OTHER ATM/SONET/SDH Circuits 66

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Applications	Surface Mount	No. of Functions	Technology	Nominal Negative Supply Voltage	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
TTRN0110G	Broadcom	ATM/SONET/SDH SUPPORT CIRCUIT	OTHER	BALL	198	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED		YES	1				3.3 V		GRID ARRAY			1 mm	85 Cel	0 Cel	TIN LEAD	BOTTOM	S-CBGA-B198	1.961 mm	15 mm	Not Qualified	e0	30	240	15 mm
TMOD0110G5YP1	Broadcom	ATM/SONET/SDH SUPPORT CIRCUIT	OTHER	NO LEAD	28	HVQCCN	SQUARE	PLASTIC/EPOXY		YES	1		-5.2 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	0 Cel	TIN LEAD	QUAD	S-PQCC-N28	1 mm	5 mm	Not Qualified	e0	30	240	5 mm
LG1628AXA	Broadcom	ATM/SONET/SDH SUPPORT CIRCUIT	OTHER	NO LEAD	21	DIE	SQUARE	UNSPECIFIED		YES	1		-5.2 V				UNCASED CHIP				85 Cel	0 Cel	TIN LEAD	UPPER	S-XUUC-N21			Not Qualified	e0	30	240
TRCV0111G2	Broadcom	ATM/SONET/SDH SUPPORT CIRCUIT	OTHER	BALL	177	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED		YES	1				3.3 V		GRID ARRAY			1 mm	85 Cel	0 Cel	TIN LEAD	BOTTOM	S-CBGA-B177	1.961 mm	14 mm	Not Qualified	e0	30	240	14 mm
HFBR-5805AT	Broadcom	ATM/SONET/SDH TRANSCEIVER	OTHER	UNSPECIFIED	9		RECTANGULAR	UNSPECIFIED	ATM; SDH; SONET	NO	1				3.3 V		FIBER OPTIC				85 Cel	-10 Cel		UNSPECIFIED	R-XXFO-X9			Not Qualified		NOT SPECIFIED	NOT SPECIFIED
TRCV0111G	Broadcom	ATM/SONET/SDH SUPPORT CIRCUIT	OTHER	BALL	177	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED		YES	1				3.3 V		GRID ARRAY			1 mm	85 Cel	0 Cel	TIN LEAD	BOTTOM	S-CBGA-B177	1.885 mm	14 mm	Not Qualified	e0	30	225	14 mm
TRCV0111G2-3-XE-DB	Broadcom	ATM/SONET/SDH SUPPORT CIRCUIT	OTHER	BALL	177	BGA	SQUARE	PLASTIC/EPOXY		YES	1				3.3 V		GRID ARRAY			1 mm	85 Cel	0 Cel	TIN LEAD	BOTTOM	S-PBGA-B177	1.74 mm	14 mm	Not Qualified	e0	30	240	14 mm
TRCV0110G-3-XE	Broadcom	ATM/SONET/SDH SUPPORT CIRCUIT	OTHER	BALL	177	BGA	SQUARE	PLASTIC/EPOXY		YES	1				3.3 V		GRID ARRAY			1 mm	85 Cel	0 Cel	TIN LEAD	BOTTOM	S-PBGA-B177	1.74 mm	14 mm	Not Qualified	e0	30	240	14 mm
TRCV0110G2	Broadcom	ATM/SONET/SDH SUPPORT CIRCUIT	OTHER	BALL	177	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED		YES	1				3.3 V		GRID ARRAY			1 mm	85 Cel	0 Cel	TIN LEAD	BOTTOM	S-CBGA-B177	1.961 mm	14 mm	Not Qualified	e0	30	240	14 mm
HFBR-5805A	Broadcom	ATM/SONET/SDH TRANSCEIVER	OTHER	UNSPECIFIED	9		RECTANGULAR	UNSPECIFIED	ATM; SDH; SONET	NO	1				3.3 V		FIBER OPTIC				85 Cel	-10 Cel		UNSPECIFIED	R-XXFO-X9			Not Qualified		NOT SPECIFIED	NOT SPECIFIED
NQ93C95	Broadcom	ATM/SONET/SDH TRANSCEIVER	OTHER	J BEND	28	QCCJ		PLASTIC/EPOXY		YES		CMOS		300 mA	5 V	5	CHIP CARRIER	LDCC28(UNSPEC)	ATM/SONET/SDH ICs		85 Cel	-25 Cel	Tin/Lead (Sn/Pb)	QUAD				Not Qualified	e0
