BALL ATM/SONET/SDH Circuits 203

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Applications	Surface Mount	No. of Functions	Technology	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
SI5100-H-GL	Silicon Labs	ATM/SONET/SDH TRANSCEIVER	OTHER	BALL	195	LBGA	SQUARE	PLASTIC/EPOXY	SDH; SONET	YES	1		830 mA	1.8 V	1.8	GRID ARRAY, LOW PROFILE	BGA195,14X14,40	ATM/SONET/SDH ICs	1 mm	85 Cel	-20 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B195		1.56 mm	15 mm	Not Qualified	e1			15 mm
ZL30123GGG2	Microchip Technology	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	BALL	100	FBGA	SQUARE	PLASTIC/EPOXY	SDH; SONET	YES	1			1.8 V		GRID ARRAY, FINE PITCH	BGA100,10X10,32		.8 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B100		1.72 mm	9 mm	Not Qualified	e1			9 mm
ZL30343GGG2	Microchip Technology	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	BALL	100	FBGA	SQUARE	PLASTIC/EPOXY	SDH; SONET	YES	1					GRID ARRAY, FINE PITCH	BGA100,10X10,32		.8 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B100		1.72 mm	9 mm		e1			9 mm
VSC8247YJB-02	Microchip Technology	ATM/SONET/SDH CLOCK RECOVERY CIRCUIT		BALL	144	BGA	SQUARE	PLASTIC/EPOXY		YES	1			1.2 V		GRID ARRAY	BGA144(UNSPEC)			95 Cel			BOTTOM	S-PBGA-B144			13 mm					13 mm
ZL81001GGG2	Microchip Technology	ATM/SONET/SDH ICS	INDUSTRIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY	SDH; SONET	YES	1		154 mA	1.8 V		GRID ARRAY, LOW PROFILE	BGA256,16X16,40		1 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B256		1.7 mm	17 mm					17 mm
ZL30122GGG2	Microchip Technology	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	BALL	64	BGA	SQUARE	PLASTIC/EPOXY	SDH; SONET	YES	1			1.8 V		GRID ARRAY	BGA64,8X8,40		1 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B64		1.72 mm	9 mm	Not Qualified	e1			9 mm
PM5319-NGI	Microchip Technology	ATM/SONET/SDH SUPPORT CIRCUIT		BALL	196	BGA	SQUARE	PLASTIC/EPOXY		YES	1					GRID ARRAY							BOTTOM	S-PBGA-B196
ZL30121GGG2V2	Microchip Technology	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	BALL	100	FBGA	SQUARE	PLASTIC/EPOXY		YES	1			3.3 V		GRID ARRAY	BGA100,10X10,32		.8 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B100	3	1.72 mm	9 mm	Not Qualified	e1	30	260	9 mm
VSC8479YYY	Microchip Technology	ATM/SONET/SDH TRANSCEIVER	OTHER	BALL	244	BGA	SQUARE	PLASTIC/EPOXY		YES	1	CMOS		1.8 V		GRID ARRAY	BGA244(UNSPEC)			90 Cel	-5 Cel		BOTTOM	S-PBGA-B244
PM5309-FEI	Microchip Technology	ATM/SONET/SDH SUPPORT CIRCUIT		BALL	500	BGA	SQUARE	PLASTIC/EPOXY		YES	1			1.2 V		GRID ARRAY							BOTTOM	S-PBGA-B500
PM5337-FEI	Microchip Technology	ATM/SONET/SDH MUX/DEMUX		BALL	896	BGA	SQUARE	PLASTIC/EPOXY		YES	1					GRID ARRAY							BOTTOM	S-PBGA-B896
ZL30165GDG2	Microchip Technology	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	BALL	144	BGA	SQUARE	PLASTIC/EPOXY	SONET;SDH	YES	1		242 mA	1.8 V		GRID ARRAY	BGA144,12X12,40		1 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B144		1.95 mm	13 mm					13 mm
SLK2504IGPV	Texas Instruments	ATM/SONET/SDH TRANSCEIVER	INDUSTRIAL	BALL	289	BGA	SQUARE	PLASTIC/EPOXY	SDH; SONET	YES	1	CMOS		1.8 V		GRID ARRAY				85 Cel	-40 Cel		BOTTOM	S-PBGA-B289				Not Qualified
DS3183N+	Analog Devices	ATM/SONET/SDH NETWORK INTERFACE	INDUSTRIAL	BALL	400	BGA	SQUARE	PLASTIC/EPOXY		YES	1			3.3 V		GRID ARRAY			1.27 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B400		2.54 mm	27 mm	Not Qualified	e1			27 mm
