48 Cellphone ICs 198

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Output Code	No. of Channels	Technology	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Resolution (um)	Minimum Operating Temperature	Terminal Finish	Maximum Output Voltage	Terminal Position	JESD-30 Code	Output (V)	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Input Type	Maximum Analog Input	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
MAX5866ETM+T	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1			CMOS		3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel		-40 Cel			QUAD	S-XQCC-N48		1	.8 mm	7 mm	Not Qualified				30	260	7 mm
MAX5864ETM+T	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1			CMOS		3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel		-40 Cel	Matte Tin (Sn) - annealed		QUAD	S-XQCC-N48		1	.8 mm	7 mm	Not Qualified			e3	30	260	7 mm
MAX2363ETMT	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1				.09 mA	2.8 V	3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel	MATTE TIN		QUAD	S-XQCC-N48		1	.8 mm	7 mm	Not Qualified			e3	30	260	7 mm
ADF7020-11BCPZ-RL7	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1					3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel		-40 Cel	MATTE TIN		QUAD	S-XQCC-N48			1 mm	7 mm	Not Qualified			e3			7 mm
ADF7025BCP	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	48	HQCCN	SQUARE	UNSPECIFIED	YES	1					3 V	2.5/3.3	CHIP CARRIER, HEAT SINK/SLUG	LCC48,.27SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel	TIN LEAD		QUAD	S-XQCC-N48			1.5 mm	7 mm	Not Qualified			e0			7 mm
ADF7021-VBCPZ-RL	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1					3 V	2.5/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel	MATTE TIN		QUAD	S-XQCC-N48		3	1 mm	7 mm	Not Qualified			e3	30	260	7 mm
ADF7021-NBCPZ-RL7	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1			CMOS		3 V	2.5/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel	MATTE TIN		QUAD	S-XQCC-N48		3	1 mm	7 mm	Not Qualified			e3	30	260	7 mm
ADF7025BCPZ-RL	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1					3 V	2.5/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel	MATTE TIN		QUAD	S-XQCC-N48		3	1 mm	7 mm	Not Qualified			e3		260	7 mm
ADF7025BCPZ	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1					3 V	2.5/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel	MATTE TIN		QUAD	S-XQCC-N48		3	1 mm	7 mm	Not Qualified			e3		260	7 mm
ADF7020BCPZ-RL7	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1					3 V	2.5/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel	MATTE TIN		QUAD	S-XQCC-N48		3	1 mm	7 mm	Not Qualified			e3		260	7 mm
ADF7021-NBCPZ-RL	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1			CMOS		3 V	2.5/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel	MATTE TIN		QUAD	S-XQCC-N48		3	1 mm	7 mm	Not Qualified			e3	30	260	7 mm
ADF7020BCP	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	48	HQCCN	SQUARE	UNSPECIFIED	YES	1					3 V	2.5/3.3	CHIP CARRIER, HEAT SINK/SLUG	LCC48,.27SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel	TIN LEAD		QUAD	S-XQCC-N48			1.5 mm	7 mm	Not Qualified			e0			7 mm
ADF7020-11BCPZ-RL	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1					3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel		-40 Cel	MATTE TIN		QUAD	S-XQCC-N48			1 mm	7 mm	Not Qualified			e3			7 mm
ADF7020-1BCPZ-RL	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1					3 V	2.5/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel	MATTE TIN		QUAD	S-XQCC-N48		3	1 mm	7 mm	Not Qualified			e3	30	260	7 mm
ADF7025BCPZ-RL7	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1					3 V	2.5/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel	MATTE TIN		QUAD	S-XQCC-N48		3	1 mm	7 mm	Not Qualified			e3		260	7 mm
MC13145FTA	NXP Semiconductors	RF AND BASEBAND CIRCUIT	OTHER	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1					3.6 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	70 Cel		-20 Cel			QUAD	S-PQFP-G48			1.6 mm	7 mm							7 mm
SA900BE-T	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1			BICMOS		4 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel		-40 Cel			QUAD	S-PQFP-G48			1.6 mm	7 mm	Not Qualified						7 mm
