Part | RoHS | Manufacturer | Telecom IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Package Body Material | Applications | Surface Mount | No. of Functions | No. of Channels | Technology | Nominal Negative Supply Voltage | Maximum Supply Current | Nominal Supply Voltage | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Minimum Operating Temperature | Terminal Finish | Terminal Position | Data Rate | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Analog Devices |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
NO LEAD |
20 |
HVQCCN |
SQUARE |
UNSPECIFIED |
ATM |
YES |
1 |
BIPOLAR |
.045 mA |
3.3 V |
3/5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC20,.16SQ,20 |
ATM/SONET/SDH ICs |
.5 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
QUAD |
S-XQCC-N20 |
1 |
.8 mm |
4 mm |
Not Qualified |
e3 |
30 |
260 |
4 mm |
|||||
|
Analog Devices |
ATM/SONET/SDH SERIAL TO PARALLEL/PARALLEL TO SERIAL CONVERTER |
INDUSTRIAL |
GULL WING |
64 |
TFQFP |
SQUARE |
PLASTIC/EPOXY |
SDH; SONET |
YES |
1 |
.38 mA |
3.3 V |
3.3 |
FLATPACK, THIN PROFILE, FINE PITCH |
TQFP64,.47SQ |
ATM/SONET/SDH ICs |
.5 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
QUAD |
S-PQFP-G64 |
3 |
1.2 mm |
10 mm |
Not Qualified |
e3 |
10 mm |
||||||||
|
Analog Devices |
ATM/SONET/SDH CLOCK RECOVERY CIRCUIT |
INDUSTRIAL |
GULL WING |
32 |
TFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
BIPOLAR |
3.3 V |
FLATPACK, THIN PROFILE, FINE PITCH |
.5 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
QUAD |
S-PQFP-G32 |
1 |
1.2 mm |
5 mm |
Not Qualified |
e3 |
30 |
260 |
5 mm |
||||||||||
|
Analog Devices |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
NO LEAD |
20 |
HVQCCN |
SQUARE |
UNSPECIFIED |
ATM |
YES |
1 |
BIPOLAR |
.045 mA |
3.3 V |
3/5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC20,.16SQ,20 |
ATM/SONET/SDH ICs |
.5 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
QUAD |
S-XQCC-N20 |
1 |
.8 mm |
4 mm |
Not Qualified |
e3 |
30 |
260 |
4 mm |
|||||
|
Analog Devices |
ATM/SONET/SDH CLOCK RECOVERY CIRCUIT |
INDUSTRIAL |
GULL WING |
32 |
HTFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH |
.5 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
QUAD |
S-PQFP-G32 |
1.2 mm |
5 mm |
Not Qualified |
e3 |
5 mm |
||||||||||||||
|
Analog Devices |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
GULL WING |
16 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
SONET |
YES |
1 |
BIPOLAR |
.027 mA |
3.3 V |
3.3/5 |
SMALL OUTLINE, SHRINK PITCH |
SSOP16,.25 |
ATM/SONET/SDH ICs |
.635 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
R-PDSO-G16 |
1 |
1.75 mm |
3.9 mm |
Not Qualified |
e3 |
30 |
260 |
4.9 mm |
|||||
|
Analog Devices |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
NO LEAD |
16 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
BIPOLAR |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
95 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
QUAD |
S-XQCC-N16 |
1 |
.8 mm |
3 mm |
e3 |
30 |
260 |
3 mm |
|||||||||||
Analog Devices |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
NO LEAD |
20 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
BIPOLAR |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
QUAD |
S-XQCC-N20 |
1 |
1 mm |
4 mm |
Not Qualified |
e0 |
4 mm |
|||||||||||||
|
Analog Devices |
ATM/SONET/SDH SERIAL TO PARALLEL/PARALLEL TO SERIAL CONVERTER |
INDUSTRIAL |
GULL WING |
64 |
HTFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH |
.5 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
QUAD |
S-PQFP-G64 |
3 |
1.2 mm |
10 mm |
Not Qualified |
e3 |
10 mm |
|||||||||||||
|
Analog Devices |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
BIPOLAR |
3.3 V |
SMALL OUTLINE |
