Part | RoHS | Manufacturer | Telecom IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Package Body Material | Applications | Surface Mount | No. of Functions | No. of Channels | Technology | Nominal Negative Supply Voltage | Maximum Supply Current | Nominal Supply Voltage | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Minimum Operating Temperature | Terminal Finish | Terminal Position | Data Rate | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Analog Devices |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
SDH; SONET |
YES |
1 |
CMOS |
.185 mA |
3.3 V |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
Other Telecom ICs |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N32 |
3 |
.8 mm |
5 mm |
Not Qualified |
e3 |
30 |
260 |
5 mm |
|||||
|
Analog Devices |
INDUSTRIAL |
NO LEAD |
24 |
QCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
122 mA |
5 V |
5 |
CHIP CARRIER |
LCC24,.16SQ,20 |
ATM/SONET/SDH ICs |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-PQCC-N24 |
Not Qualified |
||||||||||||||||
Analog Devices |
ATM/SONET/SDH NETWORK INTERFACE |
INDUSTRIAL |
GULL WING |
144 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
FLATPACK, LOW PROFILE, FINE PITCH |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-PQFP-G144 |
1.6 mm |
20 mm |
Not Qualified |
20 mm |
|||||||||||||||||
|
Analog Devices |
ATM/SONET/SDH RECEIVER |
INDUSTRIAL |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
SDH; SONET |
YES |
1 |
BIPOLAR |
.1 mA |
5 V |
5 |
SMALL OUTLINE |
SOP16,.25 |
Other Telecom ICs |
1.27 mm |
85 Cel |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-G16 |
1 |
1.75 mm |
3.9 mm |
Not Qualified |
e3 |
260 |
9.9 mm |
||||||
Analog Devices |
ATM/SONET/SDH TRANSCEIVER |
OTHER |
GULL WING |
48 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
.075 mA |
5 V |
3.3/5 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP48,.35SQ,20 |
Other Telecom ICs |
.5 mm |
85 Cel |
-25 Cel |
TIN LEAD |
QUAD |
S-PQFP-G48 |
1.6 mm |
7 mm |
Not Qualified |
e0 |
7 mm |
|||||||||||
|
Analog Devices |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
NO LEAD |
56 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
1.5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N56 |
3 |
.8 mm |
8 mm |
e3 |
30 |
260 |
8 mm |
||||||||||||
|
Analog Devices |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
NO LEAD |
72 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
1.5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N72 |
3 |
1 mm |
10 mm |
e3 |
10 mm |
||||||||||||||
|
Analog Devices |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
NO LEAD |
56 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
1.5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N56 |
3 |
.8 mm |
8 mm |
e3 |
30 |
260 |
8 mm |
||||||||||||
|
Analog Devices |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
SDH; SONET |
YES |
1 |
CMOS |
.169 mA |
3.3 V |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
Other Telecom ICs |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N32 |
3 |
1 mm |
5 mm |
Not Qualified |
e3 |
30 |
260 |
5 mm |
|||||
|
Analog Devices |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
SDH; SONET |
YES |
1 |
CMOS |
185 mA |
3.3 V |
3.3 |
CHIP CARRIER |
LCC32,.2SQ,20 |
Other Telecom ICs |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N32 |
3 |
.8 mm |
5 mm |
Not Qualified |
e3 |
30 |
260 |
5 mm |
|||||
|
Analog Devices |
ATM/SONET/SDH TRANSMITTER |
INDUSTRIAL |
HVQCCN |
SDH; SONET |
1 |
3.3 V |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
3 |
1 mm |
6 mm |
e3 |
30 |
260 |
6 mm |
|||||||||||||||||||
|
Analog Devices |
ATM/SONET/SDH SUPPORT CIRCUIT |
OTHER |
UNSPECIFIED |
10 |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
-3.3 V |
MICROELECTRONIC ASSEMBLY |
70 Cel |
-40 Cel |
GOLD OVER NICKEL |
QUAD |
R-XQMA-X10 |
Not Qualified |
e4 |
|||||||||||||||||||
|