DS3163N+	Analog Devices	ATM/SONET/SDH NETWORK INTERFACE	INDUSTRIAL	BALL	400	BGA	SQUARE	PLASTIC/EPOXY	ATM; SDH; SONET	YES	1		.381 mA	3.3 V	3.3	GRID ARRAY	BGA400,20X20,50	ATM/SONET/SDH ICs	1.27 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B400		2.54 mm	27 mm	Not Qualified	e1			27 mm
DS31400GN+T	Analog Devices	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY		YES	1			1.8 V		GRID ARRAY, LOW PROFILE			1 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B256		1.7 mm	17 mm			NOT SPECIFIED	NOT SPECIFIED	17 mm
DS3163+	Analog Devices	ATM/SONET/SDH NETWORK INTERFACE	COMMERCIAL	BALL	400	BGA	SQUARE	PLASTIC/EPOXY	ATM; SDH; SONET	YES	1		.381 mA	3.3 V	3.3	GRID ARRAY	BGA400,20X20,50	ATM/SONET/SDH ICs	1.27 mm	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B400		2.54 mm	27 mm	Not Qualified	e1			27 mm
DS3162N+	Analog Devices	ATM/SONET/SDH NETWORK INTERFACE	INDUSTRIAL	BALL	400	BGA	SQUARE	PLASTIC/EPOXY	ATM; SDH; SONET	YES	1		.3 mA	3.3 V	3.3	GRID ARRAY	BGA400,20X20,50	ATM/SONET/SDH ICs	1.27 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B400		2.54 mm	27 mm	Not Qualified	e1			27 mm
DS3161+	Analog Devices	ATM/SONET/SDH NETWORK INTERFACE	COMMERCIAL	BALL	400	BGA	SQUARE	PLASTIC/EPOXY	ATM; SDH; SONET	YES	1		.218 mA	3.3 V	3.3	GRID ARRAY	BGA400,20X20,50	ATM/SONET/SDH ICs	1.27 mm	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B400		2.54 mm	27 mm	Not Qualified	e1			27 mm
DS3162+	Analog Devices	ATM/SONET/SDH NETWORK INTERFACE	COMMERCIAL	BALL	400	BGA	SQUARE	PLASTIC/EPOXY	ATM; SDH; SONET	YES	1		.3 mA	3.3 V	3.3	GRID ARRAY	BGA400,20X20,50	ATM/SONET/SDH ICs	1.27 mm	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B400		2.54 mm	27 mm	Not Qualified	e1			27 mm
DS3161N+	Analog Devices	ATM/SONET/SDH NETWORK INTERFACE	INDUSTRIAL	BALL	400	BGA	SQUARE	PLASTIC/EPOXY	ATM; SDH; SONET	YES	1		.218 mA	3.3 V	3.3	GRID ARRAY	BGA400,20X20,50	ATM/SONET/SDH ICs	1.27 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B400		2.54 mm	27 mm	Not Qualified	e1			27 mm
DS3183+	Analog Devices	ATM/SONET/SDH NETWORK INTERFACE	COMMERCIAL	BALL	400	BGA	SQUARE	PLASTIC/EPOXY		YES	1			3.3 V		GRID ARRAY			1.27 mm	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B400		2.54 mm	27 mm	Not Qualified	e1			27 mm
ADN2901XXX	Analog Devices	ATM/SONET/SDH TRANSCEIVER	OTHER	BALL	186	BGA	SQUARE	PLASTIC/EPOXY	ATM; SDH; SONET	YES	1	BIPOLAR		3.3 V	3.3	GRID ARRAY	BGA186,16X16,40	ATM/SONET/SDH ICs	1 mm	85 Cel	0 Cel	TIN LEAD	BOTTOM	S-PBGA-B186		2.06 mm	17 mm	Not Qualified	e0			17 mm
ADN2902XXX	Analog Devices	ATM/SONET/SDH TRANSCEIVER	OTHER	BALL	186	BGA	SQUARE	PLASTIC/EPOXY	ATM; SDH; SONET	YES	1			3.3 V	3.3	GRID ARRAY	BGA186,16X16,40	ATM/SONET/SDH ICs	1 mm	85 Cel	0 Cel	TIN LEAD	BOTTOM	S-PBGA-B186		2.06 mm	17 mm	Not Qualified	e0			17 mm
MC92500ZQ	NXP Semiconductors	ATM/SONET/SDH NETWORK INTERFACE		BALL	256	BGA	SQUARE	PLASTIC/EPOXY	ATM;SONET	YES	1			3.3 V		GRID ARRAY	BGA256,20X20,50		1.27 mm	70 Cel	0 Cel		BOTTOM	S-PBGA-B256		2.834 mm	27 mm					27 mm
PXB4220EV34	Infineon Technologies	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY		YES	1			3.3 V		GRID ARRAY			1.27 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B256		2.13 mm	27 mm					27 mm
PXB4221	Infineon Technologies	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	ATM	YES	1	CMOS	.47 mA	3.3 V	3.3	GRID ARRAY	QFP256,1.2SQ,16	ATM/SONET/SDH ICs	1.27 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B256			27 mm	Not Qualified	e0			27 mm