1.27 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
R-PDSO-G8 |
1 |
1.75 mm |
3.9 mm |
Not Qualified |
e3 |
4.9 mm |
||||||||||||
|
Analog Devices |
ATM/SONET/SDH CLOCK RECOVERY CIRCUIT |
INDUSTRIAL |
NO LEAD |
32 |
QCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
BIPOLAR |
215 mA |
3.3 V |
3.3 |
CHIP CARRIER |
LCC32,.2SQ,20 |
ATM/SONET/SDH ICs |
.5 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
QUAD |
S-PQCC-N32 |
Not Qualified |
e3 |
|||||||||||||
Analog Devices |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
NO LEAD |
7 |
DIE |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
3.3 V |
UNCASED CHIP |
85 Cel |
-40 Cel |
TIN LEAD |
UPPER |
R-XUUC-N7 |
Not Qualified |
e0 |
|||||||||||||||||||
|
Analog Devices |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
GULL WING |
16 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
SONET |
YES |
1 |
BIPOLAR |
.027 mA |
3.3 V |
3.3/5 |
SMALL OUTLINE, SHRINK PITCH |
SSOP16,.25 |
ATM/SONET/SDH ICs |
.635 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
R-PDSO-G16 |
1 |
1.75 mm |
3.9 mm |
Not Qualified |
e3 |
30 |
260 |
4.9 mm |
|||||
Analog Devices |
ATM/SONET/SDH SERIAL TO PARALLEL/PARALLEL TO SERIAL CONVERTER |
INDUSTRIAL |
GULL WING |
28 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
SMALL OUTLINE, SHRINK PITCH |
.65 mm |
85 Cel |
-40 Cel |
DUAL |
R-PDSO-G28 |
1.99 mm |
5.29 mm |
10.2 mm |
||||||||||||||||||
|
Analog Devices |
ATM/SONET/SDH CLOCK RECOVERY CIRCUIT |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
SDH; SONET |
YES |
1 |
BIPOLAR |
.215 mA |
3.3 V |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
ATM/SONET/SDH ICs |
.5 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
QUAD |
S-XQCC-N32 |
1 |
.8 mm |
5 mm |
Not Qualified |
e3 |
30 |
260 |
5 mm |
|||||
Analog Devices |
ATM/SONET/SDH SERIAL TO PARALLEL/PARALLEL TO SERIAL CONVERTER |
INDUSTRIAL |
GULL WING |
28 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
ATM; SDH; SONET |
YES |
1 |
BIPOLAR |
90 mA |
3.3 V |
3.3 |
SMALL OUTLINE, SHRINK PITCH |
SSOP28,.3 |
ATM/SONET/SDH ICs |
.65 mm |
85 Cel |
-40 Cel |
TIN LEAD |
DUAL |
R-PDSO-G28 |
1 |
1.99 mm |
5.29 mm |
Not Qualified |
e0 |
10.2 mm |
||||||||
Analog Devices |
ATM/SONET/SDH SERIAL TO PARALLEL/PARALLEL TO SERIAL CONVERTER |
||||||||||||||||||||||||||||||||||||
|
Analog Devices |
INDUSTRIAL |
NO LEAD |
16 |
QCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
62 mA |
3/3.3 |
CHIP CARRIER |
LCC16,.12SQ,20 |
ATM/SONET/SDH ICs |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-PQCC-N16 |
1 |
Not Qualified |
e3 |
30 |
260 |
||||||||||||
|
Analog Devices |
ATM/SONET/SDH CLOCK RECOVERY CIRCUIT |
INDUSTRIAL |
NO LEAD |
16 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
CMOS |
62 mA |
3.3 V |
3/3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC16,.12SQ,20 |
ATM/SONET/SDH ICs |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N16 |
1 |
.8 mm |
3 mm |
Not Qualified |
e3 |
30 |
260 |
3 mm |
||||||
Analog Devices |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
NO LEAD |
6 |
DIE |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
BIPOLAR |
3.3 V |
UNCASED CHIP |
85 Cel |
-40 Cel |
TIN LEAD |
UPPER |
R-XUUC-N6 |
Not Qualified |
e0 |
||||||||||||||||||
|
Analog Devices |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
GULL WING |
10 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
BIPOLAR |
43 mA |
3.3 V |
3.3 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP10,.19,20 |
ATM/SONET/SDH ICs |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
DUAL |
S-PDSO-G10 |
1 |
1.1 mm |
3 mm |
Not Qualified |
e3 |
30 |
260 |
3 mm |
||||||
|
Analog Devices |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
SONET |
YES |
1 |
BIPOLAR |
.027 mA |