Analog Devices |
ATM/SONET/SDH TRANSMITTER |
INDUSTRIAL |
NO LEAD |
72 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
1.8 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N72 |
3 |
1 mm |
10 mm |
e3 |
30 |
260 |
10 mm |
||||||||||||
Analog Devices |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
SDH; SONET |
YES |
1 |
BIPOLAR |
.0395 mA |
5 V |
5 |
SMALL OUTLINE |
SOP16,.25 |
ATM/SONET/SDH ICs |
1.27 mm |
85 Cel |
-40 Cel |
TIN LEAD |
DUAL |
R-PDSO-G16 |
1.75 mm |
3.9 mm |
Not Qualified |
e0 |
9.9 mm |
|||||||||
|
Analog Devices |
INDUSTRIAL |
NO LEAD |
24 |
QCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
3.3 |
CHIP CARRIER |
LCC24,.16SQ,20 |
ATM/SONET/SDH ICs |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-PQCC-N24 |
Not Qualified |
|||||||||||||||||
Analog Devices |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
SDH; SONET |
YES |
1 |
5 V |
SMALL OUTLINE |
1.27 mm |
85 Cel |
-40 Cel |
DUAL |
R-PDSO-G16 |
1.75 mm |
3.9 mm |
Not Qualified |
9.9 mm |
||||||||||||||||
|
Analog Devices |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
NO LEAD |
72 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
1.5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N72 |
3 |
1 mm |
10 mm |
e3 |
30 |
260 |
10 mm |
||||||||||||
Analog Devices |
ATM/SONET/SDH CLOCK RECOVERY CIRCUIT |
INDUSTRIAL |
GULL WING |
20 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
-5.2 V |
.18 mA |
-5.2 |
SMALL OUTLINE |
SOP20,.4 |
ATM/SONET/SDH ICs |
1.27 mm |
85 Cel |
-40 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDSO-G20 |
Not Qualified |
e0 |
|||||||||||||||
|
Analog Devices |
ATM/SONET/SDH SUPPORT CIRCUIT |
OTHER |
UNSPECIFIED |
10 |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
-3.3 V |
MICROELECTRONIC ASSEMBLY |
70 Cel |
-40 Cel |
GOLD OVER NICKEL |
QUAD |
R-XQMA-X10 |
Not Qualified |
e4 |
|||||||||||||||||||
|
Analog Devices |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
-5.2 V |
5 V |
SMALL OUTLINE |
1.27 mm |
85 Cel |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-G16 |
1 |
1.75 mm |
3.9 mm |
e3 |
260 |
9.9 mm |
||||||||||||
Analog Devices |
ATM/SONET/SDH NETWORK INTERFACE |
INDUSTRIAL |
GULL WING |
144 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
FLATPACK, LOW PROFILE, FINE PITCH |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-PQFP-G144 |
1.6 mm |
20 mm |
Not Qualified |
20 mm |
|||||||||||||||||
Analog Devices |
ATM/SONET/SDH RECEIVER |
INDUSTRIAL |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
SDH; SONET |
YES |
1 |
BIPOLAR |
.1 mA |
5 V |
5 |
SMALL OUTLINE |
SOP16,.25 |
Other Telecom ICs |
1.27 mm |
85 Cel |
-40 Cel |
TIN LEAD |
DUAL |
R-PDSO-G16 |
1.75 mm |
3.9 mm |
Not Qualified |
e0 |
9.9 mm |
|||||||||
Analog Devices |
ATM/SONET/SDH RECEIVER |
INDUSTRIAL |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
SDH; SONET |
YES |
1 |
BIPOLAR |
.1 mA |
5 V |
5/-5.2 |
SMALL OUTLINE |
SOP16,.25 |
ATM/SONET/SDH ICs |
1.27 mm |
85 Cel |
-40 Cel |
TIN LEAD |
DUAL |
R-PDSO-G16 |
1 |
1.75 mm |
3.9 mm |
Not Qualified |
e0 |
240 |
9.9 mm |
|||||||
|
Analog Devices |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
SDH; SONET |
YES |
1 |
BIPOLAR |
.0395 mA |
5 V |
5 |
SMALL OUTLINE |
SOP16,.25 |
ATM/SONET/SDH ICs |
1.27 mm |
85 Cel |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-G16 |
1 |
1.75 mm |
3.9 mm |
Not Qualified |
e3 |
30 |
260 |
9.9 mm |
|||||
|
Analog Devices |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
NO LEAD |
40 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-PQCC-N40 |
1 |
.9 mm |
6 mm |
e3 |
30 |
260 |
6 mm |
||||||||||||
|
Analog Devices |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
NO LEAD |
40 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-PQCC-N40 |
1 |
.9 mm |
6 mm |
e3 |
6 mm |
||||||||||||||
|
Analog Devices |
ATM/SONET/SDH SUPPORT CIRCUIT |
OTHER |
UNSPECIFIED |
10 |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
