OTHER ATM/SONET/SDH Circuits 66

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Applications	Surface Mount	No. of Functions	Technology	Nominal Negative Supply Voltage	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
SI5100-H-GL	Silicon Labs	ATM/SONET/SDH TRANSCEIVER	OTHER	BALL	195	LBGA	SQUARE	PLASTIC/EPOXY	SDH; SONET	YES	1			830 mA	1.8 V	1.8	GRID ARRAY, LOW PROFILE	BGA195,14X14,40	ATM/SONET/SDH ICs	1 mm	85 Cel	-20 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B195		1.56 mm	15 mm	Not Qualified	e1			15 mm
VSC8479YYY	Microchip Technology	ATM/SONET/SDH TRANSCEIVER	OTHER	BALL	244	BGA	SQUARE	PLASTIC/EPOXY		YES	1	CMOS			1.8 V		GRID ARRAY	BGA244(UNSPEC)			90 Cel	-5 Cel		BOTTOM	S-PBGA-B244
ONET1101LRGER	Texas Instruments	ATM/SONET/SDH SUPPORT CIRCUIT	OTHER	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	SDH; SONET	YES	1			118 mA	3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20		.5 mm	100 Cel	-25 Cel	NICKEL PALLADIUM GOLD	QUAD	S-PQCC-N24	2	1 mm	4 mm	Not Qualified	e4	30	260	4 mm
ONET1101LRGETG4	Texas Instruments	ATM/SONET/SDH SUPPORT CIRCUIT	OTHER	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	SDH; SONET	YES	1			118 mA	3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20		.5 mm	100 Cel	-25 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD	S-PQCC-N24	2	1 mm	4 mm	Not Qualified	e4	NOT SPECIFIED	260	4 mm
ONET1101LRGET	Texas Instruments	ATM/SONET/SDH SUPPORT CIRCUIT	OTHER	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	SDH; SONET	YES	1			118 mA	3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20		.5 mm	100 Cel	-25 Cel	NICKEL PALLADIUM GOLD	QUAD	S-PQCC-N24	2	1 mm	4 mm	Not Qualified	e4	30	260	4 mm
ONET9901PARGT	Texas Instruments	ATM/SONET/SDH SUPPORT CIRCUIT	OTHER	NO LEAD	16	QCCN	SQUARE	UNSPECIFIED	SDH; SONET	YES	1				3.3 V	3.3	CHIP CARRIER	LCC16,.12SQ,20	ATM/SONET/SDH ICs	.5 mm	85 Cel	0 Cel		QUAD	S-XQCC-N16				Not Qualified
ONET9901PARGPG4	Texas Instruments	ATM/SONET/SDH SUPPORT CIRCUIT	OTHER	NO LEAD	20	HVQCCN	SQUARE	PLASTIC/EPOXY	SDH; SONET	YES	1			.055 mA	3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC20,.16SQ,20	ATM/SONET/SDH ICs	.5 mm	85 Cel	0 Cel		QUAD	S-PQCC-N20		1 mm	4 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	4 mm
ONET9901PARGP	Texas Instruments	ATM/SONET/SDH SUPPORT CIRCUIT	OTHER	NO LEAD	20	HVQCCN	SQUARE	PLASTIC/EPOXY	SDH; SONET	YES	1				3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC20,.16SQ,20	ATM/SONET/SDH ICs	.5 mm	85 Cel	0 Cel		QUAD	S-PQCC-N20		1 mm	4 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	4 mm
ONET8511TY	Texas Instruments	ATM/SONET/SDH SUPPORT CIRCUIT	OTHER	NO LEAD	18	DIE	RECTANGULAR	UNSPECIFIED	SONET	YES	1			.07 mA	3.3 V	3.3	UNCASED CHIP	DIE OR CHIP	Other Telecom ICs		85 Cel	-25 Cel		UPPER	R-XUUC-N18				Not Qualified		NOT SPECIFIED	NOT SPECIFIED