PXB4219	Infineon Technologies	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	ATM	YES	1	CMOS	.7 mA	3.3 V	3.3	GRID ARRAY	BGA256,20X20,50	ATM/SONET/SDH ICs	1.27 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B256		2.13 mm	27 mm	Not Qualified	e0			27 mm
PXB4225	Infineon Technologies	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	BALL	388	HBGA	SQUARE	PLASTIC/EPOXY	ATM	YES	1	CMOS	1000 mA	1.8 V	1.8,3.3	GRID ARRAY, HEAT SINK/SLUG	BGA388,26X26,50	ATM/SONET/SDH ICs	1.27 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B388		2.54 mm	35 mm	Not Qualified	e0			35 mm
PXB4330E	Infineon Technologies	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	BALL	352	HLBGA	SQUARE	PLASTIC/EPOXY	ATM	YES	1	CMOS		3.3 V	3.3	GRID ARRAY, HEAT SINK/SLUG, LOW PROFILE	BGA352,26X26,50	ATM/SONET/SDH ICs	1.27 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B352		1.58 mm	35 mm	Not Qualified	e0			35 mm
PXB4310	Infineon Technologies	ATM/SONET/SDH SWITCHING CIRCUIT	COMMERCIAL	BALL	352	BGA	SQUARE	PLASTIC/EPOXY	ATM	YES	1	CMOS		3.3 V	3.3	GRID ARRAY	BGA352,26X26,50	ATM/SONET/SDH ICs	1.27 mm	70 Cel	0 Cel		BOTTOM	S-PBGA-B352				Not Qualified
PXB43201	Infineon Technologies	ATM/SONET/SDH SUPPORT CIRCUIT		BALL	342	BGA	SQUARE	PLASTIC/EPOXY		YES	1					GRID ARRAY							BOTTOM	S-PBGA-B342				Not Qualified
PXB4219E	Infineon Technologies	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	ATM; SDH	YES	1	CMOS	.7 mA	3.3 V	3.3	GRID ARRAY	BGA256,20X20,50	ATM/SONET/SDH ICs	1.27 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B256		2.13 mm	27 mm	Not Qualified				27 mm
PEF3460E	Infineon Technologies	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	BALL	272	BGA	SQUARE	PLASTIC/EPOXY	ATM; SDH; SONET	YES	1	CMOS		1.8 V	1.8,3.3	GRID ARRAY	BGA272,20X20,50	Digital Transmission Interfaces	1.27 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B272		2.54 mm	27 mm	Not Qualified				27 mm
PXB4260	Infineon Technologies	ATM/SONET/SDH SUPPORT CIRCUIT	COMMERCIAL	BALL	272	BGA	SQUARE	PLASTIC/EPOXY	ATM	YES	1	CMOS		2.5 V		GRID ARRAY			1.27 mm	70 Cel	0 Cel	TIN LEAD	BOTTOM	S-PBGA-B272			27 mm	Not Qualified	e0			27 mm
PXB4220EV33	Infineon Technologies	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY		YES	1			3.3 V		GRID ARRAY			1.27 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B256		2.13 mm	27 mm					27 mm
PXB4340E	Infineon Technologies	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	BALL	352	BGA	SQUARE	PLASTIC/EPOXY	ATM	YES	1	CMOS		3.3 V	3.3	GRID ARRAY	BGA352,26X26,50	ATM/SONET/SDH ICs	1.27 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B352		2.5 mm	35 mm	Not Qualified	e0			35 mm
PXB4350E	Infineon Technologies	ATM/SONET/SDH SWITCHING CIRCUIT	INDUSTRIAL	BALL	456	BGA	SQUARE	PLASTIC/EPOXY	ATM	YES	1	CMOS		3.3 V	3.3	GRID ARRAY	BGA456,26X26,50	ATM/SONET/SDH ICs	1.27 mm	85 Cel	-45 Cel	TIN LEAD	BOTTOM	S-PBGA-B456		2.5 mm	35 mm	Not Qualified	e0			35 mm
PXB4221E	Infineon Technologies	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	ATM; SDH	YES	1	CMOS	.7 mA	3.3 V	3.3	GRID ARRAY	BGA256,20X20,50	ATM/SONET/SDH ICs	1.27 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B256		2.13 mm	27 mm	Not Qualified				27 mm
PXB43202	Infineon Technologies	ATM/SONET/SDH SUPPORT CIRCUIT		BALL	342	BGA	SQUARE	PLASTIC/EPOXY		YES	1					GRID ARRAY							BOTTOM	S-PBGA-B342				Not Qualified