SA1920	NXP Semiconductors	RF FRONT END CIRCUIT	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1			BICMOS		3.75 V	3.75	FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel	TIN		QUAD	S-PQFP-G48			1.6 mm	7 mm	Not Qualified			e3			7 mm
SA1920-T	NXP Semiconductors	RF FRONT END CIRCUIT	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1			BICMOS		3.75 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel		-40 Cel			QUAD	S-PQFP-G48			1.6 mm	7 mm	Not Qualified						7 mm
SA1638BE-S	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1				24 mA	3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel		-40 Cel			QUAD	S-PQFP-G48			1.6 mm	7 mm	Not Qualified						7 mm
SA1921	NXP Semiconductors	RF FRONT END CIRCUIT	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1			BICMOS		3.75 V	3.75	FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel	TIN		QUAD	S-PQFP-G48			1.6 mm	7 mm	Not Qualified			e3			7 mm
UAA3522HL	NXP Semiconductors	RF FRONT END CIRCUIT	OTHER	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1			CMOS		2.8 V	2.8	FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	Other Telecom ICs	.5 mm	70 Cel		-30 Cel	Tin (Sn)		QUAD	S-PQFP-G48			1.6 mm	7 mm	Not Qualified			e3			7 mm
SA1638BE-T	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1				24 mA	3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel		-40 Cel			QUAD	S-PQFP-G48			1.6 mm	7 mm	Not Qualified						7 mm
SA900BE	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1			BICMOS		4 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel		-40 Cel			QUAD	S-PQFP-G48			1.6 mm	7 mm	Not Qualified						7 mm
SA1638BE	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1			BIPOLAR	24 mA	3 V	3/5	FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel			QUAD	S-PQFP-G48			1.6 mm	7 mm	Not Qualified						7 mm
SA1920BE	NXP Semiconductors	RF FRONT END CIRCUIT	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1					3.75 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel		-40 Cel	MATTE TIN		QUAD	S-PQFP-G48			1.6 mm	7 mm	Not Qualified			e3			7 mm
UAA3535HL	NXP Semiconductors	RF AND BASEBAND CIRCUIT	OTHER	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1			CMOS	.066 mA	2.6 V	2.6,3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	Other Telecom ICs	.5 mm	70 Cel		-30 Cel	TIN		QUAD	S-PQFP-G48			1.6 mm	7 mm	Not Qualified			e3			7 mm
SA1921BE	NXP Semiconductors	RF FRONT END CIRCUIT	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1					3.75 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel		-40 Cel	MATTE TIN		QUAD	S-PQFP-G48			1.6 mm	7 mm	Not Qualified			e3			7 mm
SA1921-T	NXP Semiconductors	RF FRONT END CIRCUIT	INDUSTRIAL	GULL WING	48	QFP	SQUARE	PLASTIC/EPOXY	YES	1			BICMOS				FLATPACK				85 Cel		-40 Cel	TIN		QUAD	S-PQFP-G48					Not Qualified			e3
SA2400ABE	NXP Semiconductors	RF AND BASEBAND CIRCUIT	OTHER	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1			BICMOS		3.3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel		-30 Cel			QUAD	S-PQFP-G48			1.6 mm	7 mm	Not Qualified						7 mm
SA900BE-S	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1			BICMOS		4 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel		-40 Cel			QUAD	S-PQFP-G48			1.6 mm	7 mm	Not Qualified						7 mm
SA1920BE-T	NXP Semiconductors	RF FRONT END CIRCUIT	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1					3.75 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel		-40 Cel			QUAD	S-PQFP-G48			1.6 mm	7 mm	Not Qualified						7 mm
SA1921BE-T	NXP Semiconductors	RF FRONT END CIRCUIT	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1					3.75 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel		-40 Cel			QUAD	S-PQFP-G48			1.6 mm	7 mm	Not Qualified						7 mm
PMB2240	Infineon Technologies	RF AND BASEBAND CIRCUIT	OTHER	GULL WING	48	TFQFP	SQUARE	PLASTIC/EPOXY	YES	1							FLATPACK, THIN PROFILE, FINE PITCH			.5 mm	85 Cel		-30 Cel			QUAD	S-PQFP-G48			1.1 mm	7 mm	Not Qualified						7 mm
PMB2411	Infineon Technologies	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	48	TFQFP	SQUARE	PLASTIC/EPOXY	YES	1							FLATPACK, THIN PROFILE, FINE PITCH			.5 mm	85 Cel		-40 Cel			QUAD	S-PQFP-G48			1.1 mm	7 mm	Not Qualified						7 mm
