8 Cellphone ICs 47

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	No. of Channels	Technology	Maximum Supply Current	Nominal Supply Voltage	Package Style (Meter)	Package Equivalence Code	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
OC2321VQFN8XTMA2	Infineon Technologies	RF AND BASEBAND CIRCUIT		NO LEAD	8	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1				1.8 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.24	1.27 mm	105 Cel	-40 Cel		DUAL	R-PDSO-N8	1	.9 mm	6 mm					5 mm
MAX4003EUA-T	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1		CMOS		3 V	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		.65 mm	85 Cel	-40 Cel	TIN LEAD	DUAL	S-PDSO-G8	1	1.1 mm	3 mm	Not Qualified	e0			3 mm
MAX4003EUA+T	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1				3 V	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		.65 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL	S-PDSO-G8	1	1.1 mm	3 mm	Not Qualified	e3	30	260	3 mm
TQP3M9036	Qorvo	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1				5 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	85 Cel	-40 Cel		DUAL	S-PDSO-N8	1	.95 mm	2 mm				260	2 mm
MAX2620EUA-T	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1		BIPOLAR		3 V	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		.65 mm	85 Cel	-40 Cel	TIN LEAD	DUAL	S-PDSO-G8	1	1.1 mm	3 mm	Not Qualified	e0			3 mm
MAX2620EUA+T	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1		BIPOLAR		3 V	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		.65 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL	S-PDSO-G8	1	1.1 mm	3 mm	Not Qualified	e3	30	260	3 mm
SKY13522-644LF	Skyworks Solutions	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	8	HVQCCN	SQUARE	UNSPECIFIED	YES	1				3 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.4 mm	90 Cel	-30 Cel		QUAD	S-XQCC-N8		.5 mm	1.1 mm			NOT SPECIFIED	NOT SPECIFIED	1.1 mm
MAX2620EUA	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1		BIPOLAR		3 V	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		.65 mm	85 Cel	-40 Cel	TIN LEAD	DUAL	S-PDSO-G8	1	1.1 mm	3 mm	Not Qualified	e0	20	240	3 mm
MAX2620EUA+	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1		BIPOLAR		3 V	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		.65 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL	S-PDSO-G8	1	1.1 mm	3 mm	Not Qualified	e3	30	260	3 mm
MAX4003EUA/GH9-T	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1				3 V	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		.65 mm	85 Cel	-40 Cel		DUAL	S-PDSO-G8	1	1.1 mm	3 mm					3 mm
MAX4003EBL+	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	8	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1				3 V	GRID ARRAY, VERY THIN PROFILE, FINE PITCH		.5 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B8	1	.67 mm	1.52 mm	Not Qualified	e1	30	260	1.52 mm
MAX4003EBL	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	8	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1				3 V	GRID ARRAY, VERY THIN PROFILE, FINE PITCH		.5 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B8	1	.67 mm	1.52 mm	Not Qualified	e0			1.52 mm
MAX4003EBL-T	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	8	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1		CMOS		3 V	GRID ARRAY, VERY THIN PROFILE, FINE PITCH		.5 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B8	1	.67 mm	1.52 mm	Not Qualified	e0			1.52 mm
MAX4003EBL+T	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	8	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1		CMOS		3 V	GRID ARRAY, VERY THIN PROFILE, FINE PITCH		.5 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B8	1	.67 mm	1.52 mm	Not Qualified	e1	30	260	1.52 mm
MAX4003ETA	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	8	HVSON	SQUARE	UNSPECIFIED	YES	1				3 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE		.65 mm	85 Cel	-40 Cel	TIN LEAD	DUAL	S-XDSO-N8	1	.8 mm	3 mm	Not Qualified	e0			3 mm
MAX4003ETA+	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	8	HVSON	SQUARE	UNSPECIFIED	YES	1				3 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE		.65 mm	85 Cel	-40 Cel	Matte Tin (Sn)	DUAL	S-XDSO-N8	1	.8 mm	3 mm	Not Qualified	e3	30	260	3 mm
