BALL ATM/SONET/SDH Circuits 203

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Applications	Surface Mount	No. of Functions	Technology	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
DS3181N	Maxim Integrated	ATM/SONET/SDH NETWORK INTERFACE	INDUSTRIAL	BALL	400	BGA	SQUARE	PLASTIC/EPOXY	ATM; SDH; SONET	YES	1		.28 mA	3.3 V	3.3	GRID ARRAY	BGA400,20X20,50	ATM/SONET/SDH ICs	1.27 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B400		2.54 mm	27 mm	Not Qualified	e0			27 mm
DS3184N+	Maxim Integrated	ATM/SONET/SDH NETWORK INTERFACE	INDUSTRIAL	BALL	400	BGA	SQUARE	PLASTIC/EPOXY	ATM; SDH; SONET	YES	1		.85 mA	3.3 V	3.3	GRID ARRAY	BGA400,20X20,50	ATM/SONET/SDH ICs	1.27 mm	85 Cel	-40 Cel	MATTE TIN	BOTTOM	S-PBGA-B400	3	2.54 mm	27 mm	Not Qualified	e3			27 mm
DS3100GN#	Maxim Integrated	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY		YES	1			1.8 V		GRID ARRAY			1 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B256		1.77 mm	17 mm	Not Qualified				17 mm
DS31408GN+	Maxim Integrated	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY		YES	1			1.8 V		GRID ARRAY				85 Cel	-40 Cel		BOTTOM	S-PBGA-B256						NOT SPECIFIED	NOT SPECIFIED
DS3101GN+	Maxim Integrated	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY	SDH; SONET	YES	1		.12 mA	1.8 V	1.8,3.3	GRID ARRAY, LOW PROFILE	BGA256,16X16,40	Other Telecom ICs	1 mm	85 Cel	-40 Cel	MATTE TIN	BOTTOM	S-PBGA-B256	3	1.26 mm	17 mm	Not Qualified	e3			17 mm
DS3164	Maxim Integrated	ATM/SONET/SDH NETWORK INTERFACE	COMMERCIAL	BALL	400	BGA	SQUARE	PLASTIC/EPOXY	ATM; SDH; SONET	YES	1		.468 mA	3.3 V	3.3	GRID ARRAY	BGA400,20X20,50	ATM/SONET/SDH ICs	1.27 mm	70 Cel	0 Cel	TIN LEAD	BOTTOM	S-PBGA-B400		2.54 mm	27 mm	Not Qualified	e0			27 mm
TC35885TB	Toshiba	ATM/SONET/SDH MUX/DEMUX	OTHER	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY		YES	1			3.3 V		GRID ARRAY, LOW PROFILE			1.27 mm	85 Cel	-5 Cel	TIN LEAD	BOTTOM	S-PBGA-B256		1.7 mm	27 mm	Not Qualified	e0			27 mm
82P5088BB	Renesas Electronics	ATM/SONET/SDH CLOCK RECOVERY CIRCUIT	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	SDH; SONET	YES	1			1.8 V		GRID ARRAY			1 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B256	3	3.5 mm	17 mm	Not Qualified	e0			17 mm
77V500S25BCI	Renesas Electronics	ATM/SONET/SDH SWITCHING CIRCUIT	INDUSTRIAL	BALL	144	LBGA	SQUARE	PLASTIC/EPOXY	ATM	YES	1			3.3 V	3.3	GRID ARRAY, LOW PROFILE	BGA144,12X12,40	ATM/SONET/SDH ICs	1 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B144	3	1.5 mm	13 mm	Not Qualified	e0	20	225	13 mm
82P5088BBG	Renesas Electronics	ATM/SONET/SDH CLOCK RECOVERY CIRCUIT	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY		YES	1			1.8 V		GRID ARRAY				85 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	S-PBGA-B256	3				e1	NOT SPECIFIED	260
8A34001E-000AJG8	Renesas Electronics	ATM/SONET/SDH SUPPORT CIRCUIT		BALL	144	TFBGA	SQUARE	PLASTIC/EPOXY	SDH; SONET	YES	1		380 mA	1.2 V		GRID ARRAY, THIN PROFILE, FINE PITCH	BGA144,12X12,32		.8 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B144	3	1.2 mm	10 mm		e1		260	10 mm
UPD98405S1-6C	Renesas Electronics	ATM/SONET/SDH SEGMENTATION AND REASSEMBLY DEVICE	COMMERCIAL	BALL	304	LFBGA	SQUARE	PLASTIC/EPOXY	ATM; SDH; SONET	YES	1	CMOS		3.3 V	3.3,3.3/5	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA304,22X22,32	ATM/SONET/SDH ICs	.8 mm	70 Cel	0 Cel	TIN LEAD	BOTTOM	S-PBGA-B304		1.56 mm	19 mm	Not Qualified	e0			19 mm
