INDUSTRIAL ATM/SONET/SDH Circuits 1,013

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Applications	Surface Mount	No. of Functions	Technology	Nominal Negative Supply Voltage	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
MAX3873AETP+	Analog Devices	ATM/SONET/SDH CLOCK RECOVERY CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	SDH; SONET	YES	1	BICMOS		.142 mA	3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC20,.16SQ,20	ATM/SONET/SDH ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-XQCC-N20	1	1 mm	4 mm	Not Qualified	e3	30	260	4 mm
MAX3747AEUB+T	Analog Devices	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	NO LEAD	10	SON	SQUARE	PLASTIC/EPOXY	SONET	YES	1	BIPOLAR		.041 mA	3.3 V	3.3	SMALL OUTLINE	TSSOP10,.19,20	ATM/SONET/SDH ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	DUAL	S-PDSO-N10	1	.8 mm	3 mm	Not Qualified	e3	30	260	3 mm
MAX3964AETP+T	Analog Devices		INDUSTRIAL	NO LEAD	20	QCCN	SQUARE	PLASTIC/EPOXY		YES	1			.045 mA		3.3/5	CHIP CARRIER	LCC20,.16SQ,20	ATM/SONET/SDH ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-PQCC-N20	1			Not Qualified	e3	30	260
MAX3676EHJ+	Analog Devices	ATM/SONET/SDH CLOCK RECOVERY CIRCUIT	INDUSTRIAL	GULL WING	32	TFQFP	SQUARE	PLASTIC/EPOXY	ATM; SDH; SONET	YES	1	BIPOLAR		.111 mA	3.3 V	3.3/5	FLATPACK, THIN PROFILE, FINE PITCH	QFP32,.35SQ,32	ATM/SONET/SDH ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-PQFP-G32	1	1.2 mm	5 mm	Not Qualified	e3	30	260	5 mm
MAX3956ETJ+	Analog Devices	ATM/SONET/SDH SERIAL TO PARALLEL/PARALLEL TO SERIAL CONVERTER	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED		YES	1	BICMOS			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	95 Cel	-40 Cel	MATTE TIN	QUAD	S-XQCC-N32	1	.8 mm	5 mm		e3	30	260	5 mm
MAX3747BEUB+T	Analog Devices		INDUSTRIAL	GULL WING	10	TSSOP	RECTANGULAR	PLASTIC/EPOXY		YES	1	BIPOLAR		43 mA	3.3 V	3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP10,.19,20	ATM/SONET/SDH ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	DUAL	R-PDSO-G10	1			Not Qualified	e3	30	260
MAX3864E/D+C8R	Analog Devices	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	NO LEAD	7	DIE	RECTANGULAR	UNSPECIFIED		YES	1	BIPOLAR			3.3 V		UNCASED CHIP				85 Cel	-40 Cel		UPPER	R-XUUC-N7						NOT SPECIFIED	NOT SPECIFIED
MAX3665EUA+T	Analog Devices	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	SDH; SONET	YES	1				3.3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	MATTE TIN	DUAL	S-PDSO-G8	1	1.1 mm	3 mm	Not Qualified	e3	30	260	3 mm
MAX3840ETJ+T	Analog Devices	ATM/SONET/SDH SWITCHING CIRCUIT	INDUSTRIAL	NO LEAD	32	VQCCN	SQUARE	UNSPECIFIED	ATM; SDH; SONET	YES	1	BIPOLAR			3.3 V		CHIP CARRIER, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-XQCC-N32	1	.8 mm	5 mm	Not Qualified	e3	30	260	5 mm
MC10SX1125AD	Onsemi	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY		YES	1				5 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G16		1.75 mm	3.9 mm	Not Qualified				9.9 mm
MC10SX1125D	Onsemi	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	ATM; SDH; SONET	YES	1	ECL10K		.045 mA	5 V	5	SMALL OUTLINE	SOP16,.25	ATM/SONET/SDH ICs	1.27 mm	85 Cel	-40 Cel	TIN LEAD	DUAL	R-PDSO-G16		1.75 mm	3.9 mm	Not Qualified	e0		235	9.9 mm
MC10LVSX1125D	Onsemi		INDUSTRIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY		YES		ECL10K		45 mA	5 V	5	SMALL OUTLINE	SOP16,.25	ATM/SONET/SDH ICs	1.27 mm	85 Cel	-40 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDSO-G16				Not Qualified	e0
