16 Cellphone ICs 160

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Maximum Supply Current	Nominal Supply Voltage	Package Style (Meter)	Package Equivalence Code	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
LT5522EUF#PBF	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			5 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.65 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-PQCC-N16	1	.8 mm	4 mm	Not Qualified	e3	30	260	4 mm
LT5571EUF	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			5 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.65 mm	85 Cel	-40 Cel	Tin/Lead (Sn/Pb)	QUAD	S-PQCC-N16	1	.8 mm	4 mm	Not Qualified	e0			4 mm
LT5526EUF	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			5 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.65 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-PQCC-N16	1	.8 mm	4 mm	Not Qualified	e0			4 mm
LT5515EUF	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			5 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.65 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-PQCC-N16	1	.8 mm	4 mm	Not Qualified	e0			4 mm
LT5522EUF#TR	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			5 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.65 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-PQCC-N16	1	.8 mm	4 mm	Not Qualified	e0			4 mm
LT5527EUF#TRPBF	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			5 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.65 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-PQCC-N16	1	.8 mm	4 mm	Not Qualified	e3	30	260	4 mm
LT5520EUF#TRPBF	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			5 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.65 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-PQCC-N16	1	.8 mm	4 mm	Not Qualified	e3	30	260	4 mm
LT5522EUF#TRPBF	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			5 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.65 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-PQCC-N16	1	.8 mm	4 mm	Not Qualified	e3	30	260	4 mm
LT5525EUF	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			5 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.65 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-PQCC-N16	1	.8 mm	4 mm	Not Qualified	e0			4 mm
LT5515EUF#TR	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			5 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.65 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-PQCC-N16	1	.8 mm	4 mm	Not Qualified	e0			4 mm
LT5526EUF#TRPBF	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			5 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.65 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-PQCC-N16	1	.8 mm	4 mm	Not Qualified	e3	30	260	4 mm
MAX2685EEE+	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	16	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3 V	SMALL OUTLINE, SHRINK PITCH		.635 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL	R-PDSO-G16	1	1.73 mm	3.9 mm	Not Qualified	e3	30	260	4.89 mm
MAX2685EEE+T	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	16	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3 V	SMALL OUTLINE, SHRINK PITCH		.635 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL	R-PDSO-G16	1	1.73 mm	3.9 mm	Not Qualified	e3	30	260	4.89 mm
935299973518	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	16	HQCCN	SQUARE	PLASTIC/EPOXY	YES	1			5 V	CHIP CARRIER, HEAT SINK/SLUG		1.42 mm	85 Cel	-40 Cel		QUAD	S-PQCC-N16		1.4 mm	8 mm					8 mm
935296759115	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	16	HQCCN	SQUARE	PLASTIC/EPOXY	YES	1			5 V	CHIP CARRIER, HEAT SINK/SLUG		1.42 mm	85 Cel	-40 Cel		QUAD	S-PQCC-N16		1.4 mm	8 mm					8 mm
935300584518	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	16	HQCCN	SQUARE	PLASTIC/EPOXY	YES	1			5 V	CHIP CARRIER, HEAT SINK/SLUG		1.42 mm	85 Cel	-40 Cel		QUAD	S-PQCC-N16		1.4 mm	8 mm					8 mm