HMC-C062	Analog Devices	ATM/SONET/SDH SUPPORT CIRCUIT	OTHER	UNSPECIFIED			RECTANGULAR	UNSPECIFIED		NO	1		-3.3 V				MICROELECTRONIC ASSEMBLY				70 Cel	-40 Cel	GOLD OVER NICKEL	UNSPECIFIED	R-XXMA-X				Not Qualified	e4
HMC-C065	Analog Devices	ATM/SONET/SDH SUPPORT CIRCUIT	OTHER	UNSPECIFIED	10		RECTANGULAR	UNSPECIFIED		NO	1		-3.3 V				MICROELECTRONIC ASSEMBLY				70 Cel	-40 Cel	GOLD OVER NICKEL	QUAD	R-XQMA-X10				Not Qualified	e4
AD6411ASTRL	Analog Devices	ATM/SONET/SDH TRANSCEIVER	OTHER	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY		YES	1			.075 mA	5 V	3.3/5	FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	Other Telecom ICs	.5 mm	85 Cel	-25 Cel	TIN LEAD	QUAD	S-PQFP-G48		1.6 mm	7 mm	Not Qualified	e0			7 mm
HMC-C060	Analog Devices	ATM/SONET/SDH SUPPORT CIRCUIT	OTHER	UNSPECIFIED	10		RECTANGULAR	UNSPECIFIED		NO	1		-3.3 V				MICROELECTRONIC ASSEMBLY				70 Cel	-40 Cel	GOLD OVER NICKEL	QUAD	R-XQMA-X10				Not Qualified	e4
HMC-C064	Analog Devices	ATM/SONET/SDH SUPPORT CIRCUIT	OTHER	UNSPECIFIED	10		RECTANGULAR	UNSPECIFIED		NO	1		-3.3 V				MICROELECTRONIC ASSEMBLY				70 Cel	-40 Cel	GOLD OVER NICKEL	QUAD	R-XQMA-X10				Not Qualified	e4
HMC-C061	Analog Devices	ATM/SONET/SDH SUPPORT CIRCUIT	OTHER	UNSPECIFIED	10		RECTANGULAR	UNSPECIFIED		NO	1		-3.3 V				MICROELECTRONIC ASSEMBLY				70 Cel	-40 Cel	GOLD OVER NICKEL	QUAD	R-XQMA-X10				Not Qualified	e4
AD6411AST	Analog Devices	ATM/SONET/SDH TRANSCEIVER	OTHER	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY		YES	1			.075 mA	5 V	3.3/5	FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	Other Telecom ICs	.5 mm	85 Cel	-25 Cel		QUAD	S-PQFP-G48		1.6 mm	7 mm	Not Qualified				7 mm
ADN2901XXX	Analog Devices	ATM/SONET/SDH TRANSCEIVER	OTHER	BALL	186	BGA	SQUARE	PLASTIC/EPOXY	ATM; SDH; SONET	YES	1	BIPOLAR			3.3 V	3.3	GRID ARRAY	BGA186,16X16,40	ATM/SONET/SDH ICs	1 mm	85 Cel	0 Cel	TIN LEAD	BOTTOM	S-PBGA-B186		2.06 mm	17 mm	Not Qualified	e0			17 mm
ADN2902XXX	Analog Devices	ATM/SONET/SDH TRANSCEIVER	OTHER	BALL	186	BGA	SQUARE	PLASTIC/EPOXY	ATM; SDH; SONET	YES	1				3.3 V	3.3	GRID ARRAY	BGA186,16X16,40	ATM/SONET/SDH ICs	1 mm	85 Cel	0 Cel	TIN LEAD	BOTTOM	S-PBGA-B186		2.06 mm	17 mm	Not Qualified	e0			17 mm
OQ2541BHP	NXP Semiconductors	ATM/SONET/SDH CLOCK RECOVERY CIRCUIT	OTHER	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	SDH; SONET	YES	1	BIPOLAR	-3.35 V	.16 mA		-4.5	FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	ATM/SONET/SDH ICs	.5 mm	85 Cel	-10 Cel		QUAD	S-PQFP-G48		1.6 mm	7 mm	Not Qualified				7 mm
OQ2541BU	NXP Semiconductors	ATM/SONET/SDH CLOCK RECOVERY CIRCUIT	OTHER	NO LEAD	48	DIE	SQUARE	UNSPECIFIED		YES	1		-3.35 V				UNCASED CHIP				85 Cel	-10 Cel		UPPER	S-XUUC-N48				Not Qualified
FOA1252B1	Infineon Technologies	ATM/SONET/SDH SUPPORT CIRCUIT	OTHER	NO LEAD	25	DIE	RECTANGULAR	UNSPECIFIED		YES	1	BIPOLAR			3.3 V		UNCASED CHIP				105 Cel	-30 Cel		UPPER	R-XUUC-N25				Not Qualified
