Infineon Technologies - BGM1143N9E6327XTSA1

  1. Home
  2. Infineon Technologies - BGM1143N9E6327XTSA1
BGM1143N9E6327XTSA1 by Infineon Technologies

Image shown is a representation only.

Manufacturer Infineon Technologies
Manufacturer's Part Number BGM1143N9E6327XTSA1
Description RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BUTT; No. of Terminals: 8; Package Code: BCC; Package Shape: RECTANGULAR;
Datasheet BGM1143N9E6327XTSA1 Datasheet
In Stock318
NAME DESCRIPTION
Package Body Material: UNSPECIFIED
Nominal Supply Voltage: 1.8 V
Telecom IC Type: RF AND BASEBAND CIRCUIT
Maximum Seated Height: .77 mm
Surface Mount: YES
Minimum Operating Temperature: -40 Cel
No. of Functions: 1
No. of Terminals: 8
Terminal Position: BOTTOM
Package Style (Meter): CHIP CARRIER
Length: 1.5 mm
JESD-30 Code: R-XBCC-B8
Package Shape: RECTANGULAR
Terminal Form: BUTT
Maximum Operating Temperature: 85 Cel
Package Code: BCC
Width: 1.1 mm
Terminal Pitch: .4 mm
Temperature Grade: INDUSTRIAL
Plant 5!
Your quote plants 5 trees.

Pricing (USD)

Qty. Unit Price Ext. Price
318 - -

Popular Products

Category Top Products

MAX2620EUA+T by Analog Devices

MAX2620EUA+T

Analog Devices

MAX2620EUA+T by Analog Devices is a cellphone IC with 8 terminals in a small outline package. It operates b/w -40 to 85°C, suitable for industrial use. This RF and baseband circuit has a nominal voltage of 3V, making it ideal for telecom applications.
HMC422MS8E by Analog Devices

HMC422MS8E

Analog Devices

Analog Devices' HMC422MS8E is a cellphone IC with 8 terminals in a small outline, thin profile package. It operates b/w -40 to 85°C and has a terminal pitch of 0.65mm. Ideal for RF and baseband circuits in telecom applications due to its matte tin finish and dual terminal position.
TLV321AC36IDW by Texas Instruments

TLV321AC36IDW

Texas Instruments

TLV321AC36IDW by Texas Instruments is a Cellphone IC with 20 terminals in a small outline package. Operating temperature ranges from -40 to 85°C, suitable for industrial use. It features CMOS technology, Gull Wing terminal form, and is ideal for baseband circuit applications.
TLV321AC36CPT by Texas Instruments

TLV321AC36CPT

Texas Instruments

TLV321AC36CPT by Texas Instruments is a 48-terminal cellphone IC with CMOS technology. It operates b/w 0-70°C, suitable for baseband circuits. The flatpack package has low profile and fine pitch, making it ideal for compact mobile devices.
HMC420QS16E by Analog Devices

HMC420QS16E

Analog Devices

Analog Devices' HMC420QS16E is a 16-terminal cellphone IC with a small outline, shrink pitch package. It operates in industrial temperature range (-40 to 85°C) and has matte tin terminal finish. Ideal for RF and baseband circuits in telecom applications with a nominal voltage of 5V.
ADRF5545ABCPZN-RL by Analog Devices

ADRF5545ABCPZN-RL

Analog Devices

Analog Devices' ADRF5545ABCPZN-RL is a cellphone IC with 40 terminals in a square chip carrier package. It operates b/w -40 to 105 °C, suitable for industrial telecom applications. With RF and baseband circuits, it has a nominal voltage of 5V and terminal pitch of 0.5mm.
LMH2110TMX/NOPB by Texas Instruments

LMH2110TMX/NOPB

Texas Instruments

LMH2110TMX/NOPB by Texas Instruments is a cellphone IC with a package style of GRID ARRAY, very thin profile, and fine pitch. It operates in industrial temperature range (-40 to 85°C) with a supply current of 5.5mA at 4.5V. This RF and baseband circuit has 6 terminals in a rectangular shape for surface mount applications.
AD6657BBCZRL by Analog Devices