UPD98414F2-RN1	Renesas Electronics		INDUSTRIAL	BALL	352	BGA	SQUARE	PLASTIC/EPOXY		YES		CMOS		3.3 V	3.3	GRID ARRAY	BGA352,26X26,50	ATM/SONET/SDH ICs	1.27 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B352				Not Qualified
77V400S156BC	Renesas Electronics	ATM/SONET/SDH SUPPORT CIRCUIT	COMMERCIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY	ATM	YES	1			3.3 V	3.3	GRID ARRAY, LOW PROFILE	BGA256,16X16,40	ATM/SONET/SDH ICs	1 mm	70 Cel	0 Cel	Tin/Lead (Sn63Pb37)	BOTTOM	S-PBGA-B256	3	1.5 mm	17 mm	Not Qualified	e0	20	225	17 mm
UPD98405S1-6C-A	Renesas Electronics	ATM/SONET/SDH SEGMENTATION AND REASSEMBLY DEVICE	INDUSTRIAL	BALL	304	LFBGA	SQUARE	PLASTIC/EPOXY	ATM; SDH; SONET	YES	1	CMOS		3.3 V	3.3,3.3/5	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA304,22X22,32	ATM/SONET/SDH ICs	.8 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B304	3	1.66 mm	19 mm	Not Qualified	e1	10	250	19 mm
77V500S25BC	Renesas Electronics	ATM/SONET/SDH SWITCHING CIRCUIT	COMMERCIAL	BALL	144	LBGA	SQUARE	PLASTIC/EPOXY	ATM	YES	1			3.3 V	3.3	GRID ARRAY, LOW PROFILE	BGA144,12X12,40	ATM/SONET/SDH ICs	1 mm	70 Cel	0 Cel	Tin/Lead (Sn63Pb37)	BOTTOM	S-PBGA-B144	3	1.5 mm	13 mm	Not Qualified	e0	20	225	13 mm
UPD98412N7-H6	Renesas Electronics		INDUSTRIAL	BALL	576	BGA	SQUARE	PLASTIC/EPOXY		YES		CMOS	1300 mA	3.3 V	3.3	GRID ARRAY	BGA576,30X30,50	ATM/SONET/SDH ICs	1.27 mm	85 Cel	-40 Cel	Tin/Lead (Sn/Pb)	BOTTOM	S-PBGA-B576				Not Qualified	e0
77V400S156BCI	Renesas Electronics	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY	ATM	YES	1			3.3 V	3.3	GRID ARRAY, LOW PROFILE	BGA256,16X16,40	ATM/SONET/SDH ICs	1 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B256	3	1.5 mm	17 mm	Not Qualified	e0	20	225	17 mm
UPD98412N7-H6-A	Renesas Electronics	ATM/SONET/SDH SWITCHING CIRCUIT	INDUSTRIAL	BALL	576	LBGA	SQUARE	PLASTIC/EPOXY	ATM	YES	1	MOS	1.3 mA	3.3 V	3.3	GRID ARRAY, LOW PROFILE	BGA576,30X30,50	ATM/SONET/SDH ICs	1.27 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B576	3	1.7 mm	40 mm	Not Qualified	e1	10	260	40 mm
UPD98410S2-K6	Renesas Electronics	ATM/SONET/SDH SWITCHING CIRCUIT		BALL	580	BGA	SQUARE	PLASTIC/EPOXY		YES	1			3.3 V		GRID ARRAY			1.27 mm				BOTTOM	S-PBGA-B580		2.78 mm	45 mm	Not Qualified				45 mm
TMXF846221BL-3	Broadcom	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	BALL	700	BGA	SQUARE	PLASTIC/EPOXY		YES	1			1.5 V		GRID ARRAY			1 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B700	2A	2.51 mm	35 mm	Not Qualified				35 mm
TTRN0110G	Broadcom	ATM/SONET/SDH SUPPORT CIRCUIT	OTHER	BALL	198	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED		YES	1			3.3 V		GRID ARRAY			1 mm	85 Cel	0 Cel	TIN LEAD	BOTTOM	S-CBGA-B198		1.961 mm	15 mm	Not Qualified	e0	30	240	15 mm
MTMXL846221BL-1	Broadcom	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	BALL	700	BGA	SQUARE	PLASTIC/EPOXY		YES	1			1.5 V		GRID ARRAY			1 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B700		2.51 mm	35 mm	Not Qualified	e0	30	225	35 mm
TMXL846221BL-3	Broadcom	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	BALL	700	BGA	SQUARE	PLASTIC/EPOXY		YES	1			1.5 V		GRID ARRAY			1 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B700		2.51 mm	35 mm	Not Qualified	e0	30	225	35 mm
T-8208---BAL2-DB	Broadcom	ATM/SONET/SDH NETWORK INTERFACE	INDUSTRIAL	BALL	272	BGA	SQUARE	PLASTIC/EPOXY		YES	1			3.3 V	3.3	GRID ARRAY	BGA272,20X20,50	ATM/SONET/SDH ICs	1.27 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B272		2.54 mm	27 mm	Not Qualified	e0	30	225	27 mm