FOA1251B1	Infineon Technologies	ATM/SONET/SDH SUPPORT CIRCUIT	OTHER	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	ATM; SDH; SONET	YES	1	BIPOLAR		41 mA	3.3 V	3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP16,.25	Other Telecom ICs	.65 mm	105 Cel	-30 Cel	TIN LEAD	DUAL	R-PDSO-G16		1.2 mm	4.4 mm	Not Qualified	e0			5 mm
MAX3260C/D	Maxim Integrated	ATM/SONET/SDH SUPPORT CIRCUIT	OTHER	NO LEAD	14	DIE	SQUARE	UNSPECIFIED	SDH; SONET	YES	1	BIPOLAR		.07 mA	5 V	5	UNCASED CHIP	DIE OR CHIP	Other Telecom ICs		100 Cel	0 Cel	TIN LEAD	UPPER	S-XUUC-N14	1			Not Qualified	e0
MAX3831UCB-D	Maxim Integrated	ATM/SONET/SDH MUX/DEMUX	OTHER	GULL WING	64	HTFQFP	SQUARE	PLASTIC/EPOXY		YES	1				3.3 V		FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH			.5 mm	85 Cel	0 Cel	TIN LEAD	QUAD	S-PQFP-G64	3	1.2 mm	10 mm	Not Qualified	e0			10 mm
MAX3831UCB	Maxim Integrated	ATM/SONET/SDH MUX/DEMUX	OTHER	GULL WING	64	HTFQFP	SQUARE	PLASTIC/EPOXY	ATM; SDH; SONET	YES	1				3.3 V		FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH			.5 mm	85 Cel	0 Cel	TIN LEAD	QUAD	S-PQFP-G64	1	1.2 mm	10 mm	Not Qualified	e0			10 mm
MAX3832UCB-T	Maxim Integrated	ATM/SONET/SDH MUX/DEMUX	OTHER	GULL WING	64	HTFQFP	SQUARE	PLASTIC/EPOXY		YES	1				3.3 V		FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH			.5 mm	85 Cel	0 Cel	TIN LEAD	QUAD	S-PQFP-G64	3	1.2 mm	10 mm	Not Qualified	e0			10 mm
MAX3822UCM+T	Maxim Integrated	ATM/SONET/SDH SUPPORT CIRCUIT	OTHER	GULL WING	48	HTFQFP	SQUARE	PLASTIC/EPOXY	ATM	YES	1	BIPOLAR			3.3 V		FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH			.5 mm	85 Cel	0 Cel	MATTE TIN	QUAD	S-PQFP-G48	1	1.2 mm	7 mm	Not Qualified	e3			7 mm
MAX3992UTG+T	Maxim Integrated	ATM/SONET/SDH CLOCK RECOVERY CIRCUIT	OTHER	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	SDH; SONET	YES	1	BIPOLAR		.145 mA	3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	ATM/SONET/SDH ICs	.5 mm	85 Cel	0 Cel	MATTE TIN	QUAD	S-XQCC-N24	1	.8 mm	4 mm	Not Qualified	e3			4 mm
MAX3822UCM	Maxim Integrated	ATM/SONET/SDH SUPPORT CIRCUIT	OTHER	GULL WING	48	HTFQFP	SQUARE	PLASTIC/EPOXY	ATM	YES	1	BIPOLAR		.265 mA	3.3 V	3.3	FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH	TQFP48,.35SQ	ATM/SONET/SDH ICs	.5 mm	85 Cel	0 Cel	Tin/Lead (Sn85Pb15)	QUAD	S-PQFP-G48	3	1.2 mm	7 mm	Not Qualified	e0	20	240	7 mm
MAX3991UTG	Maxim Integrated	ATM/SONET/SDH CLOCK RECOVERY CIRCUIT	OTHER	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	SDH; SONET	YES	1	BIPOLAR		.14 mA	3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	ATM/SONET/SDH ICs	.5 mm	85 Cel	0 Cel	TIN LEAD	QUAD	S-XQCC-N24	1	.8 mm	4 mm	Not Qualified	e0			4 mm
MAX3832UCB	Maxim Integrated	ATM/SONET/SDH MUX/DEMUX	OTHER	GULL WING	64	HTFQFP	SQUARE	PLASTIC/EPOXY	ATM; SDH; SONET	YES	1				3.3 V		FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH			.5 mm	85 Cel	0 Cel	TIN LEAD	QUAD	S-PQFP-G64	1	1.2 mm	10 mm	Not Qualified	e0			10 mm
MAX3992UTG-T	Maxim Integrated	ATM/SONET/SDH CLOCK RECOVERY CIRCUIT	OTHER	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	SDH; SONET	YES	1	BIPOLAR		.145 mA	3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	ATM/SONET/SDH ICs	.5 mm	85 Cel	0 Cel	TIN LEAD	QUAD	S-XQCC-N24	1	.8 mm	4 mm	Not Qualified	e0			4 mm