935296759518	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	16	HQCCN	SQUARE	PLASTIC/EPOXY	YES	1			5 V	CHIP CARRIER, HEAT SINK/SLUG		1.42 mm	85 Cel	-40 Cel		QUAD	S-PQCC-N16		1.4 mm	8 mm					8 mm
935296762518	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	16	HQCCN	SQUARE	PLASTIC/EPOXY	YES	1			5 V	CHIP CARRIER, HEAT SINK/SLUG		1.42 mm	85 Cel	-40 Cel		QUAD	S-PQCC-N16		1.4 mm	8 mm					8 mm
935295517115	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	16	HQCCN	SQUARE	PLASTIC/EPOXY	YES	1			5 V	CHIP CARRIER, HEAT SINK/SLUG		1.42 mm	85 Cel	-40 Cel		QUAD	S-PQCC-N16		1.4 mm	8 mm					8 mm
935295517518	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	16	HQCCN	SQUARE	PLASTIC/EPOXY	YES	1			5 V	CHIP CARRIER, HEAT SINK/SLUG		1.42 mm	85 Cel	-40 Cel		QUAD	S-PQCC-N16		1.4 mm	8 mm					8 mm
935296762115	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	16	HQCCN	SQUARE	PLASTIC/EPOXY	YES	1			5 V	CHIP CARRIER, HEAT SINK/SLUG		1.42 mm	85 Cel	-40 Cel		QUAD	S-PQCC-N16		1.4 mm	8 mm					8 mm
BLM6G10-30G,118	NXP Semiconductors	BASEBAND CIRCUIT		GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			28 V	SMALL OUTLINE		1.37 mm			TIN	DUAL	R-PDSO-G16	3	3.6 mm	11 mm		e3	30	245	15.9 mm
934060893135	NXP Semiconductors	BASEBAND CIRCUIT		GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			28 V	SMALL OUTLINE		1.37 mm				DUAL	R-PDSO-G16		3.6 mm	11 mm					15.9 mm
BGU7060	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	16	HQCCN	SQUARE	PLASTIC/EPOXY	YES	1			5 V	CHIP CARRIER, HEAT SINK/SLUG		1.42 mm	85 Cel	-40 Cel		QUAD	S-PQCC-N16		1.4 mm	8 mm					8 mm
934060893127	NXP Semiconductors	BASEBAND CIRCUIT		GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			28 V	SMALL OUTLINE		1.37 mm				DUAL	R-PDSO-G16		3.6 mm	11 mm					15.9 mm
934060304118	NXP Semiconductors	BASEBAND CIRCUIT		GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			28 V	SMALL OUTLINE						DUAL	R-PDSO-G16		3.6 mm	11 mm					15.9 mm
SA3603DH	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS		2.8 V	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		.65 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G16		1.2 mm	4.4 mm	Not Qualified	e4			5 mm
934060304135	NXP Semiconductors	BASEBAND CIRCUIT		GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			28 V	SMALL OUTLINE						DUAL	R-PDSO-G16		3.6 mm	11 mm					15.9 mm
BGU7063,115	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	16	HQCCN	SQUARE	PLASTIC/EPOXY	YES	1			5 V	CHIP CARRIER, HEAT SINK/SLUG		1.42 mm	85 Cel	-40 Cel		QUAD	S-PQCC-N16		1.4 mm	8 mm					8 mm
BLM6G10-30G,135	NXP Semiconductors	BASEBAND CIRCUIT		GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			28 V	SMALL OUTLINE		1.37 mm			Tin (Sn)	DUAL	R-PDSO-G16		3.6 mm	11 mm		e3			15.9 mm
BGU7061,518	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	16	HQCCN	SQUARE	PLASTIC/EPOXY	YES	1			5 V	CHIP CARRIER, HEAT SINK/SLUG		1.42 mm	85 Cel	-40 Cel		QUAD	S-PQCC-N16	3	1.4 mm	8 mm				260	8 mm
MRFIC1814	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3 V	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		.65 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G16		1.2 mm	4.4 mm	Not Qualified
SA3604DH	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS		2.8 V	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		.65 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G16		1.2 mm	4.4 mm	Not Qualified	e4			5 mm
BGU7062	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	16	HQCCN	SQUARE	PLASTIC/EPOXY	YES	1			5 V	CHIP CARRIER, HEAT SINK/SLUG		1.42 mm	85 Cel	-40 Cel		QUAD	S-PQCC-N16	3	1.4 mm	8 mm					8 mm
WLAN7102CZ	NXP Semiconductors	RF AND BASEBAND CIRCUIT		NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1		214 mA	3.85 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.07SQ,16	.4 mm	85 Cel	-40 Cel		QUAD	S-PQCC-N16	3	.7 mm	2 mm				260	2 mm