MC10SX1405FJR2	Onsemi	ATM/SONET/SDH SERIAL TO PARALLEL/PARALLEL TO SERIAL CONVERTER	INDUSTRIAL	J BEND	52	QCCJ	SQUARE	CERAMIC, GLASS-SEALED	ATM; SDH; SONET	YES	1	ECL10K			5 V	5	CHIP CARRIER	LDCC52,.8SQ	ATM/SONET/SDH ICs	1.27 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-GQCC-J52		5.08 mm	18.935 mm	Not Qualified	e0			18.935 mm
MC10SX1126D	Onsemi	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	ATM; SONET	YES	1	ECL		.045 mA	5 V	5	SMALL OUTLINE	SOP16,.25	ATM/SONET/SDH ICs	1.27 mm	85 Cel	-40 Cel	TIN LEAD	DUAL	R-PDSO-G16		1.75 mm	3.9 mm	Not Qualified	e0			9.9 mm
MC10SX1125DR2	Onsemi	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	ATM; SDH; SONET	YES	1	ECL10K		.045 mA	5 V	5	SMALL OUTLINE	SOP16,.25	ATM/SONET/SDH ICs	1.27 mm	85 Cel	-40 Cel	TIN LEAD	DUAL	R-PDSO-G16		1.75 mm	3.9 mm	Not Qualified	e0			9.9 mm
MC10SX1127D	Onsemi	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	ATM; SONET	YES	1	ECL10K	-5.2 V	.045 mA	5 V	-5.2	SMALL OUTLINE	SOP16,.25	ATM/SONET/SDH ICs	1.27 mm	85 Cel	-40 Cel	TIN LEAD	DUAL	R-PDSO-G16		1.75 mm	3.9 mm	Not Qualified	e0			9.9 mm
MC10SX1401FJ	Onsemi	ATM/SONET/SDH RECEIVER	INDUSTRIAL	J BEND	52	QCCJ	SQUARE	CERAMIC, GLASS-SEALED	ATM; SDH; SONET	YES	1	BIPOLAR			5 V	5	CHIP CARRIER	LDCC52,.8SQ	ATM/SONET/SDH ICs	1.27 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-GQCC-J52		5.08 mm	18.935 mm	Not Qualified	e0			18.935 mm
MC10SX1401FJR2	Onsemi		INDUSTRIAL	J BEND	52	QCCJ	SQUARE	CERAMIC		YES		ECL10K			5 V	5	CHIP CARRIER	LDCC52,.8SQ	ATM/SONET/SDH ICs	1.27 mm	85 Cel	-40 Cel	Tin/Lead (Sn/Pb)	QUAD	S-XQCC-J52				Not Qualified	e0
MC10SX1405FJ	Onsemi	ATM/SONET/SDH SERIAL TO PARALLEL/PARALLEL TO SERIAL CONVERTER	INDUSTRIAL	J BEND	52	QCCJ	SQUARE	CERAMIC, GLASS-SEALED	ATM; SDH; SONET	YES	1	ECL10K			5 V	5	CHIP CARRIER	LDCC52,.8SQ	ATM/SONET/SDH ICs	1.27 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-GQCC-J52		5.08 mm	18.935 mm	Not Qualified	e0			18.935 mm
MC10SX1125ADR2	Onsemi	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY		YES	1				5 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G16		1.75 mm	3.9 mm	Not Qualified				9.9 mm
MC10SX1127	Onsemi		INDUSTRIAL	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY		YES	1	ECL10K	-5.2 V	45 mA		-5.2	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP16,.25	ATM/SONET/SDH ICs	.635 mm	85 Cel	-40 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDSO-G16				Not Qualified	e0
STLVD112BTR	STMicroelectronics	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	GULL WING	48	TSSOP	RECTANGULAR	PLASTIC/EPOXY	SDH; SONET	YES	1	CMOS			3.3 V	3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP48,.3,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G48		1.2 mm	6.1 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	12.5 mm
TZA3014HT	NXP Semiconductors	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	GULL WING	32	HTFQFP	SQUARE	PLASTIC/EPOXY	SDH; SONET	YES	1				3.3 V		FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel		QUAD	S-PQFP-G32		1.2 mm	5 mm	Not Qualified				5 mm
TZA3004HL-T	NXP Semiconductors	ATM/SONET/SDH CLOCK RECOVERY CIRCUIT	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY		YES	1		-3.3 V				FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel		QUAD	S-PQFP-G48		1.6 mm	7 mm	Not Qualified				7 mm
OQ2538HP	NXP Semiconductors	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	SDH; SONET	YES	1	BIPOLAR	-4.5 V	80 mA		-4.5	FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	ATM/SONET/SDH ICs	.5 mm	85 Cel	-40 Cel		QUAD	S-PQFP-G48		1.6 mm	7 mm	Not Qualified				7 mm