HDMP-3001	Broadcom	ATM/SONET/SDH SUPPORT CIRCUIT	OTHER	GULL WING	160	QFP	SQUARE	PLASTIC/EPOXY	SDH; SONET	YES	1	CMOS			1.8 V		FLATPACK			.65 mm	85 Cel	0 Cel		QUAD	S-PQFP-G160	4.1 mm	28 mm	Not Qualified				28 mm
TLMA0110G5XE4	Broadcom	ATM/SONET/SDH SUPPORT CIRCUIT	OTHER	GULL WING	24	HQFP	RECTANGULAR	PLASTIC/EPOXY		YES	1		-5.2 V				FLATPACK, HEAT SINK/SLUG			.8 mm	85 Cel	0 Cel	TIN LEAD	QUAD	R-PQFP-G24		6.9596 mm	Not Qualified	e0	30	240	8.4328 mm
AGRBS1G25	Broadcom	ATM/SONET/SDH CLOCK RECOVERY CIRCUIT	OTHER	GULL WING	48	TFQFP	SQUARE	PLASTIC/EPOXY		YES	1				3.3 V		FLATPACK, THIN PROFILE, FINE PITCH			.5 mm	80 Cel	-40 Cel	TIN LEAD	QUAD	S-PQFP-G48	1.2 mm	7 mm	Not Qualified	e0	NOT SPECIFIED	NOT SPECIFIED	7 mm
TRCV0110G	Broadcom	ATM/SONET/SDH SUPPORT CIRCUIT	OTHER	BALL	177	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED		YES	1				3.3 V		GRID ARRAY			1 mm	85 Cel	0 Cel	TIN LEAD	BOTTOM	S-CBGA-B177	1.961 mm	14 mm	Not Qualified	e0	30	240	14 mm
TRCV0111G-3-XE-DB	Broadcom	ATM/SONET/SDH SUPPORT CIRCUIT	OTHER	BALL	177	BGA	SQUARE	PLASTIC/EPOXY		YES	1				3.3 V		GRID ARRAY			1 mm	85 Cel	0 Cel	TIN LEAD	BOTTOM	S-PBGA-B177	1.74 mm	14 mm	Not Qualified	e0	30	240	14 mm
KA8312	Samsung		OTHER		12			PLASTIC/EPOXY		NO		BIPOLAR		.004 mA	5 V	5		SIP12,.1	ATM/SONET/SDH ICs	2.54 mm	70 Cel	-25 Cel	Tin/Lead (Sn/Pb)	SINGLE				Not Qualified	e0
KA8302S	Samsung		OTHER		12			PLASTIC/EPOXY		NO	2	BIPOLAR		4 mA	5 V	5		SIP12,.1	ATM/SONET/SDH ICs	2.54 mm	70 Cel	-25 Cel		SINGLE				Not Qualified

ATM/SONET/SDH Circuits

ATM (Asynchronous Transfer Mode), SONET (Synchronous Optical Network), and SDH (Synchronous Digital Hierarchy) circuits are high-speed communication technologies used in telecommunications networks.

ATM is a cell-based network technology that enables high-speed data transfer, video and voice communication. It divides data into fixed-size cells and sends them across the network using time-division multiplexing (TDM).

SONET and SDH are both standard protocols for optical telecommunications transport. They use synchronous timing signals to enable high-speed communication over fiber optic networks. SONET is used primarily in North America, while SDH is used primarily in Europe and other regions.

ATM, SONET, and SDH circuits offer several advantages over other communication technologies. They provide high-speed communication with low latency, allowing for efficient data transfer and real-time voice and video communication. They also provide a high level of reliability and fault tolerance, making them ideal for use in mission-critical applications such as banking, healthcare, and defense.

However, these circuits also require specialized hardware and software, and can be more expensive to implement and maintain than other communication technologies. They also require a high level of expertise to configure and manage.