PXB4325E	Infineon Technologies	ATM/SONET/SDH SWITCHING CIRCUIT	COMMERCIAL	BALL	352	BGA	SQUARE	PLASTIC/EPOXY	ATM	YES	1	CMOS		3.3 V	3.3	GRID ARRAY	BGA352,26X26,50	ATM/SONET/SDH ICs	1.27 mm	70 Cel	0 Cel	TIN LEAD	BOTTOM	S-PBGA-B352		2.5 mm	35 mm	Not Qualified	e0			35 mm
PXF4225	Infineon Technologies	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	BALL	388	BGA	SQUARE	PLASTIC/EPOXY		YES	1			1.8 V		GRID ARRAY			1.27 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B388		2.54 mm	35 mm	Not Qualified				35 mm
PXF4336E	Infineon Technologies		INDUSTRIAL	BALL	456	BGA	SQUARE	PLASTIC/EPOXY		YES					1.8,3.3	GRID ARRAY	BGA456,26X26,50	ATM/SONET/SDH ICs	1.27 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B456				Not Qualified
PXB4220	Infineon Technologies	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	ATM	YES	1	CMOS	.47 mA	3.3 V	3.3	GRID ARRAY	BGA256,20X20,50	ATM/SONET/SDH ICs	1.27 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B256			27 mm	Not Qualified	e0			27 mm
PXB4220E	Infineon Technologies	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	ATM; SDH	YES	1	CMOS	.7 mA	3.3 V	3.3	GRID ARRAY	BGA256,20X20,50	ATM/SONET/SDH ICs	1.27 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B256		2.13 mm	27 mm	Not Qualified				27 mm
PXB4350	Infineon Technologies	ATM/SONET/SDH SWITCHING CIRCUIT	COMMERCIAL	BALL	456	BGA	SQUARE	PLASTIC/EPOXY		YES	1	CMOS		3.3 V		GRID ARRAY			1.27 mm	70 Cel	0 Cel		BOTTOM	S-PBGA-B456		2.5 mm	35 mm	Not Qualified				35 mm
PXB4330	Infineon Technologies	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	BALL	456	BGA	SQUARE	PLASTIC/EPOXY		YES	1			1.8 V		GRID ARRAY			1.27 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B456		2.5 mm	35 mm	Not Qualified				35 mm
PXF4222	Infineon Technologies	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	BALL	388	BGA	SQUARE	PLASTIC/EPOXY		YES	1			1.8 V		GRID ARRAY			1.27 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B388		2.54 mm	35 mm	Not Qualified				35 mm

ATM/SONET/SDH Circuits

ATM (Asynchronous Transfer Mode), SONET (Synchronous Optical Network), and SDH (Synchronous Digital Hierarchy) circuits are high-speed communication technologies used in telecommunications networks.

ATM is a cell-based network technology that enables high-speed data transfer, video and voice communication. It divides data into fixed-size cells and sends them across the network using time-division multiplexing (TDM).

SONET and SDH are both standard protocols for optical telecommunications transport. They use synchronous timing signals to enable high-speed communication over fiber optic networks. SONET is used primarily in North America, while SDH is used primarily in Europe and other regions.

ATM, SONET, and SDH circuits offer several advantages over other communication technologies. They provide high-speed communication with low latency, allowing for efficient data transfer and real-time voice and video communication. They also provide a high level of reliability and fault tolerance, making them ideal for use in mission-critical applications such as banking, healthcare, and defense.

However, these circuits also require specialized hardware and software, and can be more expensive to implement and maintain than other communication technologies. They also require a high level of expertise to configure and manage.