TMXL33625BL-2	Broadcom	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	BALL	1152	BGA	SQUARE	PLASTIC/EPOXY		YES	1			1.5 V		GRID ARRAY			1.27 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B1152		2.51 mm	45 mm	Not Qualified	e0	30	225	45 mm
L-TMXL846221BL-3	Broadcom	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	BALL	700	BGA	SQUARE	PLASTIC/EPOXY		YES	1			1.5 V		GRID ARRAY			1 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B700		2.51 mm	35 mm	Not Qualified	e1	40	250	35 mm
L-TMXL336251BL-3	Broadcom	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	BALL	1152	BGA	SQUARE	PLASTIC/EPOXY		YES	1			1.5 V		GRID ARRAY			1.27 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B1152		2.51 mm	45 mm	Not Qualified	e1	40	245	45 mm
M-TDAT162G52-3BAL2	Broadcom		INDUSTRIAL	BALL	792	BGA	SQUARE	PLASTIC/EPOXY		YES		CMOS			1.6/3.3	GRID ARRAY	BGA792,39X39,40	ATM/SONET/SDH ICs	1 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B792				Not Qualified
M-TMXL336251BL-2-DB	Broadcom	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	BALL	1152	BGA	SQUARE	PLASTIC/EPOXY		YES	1			1.5 V		GRID ARRAY			1.27 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B1152		2.51 mm	45 mm	Not Qualified	e0	30	225	45 mm
TAAD08JU21BCL-L3A	Broadcom		COMMERCIAL	BALL	520	BGA	SQUARE	PLASTIC/EPOXY		YES		CMOS			1.5,3.3	GRID ARRAY	BGA520,31X31,50	ATM/SONET/SDH ICs	1.27 mm	70 Cel	0 Cel		BOTTOM	S-PBGA-B520				Not Qualified
TDCS6440G	Broadcom	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	BALL	792	BGA	SQUARE	PLASTIC/EPOXY		YES	1			1.5 V		GRID ARRAY			1 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B792		2.85 mm	40 mm	Not Qualified	e0	30	225	40 mm
TMXL846221BL-21	Broadcom	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	BALL	700	BGA	SQUARE	PLASTIC/EPOXY		YES	1			1.5 V	1.5,3.3	GRID ARRAY	BGA700,34X34,40	Other Telecom ICs	1 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B700		2.51 mm	35 mm	Not Qualified	e0	30	225	35 mm
TAAD08JU2	Broadcom	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	BALL	520	LBGA	SQUARE	PLASTIC/EPOXY		YES	1	CMOS		1.5 V	1.5,3.3	GRID ARRAY, LOW PROFILE	BGA520,31X31,50	ATM/SONET/SDH ICs	1.27 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B520		1.67 mm	40 mm	Not Qualified	e0	30	225	40 mm
ORT8850L-2BM680I	Broadcom	ATM/SONET/SDH TRANSCEIVER	INDUSTRIAL	BALL	680	BGA	SQUARE	PLASTIC/EPOXY		YES	1			1.5 V		GRID ARRAY			1 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B680		2.51 mm	35 mm	Not Qualified	e0	30	225	35 mm
TDAT12622-BA23	Broadcom	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	BALL	792	BGA	SQUARE	PLASTIC/EPOXY		YES	1	CMOS		1.6 V	1.6/3.3	GRID ARRAY	BGA792,39X39,40	ATM/SONET/SDH ICs	1 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B792		2.49 mm	40 mm	Not Qualified	e0	30	225	40 mm
TDAT162G52-3BAL	Broadcom		INDUSTRIAL	BALL	792	BGA	SQUARE	PLASTIC/EPOXY		YES		CMOS			1.6/3.3	GRID ARRAY	BGA792,39X39,40	ATM/SONET/SDH ICs	1 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B792				Not Qualified
LUC4AS01	Broadcom	ATM/SONET/SDH SWITCHING CIRCUIT		BALL	388	BGA	SQUARE	PLASTIC/EPOXY		YES	1	CMOS		3.3 V		GRID ARRAY						TIN LEAD	BOTTOM	S-PBGA-B388				Not Qualified	e0	30	225
BCM8228	Broadcom	ATM/SONET/SDH TRANSCEIVER		BALL	196	BGA	SQUARE	PLASTIC/EPOXY		YES	1	CMOS		1.8 V		GRID ARRAY							BOTTOM	S-PBGA-B196				Not Qualified