OQ2538HPB-S	NXP Semiconductors	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY		YES	1		-4.5 V				FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel		QUAD	S-PQFP-G48		1.6 mm	7 mm	Not Qualified				7 mm
TZA3034TT-T	NXP Semiconductors	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY		YES	1				3.3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G16		1.1 mm	4.4 mm	Not Qualified				5 mm
TZA3012AHW	NXP Semiconductors	ATM/SONET/SDH RECEIVER	INDUSTRIAL	GULL WING	100	HTFQFP	SQUARE	PLASTIC/EPOXY	SDH; SONET	YES	1				3.3 V		FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel	TIN	QUAD	S-PQFP-G100		1.2 mm	14 mm	Not Qualified	e3			14 mm
935238950551	NXP Semiconductors	ATM/SONET/SDH CLOCK RECOVERY CIRCUIT	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY		YES	1		-3.3 V				FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel		QUAD	S-PQFP-G48		1.6 mm	7 mm	Not Qualified				7 mm
TZA3014U	NXP Semiconductors	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	NO LEAD	18	DIE	SQUARE	UNSPECIFIED		YES	1				3.3 V		UNCASED CHIP				85 Cel	-40 Cel		UPPER	S-XUUC-N18				Not Qualified
TZA3034U/C2	NXP Semiconductors	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	NO LEAD	32	DIE	SQUARE	UNSPECIFIED		YES	1				3.3 V		UNCASED CHIP				85 Cel	-40 Cel		UPPER	S-XUUC-N32				Not Qualified
935262358026	NXP Semiconductors	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	NO LEAD	36	DIE	SQUARE	UNSPECIFIED		YES	1		-4.5 V				UNCASED CHIP				85 Cel	-40 Cel		UPPER	S-XUUC-N36				Not Qualified
935262890118	NXP Semiconductors	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY		YES	1				3.3 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G16		1.75 mm	3.9 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	9.9 mm
TZA3014V	NXP Semiconductors	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	BUTT	32	HVBCC	SQUARE	PLASTIC/EPOXY		YES	1		-3.3 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		BOTTOM	S-PBCC-B32		.8 mm	5 mm	Not Qualified				5 mm
OQ2541HP/C3	NXP Semiconductors	ATM/SONET/SDH CLOCK RECOVERY CIRCUIT	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY		YES	1		-3.3 V				FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel		QUAD	S-PQFP-G48		1.6 mm	7 mm	Not Qualified				7 mm
TZA3014VH	NXP Semiconductors	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	BUTT	32	HVBCC	SQUARE	PLASTIC/EPOXY	SDH; SONET	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		BOTTOM	S-PBCC-B32		.8 mm	5 mm	Not Qualified				5 mm
TZA3034TD	NXP Semiconductors	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY		YES	1				3.3 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G16		1.75 mm	3.9 mm	Not Qualified				9.9 mm
TZA3052AHW	NXP Semiconductors	ATM/SONET/SDH RECEIVER	INDUSTRIAL	GULL WING	100	HTFQFP	SQUARE	PLASTIC/EPOXY	SDH; SONET	YES	1	CMOS		511 mA	3.3 V	3.3	FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH	TQFP100,.63SQ	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	TIN	QUAD	S-PQFP-G100		1.2 mm	14 mm	Not Qualified	e3			14 mm
935163100551	NXP Semiconductors	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY		YES	1		-4.5 V				FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel		QUAD	S-PQFP-G48		1.6 mm	7 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	7 mm
OQ2536HP	NXP Semiconductors	ATM/SONET/SDH MUX/DEMUX	INDUSTRIAL	GULL WING	100	HLFQFP	SQUARE	PLASTIC/EPOXY	SDH; SONET	YES	1	BICMOS	-4.5 V	.525 mA	1.5 V	3.3,5,-4.5	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	ATM/SONET/SDH ICs	.5 mm	85 Cel	-40 Cel		QUAD	S-PQFP-G100	1	1.6 mm	14 mm	Not Qualified				14 mm