MAX5863ETM+	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1			CMOS		3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel		-40 Cel	MATTE TIN		QUAD	S-XQCC-N48		1	.8 mm	7 mm	Not Qualified			e3	30	260	7 mm
MAX5866ETM	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1			CMOS		3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel		-40 Cel	Tin/Lead (Sn85Pb15)		QUAD	S-XQCC-N48		1	.8 mm	7 mm	Not Qualified			e0	20	240	7 mm
MAX5864ETM-T	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1	OFFSET BINARY	2	CMOS	.0165 mA	3 V	1.8,3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	Codecs	.5 mm	85 Cel	8	-40 Cel	TIN LEAD	3 V	QUAD	S-XQCC-N48	VOLTAGE		.8 mm	7 mm	Not Qualified	DIFFERENTIAL	1.5 V	e0			7 mm
MAX5863ETM-T	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1			CMOS		3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel		-40 Cel	TIN LEAD		QUAD	S-XQCC-N48		1	.8 mm	7 mm	Not Qualified			e0			7 mm
MAX5863ETM	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1	OFFSET BINARY	2	CMOS		3 V	1.8,3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	Codecs	.5 mm	85 Cel	8	-40 Cel	TIN LEAD	3 V	QUAD	S-XQCC-N48	VOLTAGE	1	.8 mm	7 mm	Not Qualified	DIFFERENTIAL	1.5 V	e0		245	7 mm
MAX5866ETM-T	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1			CMOS		3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel		-40 Cel			QUAD	S-XQCC-N48			.8 mm	7 mm	Not Qualified				20	240	7 mm
MAX2368EGM-D	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	48	QCCN	SQUARE	UNSPECIFIED	YES	1					2.75 V		CHIP CARRIER				85 Cel		-40 Cel	TIN LEAD		QUAD	S-XQCC-N48		1						e0
MAX2363EGM	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1				.09 mA	2.8 V	3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel	TIN LEAD		QUAD	S-XQCC-N48		3	1 mm	7 mm	Not Qualified			e0			7 mm
MAX2366EGM-TD	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1					2.75 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel		-40 Cel			QUAD	S-XQCC-N48			1 mm	7 mm	Not Qualified				NOT SPECIFIED	NOT SPECIFIED	7 mm
MAX2369EGM	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1				.155 mA	2.75 V	2.75	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel	TIN LEAD		QUAD	S-XQCC-N48		3	.8 mm	7 mm	Not Qualified			e0			7 mm
MAX2361EGM-TD	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1				.09 mA	2.8 V	3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel	TIN LEAD		QUAD	S-XQCC-N48		1	1 mm	7 mm	Not Qualified			e0			7 mm
MAX2360ECM+	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	48	TFQFP	SQUARE	PLASTIC/EPOXY	YES	1					2.75 V		FLATPACK, THIN PROFILE, FINE PITCH			.5 mm	85 Cel		-40 Cel	TIN		QUAD	S-PQFP-G48		3	1.2 mm	7 mm	Not Qualified			e3			7 mm
MAX2369EGM+D	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1					2.75 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel		-40 Cel	MATTE TIN		QUAD	S-XQCC-N48		3	.8 mm	7 mm	Not Qualified			e3	30	260	7 mm

Cellphone ICs

Cellphone ICs (Integrated Circuits) are the electronic components that provide the processing power and functionality for modern cellphones. They are responsible for a wide range of functions, including signal processing, data storage, and communication protocols.

Some common types of cellphone ICs include:

1. Baseband processors: These ICs are responsible for handling the core functions of a cellphone, such as making calls and sending messages. They also manage the cellphone's power consumption and system resources.

2. Radio frequency (RF) transceivers: These ICs are responsible for transmitting and receiving RF signals over cellular networks. They also provide the ability to switch between different network bands and frequencies.

3. Power management ICs: These ICs manage the power supply and battery life of a cellphone. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

4. Memory ICs: These ICs provide storage for the cellphone's operating system, applications, and user data. They include flash memory, RAM, and other types of non-volatile memory.

5. Sensor ICs: These ICs provide sensing capabilities, such as accelerometers, gyroscopes, and proximity sensors. They enable the cellphone to detect motion, orientation, and other environmental conditions.