SKY65048-360LF	Skyworks Solutions	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1				5 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	85 Cel	-40 Cel	MATTE TIN	DUAL	S-PDSO-N8	1	1 mm	2 mm	Not Qualified	e3		260	2 mm
MAX4003EUA	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1		CMOS		3 V	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		.65 mm	85 Cel	-40 Cel	TIN LEAD	DUAL	S-PDSO-G8	1	1.1 mm	3 mm	Not Qualified	e0			3 mm
MAX4003EUA+	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1				3 V	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		.65 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL	S-PDSO-G8	1	1.1 mm	3 mm	Not Qualified	e3	30	260	3 mm
HMC422MS8ETR	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1				3 V	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		.65 mm	85 Cel	-40 Cel	MATTE TIN	DUAL	S-PDSO-G8	1	1.1 mm	3 mm		e3		260	3 mm
LMV232TL/NOPB	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	8	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1	2		13 mA	2.7 V	GRID ARRAY, VERY THIN PROFILE, FINE PITCH		.5 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B8	1	.675 mm	1.5095 mm		e1	30	260	1.5095 mm
LMV232TLX/NOPB	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	8	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1				2.7 V	GRID ARRAY, VERY THIN PROFILE, FINE PITCH		.5 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B8	1	.675 mm	1.5095 mm		e1	30	260	1.5095 mm
HMC422MS8	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1				3 V	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		.65 mm	85 Cel	-40 Cel	TIN LEAD	DUAL	S-PDSO-G8	1	1.1 mm	3 mm	Not Qualified	e0		235	3 mm
HMC485MS8GETR	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1				5 V	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		.65 mm	85 Cel	-40 Cel	MATTE TIN	DUAL	S-PDSO-G8	1	1.1 mm	3 mm		e3		260	3 mm
HMC485MS8GTR	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1				5 V	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		.65 mm	85 Cel	-40 Cel	TIN LEAD	DUAL	S-PDSO-G8	1	1.1 mm	3 mm		e0		235	3 mm
HMC422MS8TR	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1				3 V	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		.65 mm	85 Cel	-40 Cel	TIN LEAD	DUAL	S-PDSO-G8	1	1.1 mm	3 mm		e0		235	3 mm
HMC485MS8G	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	8	HTSSOP	SQUARE	PLASTIC/EPOXY	YES	1				5 V	SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH		.65 mm	85 Cel	-40 Cel	TIN LEAD	DUAL	S-PDSO-G8	1	1.1 mm	3 mm	Not Qualified	e0		235	3 mm
HMC485MS8GE	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	8	HTSSOP	SQUARE	PLASTIC/EPOXY	YES	1				5 V	SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH		.65 mm	85 Cel	-40 Cel	MATTE TIN	DUAL	S-PDSO-G8	1	1.1 mm	3 mm	Not Qualified	e3		260	3 mm
HMC422MS8E	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1				3 V	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		.65 mm	85 Cel	-40 Cel	MATTE TIN	DUAL	S-PDSO-G8	1	1.1 mm	3 mm	Not Qualified	e3		260	3 mm
MAX4003EUA+C1D	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1				3 V	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		.65 mm	85 Cel	-40 Cel		DUAL	S-PDSO-G8		1.1 mm	3 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	3 mm
ADL5502ACBZ-P7	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	8	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1		BICMOS		3 V	GRID ARRAY, VERY THIN PROFILE, FINE PITCH		.5 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B8	1	.625 mm	1.46 mm	Not Qualified	e1	30	260	1.46 mm
ADL5502ACBZ-P2	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	8	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1		BICMOS		3 V	GRID ARRAY, VERY THIN PROFILE, FINE PITCH		.5 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B8	1	.625 mm	1.46 mm	Not Qualified	e1		260	1.46 mm
MC13143D	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3 V	SMALL OUTLINE		1.27 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G8		1.75 mm	3.9 mm					4.9 mm
BGM1143N9E6327	Infineon Technologies	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BUTT	8	BCC	RECTANGULAR	UNSPECIFIED	YES	1				1.8 V	CHIP CARRIER		.4 mm	85 Cel	-40 Cel		BOTTOM	R-XBCC-B8		.77 mm	1.1 mm					1.5 mm