MAX3831UCB-TD	Maxim Integrated	ATM/SONET/SDH MUX/DEMUX	OTHER	GULL WING	64	HTFQFP	SQUARE	PLASTIC/EPOXY		YES	1				3.3 V		FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH			.5 mm	85 Cel	0 Cel	TIN LEAD	QUAD	S-PQFP-G64	3	1.2 mm	10 mm	Not Qualified	e0			10 mm
MAX3991UTG-T	Maxim Integrated	ATM/SONET/SDH CLOCK RECOVERY CIRCUIT	OTHER	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	SDH; SONET	YES	1	BIPOLAR		.14 mA	3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	ATM/SONET/SDH ICs	.5 mm	85 Cel	0 Cel	TIN LEAD	QUAD	S-XQCC-N24	1	.8 mm	4 mm	Not Qualified	e0			4 mm
MAX3822U/D	Maxim Integrated	ATM/SONET/SDH SUPPORT CIRCUIT	OTHER	NO LEAD	49	DIE	RECTANGULAR	UNSPECIFIED		YES	1	BIPOLAR			3.3 V		UNCASED CHIP				85 Cel	0 Cel	TIN LEAD	UPPER	R-XUUC-N49	1			Not Qualified	e0
MAX3822UCM-T	Maxim Integrated	ATM/SONET/SDH SUPPORT CIRCUIT	OTHER	GULL WING	48	HTFQFP	SQUARE	PLASTIC/EPOXY	ATM	YES	1	BIPOLAR			3.3 V		FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH			.5 mm	85 Cel	0 Cel	TIN LEAD	QUAD	S-PQFP-G48	1	1.2 mm	7 mm	Not Qualified	e0			7 mm
MAX3832UCB-TD	Maxim Integrated	ATM/SONET/SDH MUX/DEMUX	OTHER	GULL WING	64	HTFQFP	SQUARE	PLASTIC/EPOXY		YES	1				3.3 V		FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH			.5 mm	85 Cel	0 Cel		QUAD	S-PQFP-G64		1.2 mm	10 mm			NOT SPECIFIED	NOT SPECIFIED	10 mm
MAX3831UCB-T	Maxim Integrated	ATM/SONET/SDH MUX/DEMUX	OTHER	GULL WING	64	HTFQFP	SQUARE	PLASTIC/EPOXY		YES	1				3.3 V		FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH			.5 mm	85 Cel	0 Cel	TIN LEAD	QUAD	S-PQFP-G64	3	1.2 mm	10 mm	Not Qualified	e0			10 mm
MAX3991UTG+	Maxim Integrated	ATM/SONET/SDH CLOCK RECOVERY CIRCUIT	OTHER	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	SDH; SONET	YES	1	BIPOLAR		.14 mA	3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	ATM/SONET/SDH ICs	.5 mm	85 Cel	0 Cel	MATTE TIN	QUAD	S-XQCC-N24	1	.8 mm	4 mm	Not Qualified	e3	30	260	4 mm
MAX3822UCM+	Maxim Integrated	ATM/SONET/SDH SUPPORT CIRCUIT	OTHER	GULL WING	48	HTFQFP	SQUARE	PLASTIC/EPOXY	ATM	YES	1	BIPOLAR		.265 mA	3.3 V	3.3	FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH	TQFP48,.35SQ	ATM/SONET/SDH ICs	.5 mm	85 Cel	0 Cel	MATTE TIN	QUAD	S-PQFP-G48	3	1.2 mm	7 mm	Not Qualified	e3	30	260	7 mm
MAX3992UTG+	Maxim Integrated	ATM/SONET/SDH CLOCK RECOVERY CIRCUIT	OTHER	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	SDH; SONET	YES	1	BIPOLAR		.145 mA	3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	ATM/SONET/SDH ICs	.5 mm	85 Cel	0 Cel	MATTE TIN	QUAD	S-XQCC-N24	1	.8 mm	4 mm	Not Qualified	e3	30	260	4 mm
MAX3832UCB-D	Maxim Integrated	ATM/SONET/SDH MUX/DEMUX	OTHER	GULL WING	64	HTFQFP	SQUARE	PLASTIC/EPOXY		YES	1				3.3 V		FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH			.5 mm	85 Cel	0 Cel		QUAD	S-PQFP-G64		1.2 mm	10 mm			NOT SPECIFIED	NOT SPECIFIED	10 mm
