16 Cellphone ICs 160

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
ADL5561ACPZ-R7	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N16	3	1 mm	3 mm		e3	30	260	3 mm
ADL5561ACPZ-WP	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N16	3	1 mm	3 mm		e3	30	260	3 mm
LT5526EUF#PBF	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-PQCC-N16	1	.8 mm	4 mm	Not Qualified	e3	30	260	4 mm
1185	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	85 Cel	-40 Cel		QUAD		S-PQCC-N16		.95 mm	4 mm	Not Qualified				4 mm
RFX2401C	Skyworks Solutions	RF AND BASEBAND CIRCUIT	AUTOMOTIVE	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	125 Cel	-40 Cel		QUAD		S-XQCC-N16		.6 mm	3 mm			NOT SPECIFIED	NOT SPECIFIED	3 mm
CC2591RGVR	Texas Instruments	RF FRONT END CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1		4 mA	3 V	3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.16SQ,25	Other Telecom ICs	.65 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N16	2	1 mm	4 mm	Not Qualified	e4	30	260	4 mm
LT5575EUF#TRPBF	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-PQCC-N16	1	.8 mm	4 mm	Not Qualified	e3	30	260	4 mm
LT5575EUF#PBF	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-PQCC-N16	1	.8 mm	4 mm	Not Qualified	e3	30	260	4 mm
LT5558EUF#PBF	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-PQCC-N16	1	.8 mm	4 mm	Not Qualified	e3	30	260	4 mm
CC2591RGVRG4	Texas Instruments	RF FRONT END CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1		4 mA	3 V	3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.16SQ,25	Other Telecom ICs	.65 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N16	2	1 mm	4 mm	Not Qualified	e4	30	260	4 mm
1168	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	85 Cel	-40 Cel		QUAD		S-PQCC-N16		.95 mm	4 mm	Not Qualified				4 mm
LT5527EUF#PBF	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-PQCC-N16	1	.8 mm	4 mm	Not Qualified	e3	30	260	4 mm
LX5584BLQ-TR	Microchip Technology	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	16	HQCCN	SQUARE	UNSPECIFIED	YES	1			5 V		CHIP CARRIER, HEAT SINK/SLUG			.5 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N16		1.023 mm	3 mm					3 mm
SKY66420-11	Skyworks Solutions	RF AND BASEBAND CIRCUIT		NO LEAD	16	HVQCCN	SQUARE		YES	1			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.1SQ,20		.5 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N16		.8 mm	3 mm			NOT SPECIFIED	NOT SPECIFIED	3 mm
MC13142D	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel		DUAL		R-PDSO-G16		1.75 mm	3.9 mm					9.9 mm
SKY66423-11	Skyworks Solutions	RF AND BASEBAND CIRCUIT		NO LEAD	16	HVQCCN	SQUARE		YES	1			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.1SQ,20		.5 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N16		.8 mm	3 mm			NOT SPECIFIED	NOT SPECIFIED	3 mm
SKY66291-11	Skyworks Solutions	RF AND BASEBAND CIRCUIT	OTHER	UNSPECIFIED	16					1			5 V									UNSPECIFIED		S-XXSS-X16	3						260
LT5521EUF#PBF	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-PQCC-N16	1	.8 mm	4 mm	Not Qualified	e3	30	260	4 mm
SKY65933-11	Skyworks Solutions	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	16		SQUARE	UNSPECIFIED	YES	1			1.8 V		MICROELECTRONIC ASSEMBLY			.475 mm	85 Cel	-40 Cel		QUAD		S-XQMA-N16		.8 mm	2.5 mm			NOT SPECIFIED	NOT SPECIFIED	2.5 mm
SKY66121-11	Skyworks Solutions	RF AND BASEBAND CIRCUIT		NO LEAD	16	HVQCCN	SQUARE		YES	1		600 mA	3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.16SQ,32		.8 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N16	3	.81 mm	4 mm				260	4 mm
RFX1010	Skyworks Solutions	RF AND BASEBAND CIRCUIT	AUTOMOTIVE	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	125 Cel	-40 Cel		QUAD		S-XQCC-N16		.6 mm	3 mm			NOT SPECIFIED	NOT SPECIFIED	3 mm
RFX2402E	Skyworks Solutions	RF AND BASEBAND CIRCUIT	AUTOMOTIVE	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	125 Cel	-40 Cel		QUAD		S-XQCC-N16		.6 mm	3 mm			NOT SPECIFIED	NOT SPECIFIED	3 mm
RFX2411	Skyworks Solutions	RF AND BASEBAND CIRCUIT	AUTOMOTIVE	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	125 Cel	-40 Cel		QUAD		S-XQCC-N16		.6 mm	3 mm			NOT SPECIFIED	NOT SPECIFIED	3 mm
RFX5000B	Skyworks Solutions	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N16		.6 mm	3 mm			NOT SPECIFIED	NOT SPECIFIED	3 mm
SE5007BT-R	Skyworks Solutions	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N16		.6 mm	3 mm			NOT SPECIFIED	NOT SPECIFIED	3 mm
SKY66115-11	Skyworks Solutions	RF AND BASEBAND CIRCUIT		NO LEAD	16	HVQCCN	SQUARE		YES	1			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.16SQ,32		.8 mm	85 Cel	-40 Cel	GOLD OVER NICKEL	QUAD		S-XQCC-N16	3	1 mm	4 mm		e4		260	4 mm
1605C	Murata Manufacturing	BASEBAND CIRCUIT	COMMERCIAL	THROUGH-HOLE	16	DIP	RECTANGULAR	UNSPECIFIED	NO	1					IN-LINE			2.54 mm	70 Cel	0 Cel		DUAL		R-XDIP-T16		6.84 mm	7.62 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	22.5 mm
HPA02142RGVR	Texas Instruments	RF AND BASEBAND CIRCUIT		NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1		4 mA	3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.16SQ,25		.65 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N16	2	1 mm	4 mm		e4	30	260	4 mm
LP3939ILQ	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-PQCC-N16		.8 mm	4 mm					4 mm
LP3939ILQX	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-PQCC-N16		.8 mm	4 mm					4 mm
HPA00420RGVR	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N16	2	1 mm	4 mm		e4	30	260	4 mm
HPA01083RGVR	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N16	2	1 mm	4 mm		e4	30	260	4 mm