OQ2541HPB-S	NXP Semiconductors	ATM/SONET/SDH CLOCK RECOVERY CIRCUIT	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY		YES	1		-3.3 V				FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel		QUAD	S-PQFP-G48		1.6 mm	7 mm	Not Qualified				7 mm
TZA3019AVH	NXP Semiconductors	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	BUTT	32	HVBCC	SQUARE	PLASTIC/EPOXY	SDH; SONET	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		BOTTOM	S-PBCC-B32		.8 mm	5 mm	Not Qualified				5 mm
OQ2538HP-T	NXP Semiconductors	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY		YES	1		-4.5 V	80 mA			FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel		QUAD	S-PQFP-G48		1.6 mm	7 mm	Not Qualified				7 mm
TZA3005H-T	NXP Semiconductors	ATM/SONET/SDH TRANSCEIVER	INDUSTRIAL	GULL WING	64	QFP	SQUARE	PLASTIC/EPOXY		YES	1				3.3 V		FLATPACK			.8 mm	85 Cel	-40 Cel		QUAD	S-PQFP-G64		3 mm	14 mm	Not Qualified				14 mm
935198040551	NXP Semiconductors	ATM/SONET/SDH CLOCK RECOVERY CIRCUIT	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY		YES	1		-3.3 V				FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel		QUAD	S-PQFP-G48		1.6 mm	7 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	7 mm
TZA3019CVH	NXP Semiconductors	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	BUTT	32	HVBCC	SQUARE	PLASTIC/EPOXY	SDH; SONET	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		BOTTOM	S-PBCC-B32		.8 mm	5 mm	Not Qualified				5 mm
TZA3057HW	NXP Semiconductors	ATM/SONET/SDH TRANSMITTER	INDUSTRIAL	GULL WING	100	HTFQFP	SQUARE	PLASTIC/EPOXY	SDH; SONET	YES	1	CMOS		318 mA	3.3 V	3.3	FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH	TQFP100,.63SQ	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	TIN	QUAD	S-PQFP-G100		1.2 mm	14 mm	Not Qualified	e3			14 mm
TZA3019BHT	NXP Semiconductors	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	GULL WING	32	HTFQFP	SQUARE	PLASTIC/EPOXY	SDH; SONET	YES	1				3.3 V		FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel		QUAD	S-PQFP-G32		1.2 mm	5 mm	Not Qualified				5 mm

ATM/SONET/SDH Circuits

ATM (Asynchronous Transfer Mode), SONET (Synchronous Optical Network), and SDH (Synchronous Digital Hierarchy) circuits are high-speed communication technologies used in telecommunications networks.

ATM is a cell-based network technology that enables high-speed data transfer, video and voice communication. It divides data into fixed-size cells and sends them across the network using time-division multiplexing (TDM).

SONET and SDH are both standard protocols for optical telecommunications transport. They use synchronous timing signals to enable high-speed communication over fiber optic networks. SONET is used primarily in North America, while SDH is used primarily in Europe and other regions.

ATM, SONET, and SDH circuits offer several advantages over other communication technologies. They provide high-speed communication with low latency, allowing for efficient data transfer and real-time voice and video communication. They also provide a high level of reliability and fault tolerance, making them ideal for use in mission-critical applications such as banking, healthcare, and defense.

However, these circuits also require specialized hardware and software, and can be more expensive to implement and maintain than other communication technologies. They also require a high level of expertise to configure and manage.