4 Cellphone ICs 18

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	No. of Channels	Maximum Supply Current	Nominal Supply Voltage	Package Style (Meter)	Package Equivalence Code	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
BALF-NRG-02D3	STMicroelectronics	RF AND BASEBAND CIRCUIT		BALL	4	VBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA4,2X2,40/16	1 mm	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	R-PBGA-B4		.69 mm	.855 mm		e1	30	260	1.385 mm
LMV225TLX	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	4	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1			2.7 V	GRID ARRAY, VERY THIN PROFILE, FINE PITCH		.5 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B4	1	.675 mm	1.014 mm	Not Qualified				1.014 mm
LMH2121TMX	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	4	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			2.7 V	GRID ARRAY, VERY THIN PROFILE, FINE PITCH		.4 mm	85 Cel	-40 Cel		BOTTOM	R-PBGA-B4		.675 mm	.866 mm					1.07 mm
LMH2121TMX/NOPB	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	4	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	1	4.7 mA	2.7 V	GRID ARRAY, VERY THIN PROFILE, FINE PITCH		.4 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	R-PBGA-B4	1	.675 mm	.858 mm		e1	30	260	1.058 mm
LMV228TLX	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	4	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1			2.7 V	GRID ARRAY, VERY THIN PROFILE, FINE PITCH		.5 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B4	1	.675 mm	1.014 mm	Not Qualified				1.014 mm
LMV225TL	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	4	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1			2.7 V	GRID ARRAY, VERY THIN PROFILE, FINE PITCH		.5 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B4	1	.675 mm	1.014 mm	Not Qualified				1.014 mm
LMV228URX	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	4	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1			2.7 V	GRID ARRAY, VERY THIN PROFILE, FINE PITCH		.5 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B4	1	.425 mm	.975 mm	Not Qualified	e0	40	260	.975 mm
LMH2121TME/NOPB	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	4	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	1	4.7 mA	2.7 V	GRID ARRAY, VERY THIN PROFILE, FINE PITCH		.4 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	R-PBGA-B4	1	.675 mm	.858 mm		e1	30	260	1.058 mm
LMV226URX	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	4	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1			2.7 V	GRID ARRAY, VERY THIN PROFILE, FINE PITCH		.5 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B4	1	.425 mm	.975 mm	Not Qualified	e0	40	260	.975 mm
LMV228UR	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	4	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1			2.7 V	GRID ARRAY, VERY THIN PROFILE, FINE PITCH		.5 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B4	1	.425 mm	.975 mm	Not Qualified	e0	40	260	.975 mm
LMV226UR	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	4	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1			2.7 V	GRID ARRAY, VERY THIN PROFILE, FINE PITCH		.5 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B4	1	.425 mm	.975 mm	Not Qualified	e0	40	260	.975 mm
LMV226TL	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	4	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1			2.7 V	GRID ARRAY, VERY THIN PROFILE, FINE PITCH		.5 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B4	1	.675 mm	1.014 mm	Not Qualified	e1			1.014 mm
LMV228TL	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	4	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1			2.7 V	GRID ARRAY, VERY THIN PROFILE, FINE PITCH		.5 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B4	1	.675 mm	1.014 mm	Not Qualified				1.014 mm
LMV225UR	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	4	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1			2.7 V	GRID ARRAY, VERY THIN PROFILE, FINE PITCH		.5 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B4	1	.425 mm	.975 mm	Not Qualified	e0	40	260	.975 mm
LMV225TLX/NOPB	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	4	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1	1	8 mA	2.7 V	GRID ARRAY, VERY THIN PROFILE, FINE PITCH		.5 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B4	1	.675 mm	1.014 mm	Not Qualified	e1	30	260	1.014 mm
LMV225TL/NOPB	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	4	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1	1	8 mA	2.7 V	GRID ARRAY, VERY THIN PROFILE, FINE PITCH		.5 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B4	1	.675 mm	1.014 mm	Not Qualified	e1	30	260	1.014 mm
LMV226TLX	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	4	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1			2.7 V	GRID ARRAY, VERY THIN PROFILE, FINE PITCH		.5 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B4	1	.675 mm	1.014 mm	Not Qualified				1.014 mm
LMV225URX	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	4	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1			2.7 V	GRID ARRAY, VERY THIN PROFILE, FINE PITCH		.5 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B4	1	.425 mm	.975 mm	Not Qualified	e0	40	260	.975 mm

Cellphone ICs

Cellphone ICs (Integrated Circuits) are the electronic components that provide the processing power and functionality for modern cellphones. They are responsible for a wide range of functions, including signal processing, data storage, and communication protocols.

Some common types of cellphone ICs include:

1. Baseband processors: These ICs are responsible for handling the core functions of a cellphone, such as making calls and sending messages. They also manage the cellphone's power consumption and system resources.

2. Radio frequency (RF) transceivers: These ICs are responsible for transmitting and receiving RF signals over cellular networks. They also provide the ability to switch between different network bands and frequencies.

3. Power management ICs: These ICs manage the power supply and battery life of a cellphone. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

4. Memory ICs: These ICs provide storage for the cellphone's operating system, applications, and user data. They include flash memory, RAM, and other types of non-volatile memory.

5. Sensor ICs: These ICs provide sensing capabilities, such as accelerometers, gyroscopes, and proximity sensors. They enable the cellphone to detect motion, orientation, and other environmental conditions.