HPA00452RSTR	Texas Instruments	RF AND BASEBAND CIRCUIT		NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.16SQ,25		.65 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N16	3	.95 mm	4 mm		e4	30	260	4 mm
CC2591RGVTG4	Texas Instruments	RF FRONT END CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1		4 mA	3 V	3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.16SQ,25	Other Telecom ICs	.65 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N16	2	1 mm	4 mm	Not Qualified	e4	30	260	4 mm
CC2591RGVT	Texas Instruments	RF FRONT END CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1		4 mA	3 V	3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.16SQ,25	Other Telecom ICs	.65 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N16	2	1 mm	4 mm	Not Qualified	e4	30	260	4 mm
CC1150RGVT	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	85 Cel	-40 Cel	Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)	QUAD	.5 Mbps	S-PQCC-N16	3	1 mm	4 mm		e4	30	260	4 mm
TRF3701IRHC	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			5 V	5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.16SQ,32	Other Telecom ICs	.8 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N16	2	1 mm	4 mm	Not Qualified	e4	30	260	4 mm
TRF3701CRHCR	Texas Instruments	RF AND BASEBAND CIRCUIT	COMMERCIAL	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			5 V	5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.16SQ,32	Other Telecom ICs	.8 mm	70 Cel	0 Cel		QUAD		S-PQCC-N16		1 mm	4 mm	Not Qualified				4 mm
CC1150-RTY1	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS		3 V	1.8/3.6	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.16SQ,25	Other Telecom ICs	.65 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-XQCC-N16	3	.95 mm	4 mm	Not Qualified	e4	30	260	4 mm
CC1150RSTRG3	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS		3 V	1.8/3.6	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.16SQ,25	Other Telecom ICs	.65 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-XQCC-N16	3	.95 mm	4 mm	Not Qualified	e4	30	260	4 mm
TRF3702IRHCG4	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1		.17 mA	5 V	5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.16SQ,32	Other Telecom ICs	.8 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N16	2	1 mm	4 mm	Not Qualified	e4	30	260	4 mm
CC1150RSTG3	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS		3 V	1.8/3.6	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.16SQ,25	Other Telecom ICs	.65 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-XQCC-N16	3	.95 mm	4 mm	Not Qualified	e4	30	260	4 mm
CC1150-RTR1	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS		3 V	1.8/3.6	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.16SQ,25	Other Telecom ICs	.65 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-XQCC-N16	3	.95 mm	4 mm	Not Qualified	e4	30	260	4 mm
TRF3702IRHC	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1		.17 mA	5 V	5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.16SQ,32	Other Telecom ICs	.8 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N16	2	1 mm	4 mm	Not Qualified	e4	30	260	4 mm
TRF3701IRHCR	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			5 V	5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.16SQ,32	Other Telecom ICs	.8 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N16	2	1 mm	4 mm	Not Qualified	e4	30	260	4 mm
TRF3701IRHCG4	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1		.145 mA	5 V	5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.16SQ,32	Other Telecom ICs	.8 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N16	2	1 mm	4 mm	Not Qualified	e4	30	260	4 mm
TRF3702IRHCR	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1		.17 mA	5 V	5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.16SQ,32	Other Telecom ICs	.8 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N16	2	1 mm	4 mm	Not Qualified	e4	30	260	4 mm
TRF3701CRHC	Texas Instruments	RF AND BASEBAND CIRCUIT	COMMERCIAL	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			5 V	5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.16SQ,32	Other Telecom ICs	.8 mm	70 Cel	0 Cel		QUAD		S-PQCC-N16		1 mm	4 mm	Not Qualified				4 mm

Cellphone ICs

Cellphone ICs (Integrated Circuits) are the electronic components that provide the processing power and functionality for modern cellphones. They are responsible for a wide range of functions, including signal processing, data storage, and communication protocols.

Some common types of cellphone ICs include:

1. Baseband processors: These ICs are responsible for handling the core functions of a cellphone, such as making calls and sending messages. They also manage the cellphone's power consumption and system resources.

2. Radio frequency (RF) transceivers: These ICs are responsible for transmitting and receiving RF signals over cellular networks. They also provide the ability to switch between different network bands and frequencies.

3. Power management ICs: These ICs manage the power supply and battery life of a cellphone. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

4. Memory ICs: These ICs provide storage for the cellphone's operating system, applications, and user data. They include flash memory, RAM, and other types of non-volatile memory.

5. Sensor ICs: These ICs provide sensing capabilities, such as accelerometers, gyroscopes, and proximity sensors. They enable the cellphone to detect motion, orientation, and other environmental conditions.