE	RECTANGULAR	UNSPECIFIED		YES	1				3.3 V		UNCASED CHIP				85 Cel	-40 Cel	TIN LEAD	UPPER	R-XUUC-N33	1			Not Qualified	e0
MAX3886ETN+	Maxim Integrated	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	SONET	YES	1	BICMOS		310 mA	3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.31SQ,20	ATM/SONET/SDH ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-XQCC-N56	3	.8 mm	8 mm	Not Qualified	e3	30	260	8 mm
MAX3691ECJ	Maxim Integrated	ATM/SONET/SDH SERIAL TO PARALLEL/PARALLEL TO SERIAL CONVERTER	INDUSTRIAL	GULL WING	32	LQFP	SQUARE	PLASTIC/EPOXY	ATM; SDH; SONET	YES	1	BIPOLAR		100 mA	3.3 V	3.3	FLATPACK, LOW PROFILE	QFP32,.35SQ,32	ATM/SONET/SDH ICs	.8 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-PQFP-G32	1	1.6 mm	7 mm	Not Qualified	e0			7 mm
MAX3940E/D	Maxim Integrated	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	NO LEAD	44	DIE	RECTANGULAR	UNSPECIFIED	SDH; SONET	YES	1	BIPOLAR	-5.2 V				UNCASED CHIP				85 Cel	-40 Cel	TIN LEAD	UPPER	R-XUUC-N44	3			Not Qualified	e0
MAX3748HETE#G16	Maxim Integrated	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	ATM; SONET	YES	1	BIPOLAR		.049 mA	3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.12SQ,20	ATM/SONET/SDH ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-XQCC-N16	1	.8 mm	3 mm	Not Qualified	e3			3 mm
MAX3664EUA	Maxim Integrated	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	SDH; SONET	YES	1			.035 mA	3.3 V	3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.19	Other Telecom ICs	.65 mm	85 Cel	-40 Cel	TIN LEAD	DUAL	S-PDSO-G8	1	1.1 mm	3 mm	Not Qualified	e0			3 mm
MAX3874AEGJ	Maxim Integrated	ATM/SONET/SDH CLOCK RECOVERY CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	SDH; SONET	YES	1	BIPOLAR		.215 mA	3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	ATM/SONET/SDH ICs	.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-XQCC-N32	1	1 mm	5 mm	Not Qualified	e0		245	5 mm
MAX3762C/D	Maxim Integrated	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	NO LEAD	20	DIE	RECTANGULAR	UNSPECIFIED		YES	1				5 V		UNCASED CHIP				85 Cel	-40 Cel	TIN LEAD	UPPER	R-XUUC-N20				Not Qualified	e0
MAX3645EEE	Maxim Integrated	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	GULL WING	16	SSOP	RECTANGULAR	PLASTIC/EPOXY	SONET	YES	1	BIPOLAR		.027 mA	3.3 V	3.3/5	SMALL OUTLINE, SHRINK PITCH	SSOP16,.25	ATM/SONET/SDH ICs	.635 mm	85 Cel	-40 Cel	TIN LEAD	DUAL	R-PDSO-G16	1	1.75 mm	3.9 mm	Not Qualified	e0	20	240	4.9 mm
MAX3861E/D	Maxim Integrated	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	NO LEAD	32	DIE	SQUARE	UNSPECIFIED		YES	1	BIPOLAR			3.3 V		UNCASED CHIP				85 Cel	-40 Cel	TIN LEAD	UPPER	S-XUUC-N32				Not Qualified	e0
MAX3890ECB+D	Maxim Integrated	ATM/SONET/SDH SERIAL TO PARALLEL/PARALLEL TO SERIAL CONVERTER	INDUSTRIAL	GULL WING	64	HTFQFP	SQUARE	PLASTIC/EPOXY		YES	1				3.3 V		FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel	TIN	QUAD	S-PQFP-G64	3	1.2 mm	10 mm	Not Qualified	e3			10 mm
MAX3885ECB-TD	Maxim Integrated	ATM/SONET/SDH SERIAL TO PARALLEL/PARALLEL TO SERIAL CONVERTER	INDUSTRIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	SDH; SONET	YES	1			.28 mA	3.3 V	3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	ATM/SONET/SDH ICs	.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-PQFP-G64	3	1.6 mm	10 mm	Not Qualified	e0			10 mm
MAX3873EGP-T	Maxim Integrated	ATM/SONET/SDH CLOCK RECOVERY CIRCUIT	INDUSTRIAL	NO LEAD	20	VQCCN	SQUARE	CERAMIC, METAL-SEALED COFIRED		YES	1	BICMOS			3.3 V		CHIP CARRIER, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-CQCC-N20	1	1 mm	4 mm	Not Qualified	e0			4 mm
MAX3892EGH-D	Maxim Integrated	ATM/SONET/SDH SERIAL TO PARALLEL/PARALLEL TO SERIAL CONVERTER	INDUSTRIAL	NO LEAD	44	HVQCCN	SQUARE	UNSPECIFIED	SDH; SONET	YES	1	BIPOLAR		.19 mA	3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC44,.28SQ,20	ATM/SONET/SDH ICs	.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-XQCC-N44	1	.9 mm	7 mm	Not Qualified	e0			7 mm

ATM/SONET/SDH Circuits

ATM (Asynchronous Transfer Mode), SONET (Synchronous Optical Network), and SDH (Synchronous Digital Hierarchy) circuits are high-speed communication technologies used in telecommunications networks.

ATM is a cell-based network technology that enables high-speed data transfer, video and voice communication. It divides data into fixed-size cells and sends them across the network using time-division multiplexing (TDM).

SONET and SDH are both standard protocols for optical telecommunications transport. They use synchronous timing signals to enable high-speed communication over fiber optic networks. SONET is used primarily in North America, while SDH is used primarily in Europe and other regions.

ATM, SONET, and SDH circuits offer several advantages over other communication technologies. They provide high-speed communication with low latency, allowing for efficient data transfer and real-time voice and video communication. They also provide a high level of reliability and fault tolerance, making them ideal for use in mission-critical applications such as banking, healthcare, and defense.

However, these circuits also require specialized hardware and software, and can be more expensive to implement and maintain than other communication technologies. They also require a high level of expertise to configure and manage.