TMXA846221BL-21	Broadcom	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	BALL	909	BGA	SQUARE	PLASTIC/EPOXY		YES	1			1.5 V	1.5,3.3	GRID ARRAY	BGA909,34X34,40	Other Telecom ICs	1 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B909		2.51 mm	35 mm	Not Qualified	e0	30	225	35 mm
BCM8220	Broadcom	ATM/SONET/SDH TRANSCEIVER		BALL	100	BGA	SQUARE	PLASTIC/EPOXY		YES	1	CMOS		1.8 V		GRID ARRAY							BOTTOM	S-PBGA-B100
T-8207---BAL-DT	Broadcom	ATM/SONET/SDH NETWORK INTERFACE	INDUSTRIAL	BALL	272	BGA	SQUARE	PLASTIC/EPOXY		YES	1			3.3 V		GRID ARRAY			1.27 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B272		2.54 mm	27 mm	Not Qualified	e0	30	225	27 mm
L-TMXA846221BL-3	Broadcom	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	BALL	909	BGA	SQUARE	PLASTIC/EPOXY		YES	1			1.5 V		GRID ARRAY			1 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B909		2.51 mm	35 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	35 mm
TSWC03622	Broadcom	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	BALL	208	BGA	SQUARE	PLASTIC/EPOXY		YES	1			3.3 V		GRID ARRAY			1 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B208		2.12 mm	17 mm	Not Qualified	e0	30	225	17 mm
L-TMXF846221BL-3	Broadcom	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	BALL	700	BGA	SQUARE	PLASTIC/EPOXY		YES	1			1.5 V		GRID ARRAY			1 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B700		2.51 mm	35 mm	Not Qualified	e1	40	245	35 mm
T-8207---BAL-DB	Broadcom	ATM/SONET/SDH NETWORK INTERFACE	INDUSTRIAL	BALL	272	BGA	SQUARE	PLASTIC/EPOXY		YES	1			3.3 V		GRID ARRAY			1.27 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B272		2.54 mm	27 mm	Not Qualified	e0	30	225	27 mm
TDAT042G5-3BLL1	Broadcom	ATM/SONET/SDH TERMINATOR	INDUSTRIAL	BALL	600	BGA	SQUARE	PLASTIC/EPOXY		YES	1	CMOS		3.3 V		GRID ARRAY			1.27 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B600		3.05 mm	45 mm	Not Qualified	e0	30	225	45 mm
TMXL281553BAL-1-DB	Broadcom	ATM/SONET/SDH SUPPORT CIRCUIT	INDUSTRIAL	BALL	456	BGA	SQUARE	PLASTIC/EPOXY		YES	1			3.3 V		GRID ARRAY			1.27 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B456		2.54 mm	35 mm	Not Qualified	e0	30	225	35 mm

ATM/SONET/SDH Circuits

ATM (Asynchronous Transfer Mode), SONET (Synchronous Optical Network), and SDH (Synchronous Digital Hierarchy) circuits are high-speed communication technologies used in telecommunications networks.

ATM is a cell-based network technology that enables high-speed data transfer, video and voice communication. It divides data into fixed-size cells and sends them across the network using time-division multiplexing (TDM).

SONET and SDH are both standard protocols for optical telecommunications transport. They use synchronous timing signals to enable high-speed communication over fiber optic networks. SONET is used primarily in North America, while SDH is used primarily in Europe and other regions.

ATM, SONET, and SDH circuits offer several advantages over other communication technologies. They provide high-speed communication with low latency, allowing for efficient data transfer and real-time voice and video communication. They also provide a high level of reliability and fault tolerance, making them ideal for use in mission-critical applications such as banking, healthcare, and defense.

However, these circuits also require specialized hardware and software, and can be more expensive to implement and maintain than other communication technologies. They also require a high level of expertise to configure and manage.