BGU7063,518	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	16	HQCCN	SQUARE	PLASTIC/EPOXY	YES	1			5 V	CHIP CARRIER, HEAT SINK/SLUG		1.42 mm	85 Cel	-40 Cel		QUAD	S-PQCC-N16	3	1.4 mm	8 mm			30	260	8 mm
934060303135	NXP Semiconductors	BASEBAND CIRCUIT		FLAT	16	SOF	RECTANGULAR	PLASTIC/EPOXY	YES	1			28 V	SMALL OUTLINE						DUAL	R-PDSO-F16			11 mm					15.9 mm
BLM6G10-30,127	NXP Semiconductors	BASEBAND CIRCUIT		FLAT	16	SOF	RECTANGULAR	PLASTIC/EPOXY	YES	1			28 V	SMALL OUTLINE					Tin (Sn)	DUAL	R-PDSO-F16			11 mm		e3			15.9 mm
BLM6G10-30	NXP Semiconductors	BASEBAND CIRCUIT		FLAT	16	HSOF	RECTANGULAR	PLASTIC/EPOXY	YES	1			28 V	SMALL OUTLINE, HEAT SINK/SLUG		1.37 mm			TIN	DUAL	R-PDSO-F16			11 mm	Not Qualified	e3			15.9 mm
BGU7060Y	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	16	HQCCN	SQUARE	PLASTIC/EPOXY	YES	1			5 V	CHIP CARRIER, HEAT SINK/SLUG		1.42 mm	85 Cel	-40 Cel		QUAD	S-PQCC-N16	3	1.4 mm	8 mm				260	8 mm
BGU7075	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	16	HQCCN	SQUARE	PLASTIC/EPOXY	YES	1			5 V	CHIP CARRIER, HEAT SINK/SLUG		1.42 mm	85 Cel	-40 Cel		QUAD	S-PQCC-N16		1.4 mm	8 mm					8 mm
934060303118	NXP Semiconductors	BASEBAND CIRCUIT		FLAT	16	SOF	RECTANGULAR	PLASTIC/EPOXY	YES	1			28 V	SMALL OUTLINE						DUAL	R-PDSO-F16			11 mm					15.9 mm
MRFIC1814R2	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3 V	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		.65 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G16		1.2 mm	4.4 mm					5.1 mm
BLM6G10-30,135	NXP Semiconductors	BASEBAND CIRCUIT		FLAT	16	SOF	RECTANGULAR	PLASTIC/EPOXY	YES	1			28 V	SMALL OUTLINE					Tin (Sn)	DUAL	R-PDSO-F16			11 mm		e3			15.9 mm
934060303127	NXP Semiconductors	BASEBAND CIRCUIT		FLAT	16	SOF	RECTANGULAR	PLASTIC/EPOXY	YES	1			28 V	SMALL OUTLINE						DUAL	R-PDSO-F16			11 mm					15.9 mm
BGU7075Y	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	16	HQCCN	SQUARE	PLASTIC/EPOXY	YES	1			5 V	CHIP CARRIER, HEAT SINK/SLUG		1.42 mm	85 Cel	-40 Cel		QUAD	S-PQCC-N16	3	1.4 mm	8 mm				260	8 mm
BLM6G10-30G,127	NXP Semiconductors	BASEBAND CIRCUIT		GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			28 V	SMALL OUTLINE		1.37 mm			Tin (Sn)	DUAL	R-PDSO-G16		3.6 mm	11 mm		e3			15.9 mm
BLM6G10-30G	NXP Semiconductors	BASEBAND CIRCUIT		GULL WING	16	HSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			28 V	SMALL OUTLINE, HEAT SINK/SLUG		1.37 mm			TIN	DUAL	R-PDSO-G16	3	3.6 mm	11 mm	Not Qualified	e3			15.9 mm

Cellphone ICs

Cellphone ICs (Integrated Circuits) are the electronic components that provide the processing power and functionality for modern cellphones. They are responsible for a wide range of functions, including signal processing, data storage, and communication protocols.

Some common types of cellphone ICs include:

1. Baseband processors: These ICs are responsible for handling the core functions of a cellphone, such as making calls and sending messages. They also manage the cellphone's power consumption and system resources.

2. Radio frequency (RF) transceivers: These ICs are responsible for transmitting and receiving RF signals over cellular networks. They also provide the ability to switch between different network bands and frequencies.

3. Power management ICs: These ICs manage the power supply and battery life of a cellphone. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

4. Memory ICs: These ICs provide storage for the cellphone's operating system, applications, and user data. They include flash memory, RAM, and other types of non-volatile memory.

5. Sensor ICs: These ICs provide sensing capabilities, such as accelerometers, gyroscopes, and proximity sensors. They enable the cellphone to detect motion, orientation, and other environmental conditions.