BGM1143N9	Infineon Technologies	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BUTT	8	BCC	RECTANGULAR	UNSPECIFIED	YES	1				1.8 V	CHIP CARRIER		.4 mm	85 Cel	-40 Cel		BOTTOM	R-XBCC-B8		.77 mm	1.1 mm			NOT SPECIFIED	NOT SPECIFIED	1.5 mm
BGM1143N9E6327XTSA1	Infineon Technologies	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BUTT	8	BCC	RECTANGULAR	UNSPECIFIED	YES	1				1.8 V	CHIP CARRIER		.4 mm	85 Cel	-40 Cel		BOTTOM	R-XBCC-B8		.77 mm	1.1 mm					1.5 mm
CMY212	Infineon Technologies	RF AND BASEBAND CIRCUIT	OTHER	GULL WING	8	TSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3 V	SMALL OUTLINE, THIN PROFILE			85 Cel	-30 Cel		DUAL	R-PDSO-G8		1.1 mm	1.6 mm	Not Qualified				2.9 mm
CMY213	Infineon Technologies	RF AND BASEBAND CIRCUIT	OTHER	GULL WING	8	TSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3 V	SMALL OUTLINE, THIN PROFILE			85 Cel	-30 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDSO-G8		1.1 mm	1.6 mm	Not Qualified	e0			2.9 mm
OC1120-0810VQFN8	Infineon Technologies	BASEBAND CIRCUIT		NO LEAD	8	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1			10 mA	1.8 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE		1.27 mm	85 Cel	-25 Cel		DUAL	R-PQCC-N8		.9 mm	5 mm					6 mm
MAX4003ETA+T	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	8	HVSON	SQUARE	UNSPECIFIED	YES	1		CMOS		3 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE		.65 mm	85 Cel	-40 Cel	MATTE TIN	DUAL	S-XDSO-N8	1	.8 mm	3 mm	Not Qualified	e3	30	260	3 mm
MAX4003EUA-C1D	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1				3 V	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		.65 mm	85 Cel	-40 Cel		DUAL	S-PDSO-G8		1.1 mm	3 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	3 mm
MAX4003ETA-T	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	8	HVSON	SQUARE	UNSPECIFIED	YES	1		CMOS		3 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE		.65 mm	85 Cel	-40 Cel	TIN LEAD	DUAL	S-XDSO-N8	1	.8 mm	3 mm	Not Qualified	e0			3 mm
MAX4003EUA/GH9	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1				3 V	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		.65 mm	85 Cel	-40 Cel		DUAL	S-PDSO-G8		1.1 mm	3 mm			NOT SPECIFIED	NOT SPECIFIED	3 mm
WS1405-TR1	Broadcom	RF AND BASEBAND CIRCUIT		NO LEAD	8	HQCCN	SQUARE		YES	1			520 mA	3.4 V	CHIP CARRIER, HEAT SINK/SLUG	SOLCC8,.16,32	.8 mm	85 Cel	-30 Cel		DUAL	S-XQCC-N8		1.1 mm	3 mm					3 mm
WS1405-BLK	Broadcom	RF AND BASEBAND CIRCUIT		NO LEAD	8	HQCCN	SQUARE		YES	1			520 mA	3.4 V	CHIP CARRIER, HEAT SINK/SLUG	SOLCC8,.16,32	.8 mm	85 Cel	-30 Cel		DUAL	S-XQCC-N8		1.1 mm	3 mm					3 mm
ACMD-7610-BLK	Broadcom	RF AND BASEBAND CIRCUIT		NO LEAD	8		RECTANGULAR	UNSPECIFIED	YES						UNCASED CHIP					GOLD	UPPER	R-XUUC-N8	3			Not Qualified	e4
ACMD-7610-TR1	Broadcom	RF AND BASEBAND CIRCUIT		NO LEAD	8		RECTANGULAR	UNSPECIFIED	YES						UNCASED CHIP					GOLD	UPPER	R-XUUC-N8	3			Not Qualified	e4

Cellphone ICs

Cellphone ICs (Integrated Circuits) are the electronic components that provide the processing power and functionality for modern cellphones. They are responsible for a wide range of functions, including signal processing, data storage, and communication protocols.

Some common types of cellphone ICs include:

1. Baseband processors: These ICs are responsible for handling the core functions of a cellphone, such as making calls and sending messages. They also manage the cellphone's power consumption and system resources.

2. Radio frequency (RF) transceivers: These ICs are responsible for transmitting and receiving RF signals over cellular networks. They also provide the ability to switch between different network bands and frequencies.

3. Power management ICs: These ICs manage the power supply and battery life of a cellphone. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

4. Memory ICs: These ICs provide storage for the cellphone's operating system, applications, and user data. They include flash memory, RAM, and other types of non-volatile memory.

5. Sensor ICs: These ICs provide sensing capabilities, such as accelerometers, gyroscopes, and proximity sensors. They enable the cellphone to detect motion, orientation, and other environmental conditions.