-3.3 V |
MICROELECTRONIC ASSEMBLY |
70 Cel |
-40 Cel |
GOLD OVER NICKEL |
QUAD |
R-XQMA-X10 |
Not Qualified |
e4 |
|||||||||||||||||||
|
Analog Devices |
ATM/SONET/SDH TRANSMITTER |
INDUSTRIAL |
NO LEAD |
64 |
HVQCCN |
SQUARE |
UNSPECIFIED |
SDH; SONET |
YES |
1 |
1.8 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N64 |
3 |
1 mm |
9 mm |
e3 |
30 |
260 |
9 mm |
|||||||||||
Analog Devices |
ATM/SONET/SDH TRANSCEIVER |
OTHER |
GULL WING |
48 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
.075 mA |
5 V |
3.3/5 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP48,.35SQ,20 |
Other Telecom ICs |
.5 mm |
85 Cel |
-25 Cel |
QUAD |
S-PQFP-G48 |
1.6 mm |
7 mm |
Not Qualified |
7 mm |
|||||||||||||
|
Analog Devices |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
NO LEAD |
40 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-PQCC-N40 |
.9 mm |
6 mm |
NOT SPECIFIED |
NOT SPECIFIED |
6 mm |
|||||||||||||||
|
Analog Devices |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
NO LEAD |
72 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
1.5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N72 |
3 |
1 mm |
10 mm |
e3 |
30 |
260 |
10 mm |
||||||||||||
Analog Devices |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
-5.2 V |
5 V |
SMALL OUTLINE |
1.27 mm |
85 Cel |
-40 Cel |
DUAL |
R-PDSO-G16 |
1.75 mm |
3.9 mm |
9.9 mm |
|||||||||||||||||
|
Analog Devices |
ATM/SONET/SDH TRANSMITTER |
INDUSTRIAL |
NO LEAD |
72 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
1.8 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N72 |
3 |
1 mm |
10 mm |
e3 |
30 |
260 |
10 mm |
||||||||||||
Analog Devices |
ATM/SONET/SDH TRANSCEIVER |
COMMERCIAL |
GULL WING |
44 |
LQFP |
SQUARE |
PLASTIC/EPOXY |
ATM; SDH; SONET |
YES |
1 |
BIPOLAR |
95 mA |
5 V |
5 |
FLATPACK, LOW PROFILE |
QFP44,.47SQ,32 |
ATM/SONET/SDH ICs |
.8 mm |
70 Cel |
0 Cel |
QUAD |
S-PQFP-G44 |
1.6 mm |
10 mm |
Not Qualified |
10 mm |
|||||||||||
|
Analog Devices |
ATM/SONET/SDH NETWORK INTERFACE |
INDUSTRIAL |
NO LEAD |
16 |
QCCN |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
3.3 V |
CHIP CARRIER |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-CQCC-N16 |
1.31 mm |
3 mm |
3 mm |
|||||||||||||||||
Analog Devices |
INDUSTRIAL |
NO LEAD |
24 |
QCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
122 mA |
5 V |
5 |
CHIP CARRIER |
LCC24,.16SQ,20 |
ATM/SONET/SDH ICs |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-PQCC-N24 |
Not Qualified |
|||||||||||||||||
|
Analog Devices |
ATM/SONET/SDH RECEIVER |
INDUSTRIAL |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
SDH; SONET |
YES |
1 |
BIPOLAR |
.1 mA |
5 V |
5 |
SMALL OUTLINE |
SOP16,.25 |
Other Telecom ICs |
1.27 mm |
85 Cel |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-G16 |
1 |
1.75 mm |
3.9 mm |
Not Qualified |
e3 |
260 |
9.9 mm |
||||||
Analog Devices |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
SDH; SONET |
YES |
1 |
BIPOLAR |
.0395 mA |
5 V |
5 |
SMALL OUTLINE |
SOP16,.25 |
ATM/SONET/SDH ICs |
1.27 mm |
85 Cel |
-40 Cel |
TIN LEAD |
DUAL |
R-PDSO-G16 |
1 |
1.75 mm |
3.9 mm |
Not Qualified |
e0 |
240 |
9.9 mm |
|||||||
Analog Devices |
ATM/SONET/SDH TRANSCEIVER |
INDUSTRIAL |
NO LEAD |
56 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.4 mm |
85 Cel |
-40 Cel |
QUAD |
S-XQCC-N56 |
.9 mm |
7 mm |
Not Qualified |
7 mm |
|||||||||||||||||
|
Analog Devices |
ATM/SONET/SDH NETWORK INTERFACE |
INDUSTRIAL |
BALL |
400 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
GRID ARRAY |
1.27 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B400 |
2.54 mm |
27 mm |
Not Qualified |
e1 |
27 mm |
||||||||||||||
Analog Devices |
ATM/SONET/SDH TRANSCEIVER |
INDUSTRIAL |
GULL WING |
128 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
SDH; SONET |
YES |
1 |
.35 mA |
3.3 V |
3.3 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP128,.64SQ,16 |