3.3 V |
3.3/5 |
SMALL OUTLINE |
SOP16,.25 |
ATM/SONET/SDH ICs |
1.27 mm |
85 Cel |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-G16 |
1 |
1.75 mm |
3.9 mm |
Not Qualified |
e3 |
30 |
260 |
9.9 mm |
|||||
|
Analog Devices |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
NO LEAD |
20 |
HVQCCN |
SQUARE |
UNSPECIFIED |
ATM; SDH; SONET |
YES |
1 |
BIPOLAR |
.044 mA |
3.3 V |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC20,.16SQ,20 |
ATM/SONET/SDH ICs |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N20 |
1 |
.8 mm |
4 mm |
Not Qualified |
e3 |
30 |
260 |
4 mm |
|||||
|
Analog Devices |
ATM/SONET/SDH CLOCK RECOVERY CIRCUIT |
INDUSTRIAL |
GULL WING |
32 |
TFQFP |
SQUARE |
PLASTIC/EPOXY |
ATM; SDH; SONET |
YES |
1 |
BIPOLAR |
.111 mA |
3.3 V |
3.3/5 |
FLATPACK, THIN PROFILE, FINE PITCH |
QFP32,.35SQ,32 |
ATM/SONET/SDH ICs |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-PQFP-G32 |
1 |
1.2 mm |
5 mm |
Not Qualified |
e3 |
30 |
260 |
5 mm |
|||||
|
Analog Devices |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
NO LEAD |
24 |
HVQCCN |
SQUARE |
UNSPECIFIED |
SDH; SONET |
YES |
1 |
BIPOLAR |
-5.2 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N24 |
1 |
.8 mm |
4 mm |
Not Qualified |
e3 |
30 |
260 |
4 mm |
|||||||||
|
Analog Devices |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
NO LEAD |
20 |
HVQCCN |
SQUARE |
UNSPECIFIED |
ATM; SDH; SONET |
YES |
1 |
BIPOLAR |
.044 mA |
3.3 V |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC20,.16SQ,20 |
ATM/SONET/SDH ICs |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N20 |
1 |
.8 mm |
4 mm |
Not Qualified |
e3 |
30 |
260 |
4 mm |
|||||
|
Analog Devices |
ATM/SONET/SDH CLOCK RECOVERY CIRCUIT |
INDUSTRIAL |
NO LEAD |
20 |
HVQCCN |
SQUARE |
UNSPECIFIED |
SDH; SONET |
YES |
1 |
BICMOS |
.142 mA |
3.3 V |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC20,.16SQ,20 |
ATM/SONET/SDH ICs |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N20 |
1 |
1 mm |
4 mm |
Not Qualified |
e3 |
30 |
260 |
4 mm |
|||||
|
Analog Devices |
ATM/SONET/SDH SWITCHING CIRCUIT |
INDUSTRIAL |
NO LEAD |
32 |
VQCCN |
SQUARE |
UNSPECIFIED |
ATM; SDH; SONET |
YES |
1 |
BIPOLAR |
3.3 V |
CHIP CARRIER, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N32 |
1 |
.8 mm |
5 mm |
Not Qualified |
e3 |
30 |
260 |
5 mm |
|||||||||
|
Analog Devices |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
NO LEAD |
24 |
QCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
BIPOLAR |
-5.2 V |
CHIP CARRIER |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N24 |
1 |
Not Qualified |
e3 |
30 |
260 |
||||||||||||||
|
Analog Devices |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
NO LEAD |
24 |
QCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
BIPOLAR |
-5.2 V |
CHIP CARRIER |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N24 |
1 |
Not Qualified |
e3 |
30 |
260 |
||||||||||||||
Analog Devices |
ATM/SONET/SDH SERIAL TO PARALLEL/PARALLEL TO SERIAL CONVERTER |
||||||||||||||||||||||||||||||||||||
|
Analog Devices |
ATM/SONET/SDH CLOCK RECOVERY CIRCUIT |
INDUSTRIAL |
NO LEAD |
20 |
HVQCCN |
SQUARE |
UNSPECIFIED |
SDH; SONET |
YES |
1 |
BICMOS |
.142 mA |
3.3 V |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC20,.16SQ,20 |
ATM/SONET/SDH ICs |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N20 |
1 |
1 mm |
4 mm |
Not Qualified |
e3 |
30 |
260 |
4 mm |
|||||
|
Analog Devices |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
NO LEAD |
10 |
SON |
SQUARE |
PLASTIC/EPOXY |
SONET |
YES |
1 |
BIPOLAR |
.041 mA |
3.3 V |
3.3 |
SMALL OUTLINE |
TSSOP10,.19,20 |
ATM/SONET/SDH ICs |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
DUAL |
S-PDSO-N10 |
1 |
.8 mm |
3 mm |
Not Qualified |
e3 |
30 |
260 |