MAX3825U/D	Maxim Integrated	ATM/SONET/SDH SUPPORT CIRCUIT	OTHER	NO LEAD	44	DIE	RECTANGULAR	UNSPECIFIED	ATM; SDH; SONET	YES	1	BIPOLAR		160 mA	3.3 V	3.3	UNCASED CHIP	DIE OR CHIP	Other Telecom ICs		85 Cel	0 Cel	TIN LEAD	UPPER	R-XUUC-N44	1			Not Qualified	e0
MAX3991UTG+T	Maxim Integrated	ATM/SONET/SDH CLOCK RECOVERY CIRCUIT	OTHER	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	SDH; SONET	YES	1	BIPOLAR		.14 mA	3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	ATM/SONET/SDH ICs	.5 mm	85 Cel	0 Cel	MATTE TIN	QUAD	S-XQCC-N24	1	.8 mm	4 mm	Not Qualified	e3			4 mm
MAX3992UTG	Maxim Integrated	ATM/SONET/SDH CLOCK RECOVERY CIRCUIT	OTHER	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	SDH; SONET	YES	1	BIPOLAR		.145 mA	3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	ATM/SONET/SDH ICs	.5 mm	85 Cel	0 Cel	TIN LEAD	QUAD	S-XQCC-N24	1	.8 mm	4 mm	Not Qualified	e0			4 mm
TC35885TB	Toshiba	ATM/SONET/SDH MUX/DEMUX	OTHER	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY		YES	1				3.3 V		GRID ARRAY, LOW PROFILE			1.27 mm	85 Cel	-5 Cel	TIN LEAD	BOTTOM	S-PBGA-B256		1.7 mm	27 mm	Not Qualified	e0			27 mm
RCV5737AH	Renesas Electronics	ATM/SONET/SDH RECEIVER	OTHER	PIN/PEG	22		RECTANGULAR	UNSPECIFIED		NO	1		-5.2 V		5 V		FIBER OPTIC				85 Cel	-20 Cel		UNSPECIFIED	R-XXFO-P22				Not Qualified
RCV5707AH	Renesas Electronics	ATM/SONET/SDH RECEIVER	OTHER	PIN/PEG	22		RECTANGULAR	UNSPECIFIED		NO	1		-5.2 V		5 V		FIBER OPTIC				85 Cel	-20 Cel		UNSPECIFIED	R-XXFO-P22				Not Qualified

ATM/SONET/SDH Circuits

ATM (Asynchronous Transfer Mode), SONET (Synchronous Optical Network), and SDH (Synchronous Digital Hierarchy) circuits are high-speed communication technologies used in telecommunications networks.

ATM is a cell-based network technology that enables high-speed data transfer, video and voice communication. It divides data into fixed-size cells and sends them across the network using time-division multiplexing (TDM).

SONET and SDH are both standard protocols for optical telecommunications transport. They use synchronous timing signals to enable high-speed communication over fiber optic networks. SONET is used primarily in North America, while SDH is used primarily in Europe and other regions.

ATM, SONET, and SDH circuits offer several advantages over other communication technologies. They provide high-speed communication with low latency, allowing for efficient data transfer and real-time voice and video communication. They also provide a high level of reliability and fault tolerance, making them ideal for use in mission-critical applications such as banking, healthcare, and defense.

However, these circuits also require specialized hardware and software, and can be more expensive to implement and maintain than other communication technologies. They also require a high level of expertise to configure and manage.