Digital Transmission Interfaces |
.4 mm |
85 Cel |
-40 Cel |
QUAD |
S-PQFP-G128 |
1.6 mm |
14 mm |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
14 mm |
||||||||||
Analog Devices |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
GULL WING |
64 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1.8 V |
FLATPACK, LOW PROFILE, FINE PITCH |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-PQFP-G64 |
1.6 mm |
10 mm |
Not Qualified |
10 mm |
|||||||||||||||||
Analog Devices |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
GULL WING |
64 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1.8 V |
FLATPACK, LOW PROFILE, FINE PITCH |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-PQFP-G64 |
1.6 mm |
10 mm |
Not Qualified |
10 mm |
|||||||||||||||||
|
Analog Devices |
ATM/SONET/SDH NETWORK INTERFACE |
INDUSTRIAL |
BALL |
400 |
BGA |
SQUARE |
PLASTIC/EPOXY |
ATM; SDH; SONET |
YES |
1 |
.381 mA |
3.3 V |
3.3 |
GRID ARRAY |
BGA400,20X20,50 |
ATM/SONET/SDH ICs |
1.27 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B400 |
2.54 mm |
27 mm |
Not Qualified |
e1 |
27 mm |
|||||||||
|
Analog Devices |
ATM/SONET/SDH SWITCHING CIRCUIT |
INDUSTRIAL |
NO LEAD |
56 |
HVQCCN |
RECTANGULAR |
UNSPECIFIED |
SDH; SONET |
YES |
1 |
BICMOS |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
QUAD |
R-XQCC-N56 |
3 |
.8 mm |
5 mm |
Not Qualified |
e3 |
30 |
260 |
11 mm |
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Analog Devices |
ATM/SONET/SDH TRANSCEIVER |
INDUSTRIAL |
GULL WING |
128 |
HLFQFP |
SQUARE |
PLASTIC/EPOXY |
SDH; SONET |
YES |
1 |
.35 mA |
3.3 V |
3.3 |
FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH |
QFP128,.64SQ,16 |
Digital Transmission Interfaces |
.4 mm |
85 Cel |
-40 Cel |
QUAD |
S-PQFP-G128 |
1.6 mm |
14 mm |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
14 mm |
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|
Analog Devices |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
BALL |
256 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1.8 V |
GRID ARRAY, LOW PROFILE |
1 mm |
85 Cel |
-40 Cel |
BOTTOM |
S-PBGA-B256 |
1.7 mm |
17 mm |
NOT SPECIFIED |
NOT SPECIFIED |
17 mm |
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|
Analog Devices |
ATM/SONET/SDH NETWORK INTERFACE |
COMMERCIAL |
BALL |
400 |
BGA |
SQUARE |
PLASTIC/EPOXY |
ATM; SDH; SONET |
YES |
1 |
.381 mA |
3.3 V |
3.3 |
GRID ARRAY |
BGA400,20X20,50 |
ATM/SONET/SDH ICs |
1.27 mm |
70 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B400 |
2.54 mm |
27 mm |
Not Qualified |
e1 |
27 mm |
ATM (Asynchronous Transfer Mode), SONET (Synchronous Optical Network), and SDH (Synchronous Digital Hierarchy) circuits are high-speed communication technologies used in telecommunications networks.
ATM is a cell-based network technology that enables high-speed data transfer, video and voice communication. It divides data into fixed-size cells and sends them across the network using time-division multiplexing (TDM).
SONET and SDH are both standard protocols for optical telecommunications transport. They use synchronous timing signals to enable high-speed communication over fiber optic networks. SONET is used primarily in North America, while SDH is used primarily in Europe and other regions.
ATM, SONET, and SDH circuits offer several advantages over other communication technologies. They provide high-speed communication with low latency, allowing for efficient data transfer and real-time voice and video communication. They also provide a high level of reliability and fault tolerance, making them ideal for use in mission-critical applications such as banking, healthcare, and defense.
However, these circuits also require specialized hardware and software, and can be more expensive to implement and maintain than other communication technologies. They also require a high level of expertise to configure and manage.