3 mm |
|||||
|
Analog Devices |
INDUSTRIAL |
NO LEAD |
20 |
QCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
.045 mA |
3.3/5 |
CHIP CARRIER |
LCC20,.16SQ,20 |
ATM/SONET/SDH ICs |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-PQCC-N20 |
1 |
Not Qualified |
e3 |
30 |
260 |
||||||||||||
|
Analog Devices |
ATM/SONET/SDH CLOCK RECOVERY CIRCUIT |
INDUSTRIAL |
GULL WING |
32 |
TFQFP |
SQUARE |
PLASTIC/EPOXY |
ATM; SDH; SONET |
YES |
1 |
BIPOLAR |
.111 mA |
3.3 V |
3.3/5 |
FLATPACK, THIN PROFILE, FINE PITCH |
QFP32,.35SQ,32 |
ATM/SONET/SDH ICs |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-PQFP-G32 |
1 |
1.2 mm |
5 mm |
Not Qualified |
e3 |
30 |
260 |
5 mm |
|||||
Analog Devices |
ATM/SONET/SDH SUPPORT CIRCUIT |
||||||||||||||||||||||||||||||||||||
|
Analog Devices |
ATM/SONET/SDH SERIAL TO PARALLEL/PARALLEL TO SERIAL CONVERTER |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
BICMOS |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
95 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N32 |
1 |
.8 mm |
5 mm |
e3 |
30 |
260 |
5 mm |
|||||||||||
|
Analog Devices |
INDUSTRIAL |
GULL WING |
10 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
BIPOLAR |
43 mA |
3.3 V |
3.3 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP10,.19,20 |
ATM/SONET/SDH ICs |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-G10 |
1 |
Not Qualified |
e3 |
30 |
260 |
||||||||||
|
Analog Devices |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
NO LEAD |
7 |
DIE |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
BIPOLAR |
3.3 V |
UNCASED CHIP |
85 Cel |
-40 Cel |
UPPER |
R-XUUC-N7 |
NOT SPECIFIED |
NOT SPECIFIED |
||||||||||||||||||
|
Analog Devices |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
GULL WING |
8 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
SDH; SONET |
YES |
1 |
3.3 V |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
.65 mm |
85 Cel |
-40 Cel |
MATTE TIN |
DUAL |
S-PDSO-G8 |
1 |
1.1 mm |
3 mm |
Not Qualified |
e3 |
30 |
260 |
3 mm |
||||||||||
Analog Devices |
ATM/SONET/SDH SUPPORT CIRCUIT |
||||||||||||||||||||||||||||||||||||
|
Analog Devices |
ATM/SONET/SDH SWITCHING CIRCUIT |
INDUSTRIAL |
NO LEAD |
32 |
VQCCN |
SQUARE |
UNSPECIFIED |
ATM; SDH; SONET |
YES |
1 |
BIPOLAR |
3.3 V |
CHIP CARRIER, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N32 |
1 |
.8 mm |
5 mm |
Not Qualified |
e3 |
30 |
260 |
5 mm |
ATM (Asynchronous Transfer Mode), SONET (Synchronous Optical Network), and SDH (Synchronous Digital Hierarchy) circuits are high-speed communication technologies used in telecommunications networks.
ATM is a cell-based network technology that enables high-speed data transfer, video and voice communication. It divides data into fixed-size cells and sends them across the network using time-division multiplexing (TDM).
SONET and SDH are both standard protocols for optical telecommunications transport. They use synchronous timing signals to enable high-speed communication over fiber optic networks. SONET is used primarily in North America, while SDH is used primarily in Europe and other regions.
ATM, SONET, and SDH circuits offer several advantages over other communication technologies. They provide high-speed communication with low latency, allowing for efficient data transfer and real-time voice and video communication. They also provide a high level of reliability and fault tolerance, making them ideal for use in mission-critical applications such as banking, healthcare, and defense.
However, these circuits also require specialized hardware and software, and can be more expensive to implement and maintain than other communication technologies. They also require a high level of expertise to configure and manage.