AD6657BBCZRL

Analog Devices

AD6657BBCZRL by Analog Devices is a cellphone IC with 144 terminals in a square grid array package. It operates b/w -40 to 85 °C, with a supply voltage of 1.8V for RF and baseband circuits. The low-profile, fine-pitch design makes it suitable for industrial telecom applications.
ADL5812ACPZ-R7 by Analog Devices

ADL5812ACPZ-R7

Analog Devices

ADL5812ACPZ-R7 by Analog Devices is a 40-terminal cellphone IC with BICMOS technology. It operates b/w -40 to 85°C, has a package style of CHIP CARRIER, and requires a nominal voltage of 5V. This RF and baseband circuit is ideal for telecom applications due to its compact square shape and low profile design.
WFM200S022XNA2 by Silicon Labs

WFM200S022XNA2

Silicon Labs

Cellular Telephone Circuits; Maximum Time At Peak Reflow Temperature (s): 40; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3;
MAMF-011139-TR1000 by M/a-com Technology Solutions

MAMF-011139-TR1000

M/a-com Technology Solutions

RF FRONT END CIRCUIT;
NRF24L01-REEL by Nordic Semiconductor Asa

NRF24L01-REEL

Nordic Semiconductor Asa

NRF24L01-REEL by Nordic Semiconductor Asa is a cellphone IC with 20 terminals in a square chip carrier package. It operates b/w -40 to 85°C, suitable for industrial use. This RF and baseband circuit has a nominal voltage of 3V, making it ideal for wireless communication applications.
CC115LRGPR by Texas Instruments

CC115LRGPR

Texas Instruments

CC115LRGPR by Texas Instruments is a cellphone IC with 20 terminals in a square chip carrier package. It operates b/w -40 to 85°C, suitable for industrial use. With RF and baseband circuitry, it supports data rates up to 0.6 Mbps, making it ideal for telecom applications.
CC1000PWR by Texas Instruments

CC1000PWR

Texas Instruments

CC1000PWR by Texas Instruments is a cellphone IC with 28 terminals, operating at temperatures from -40 to 85°C. It features a supply voltage of 2.5/3.3V, RF and baseband circuitry, and CMOS technology. This small outline package is ideal for telecom applications requiring low power consumption and high reliability in industrial environments.
CC2591RGVRG4 by Texas Instruments

CC2591RGVRG4

Texas Instruments

CC2591RGVRG4 by Texas Instruments is a cellphone IC with 16 terminals in a square package. It operates at temperatures from -40 to 85°C and has a supply voltage of 3V. This RF front end circuit has a max supply current of 4mA, making it ideal for industrial telecom applications.
BGC100GN6E6327XTSA1 by Infineon Technologies

BGC100GN6E6327XTSA1

Infineon Technologies

Infineon's BGC100GN6E6327XTSA1 is a CMOS Cellphone IC with 6 terminals in a rectangular chip carrier package. It features RF and baseband circuitry, suitable for telecom applications. This surface-mount IC has terminals at the bottom and a butt terminal form.
AD8348ARUZ-REEL7 by Analog Devices

AD8348ARUZ-REEL7

Analog Devices

AD8348ARUZ-REEL7 by Analog Devices is a Cellphone IC with 28 terminals, operating at -40 to 85°C. It has a supply voltage of 5V and uses BIPOLAR technology for BASEBAND CIRCUIT in telecom applications. The package is SMALL OUTLINE, THIN PROFILE, RECTANGULAR shape with PLASTIC/EPOXY material.
CC1150-RTY1 by Texas Instruments

CC1150-RTY1

Texas Instruments

CC1150-RTY1 by Texas Instruments is a cellphone IC with 16 terminals, operating at -40 to 85°C. It features a supply voltage of 3V, RF and baseband circuitry, and CMOS technology. This surface-mount chip carrier has a square shape, 0.65mm terminal pitch, and MSL level of 3 for industrial applications.
TRF3705IRGET by Texas Instruments

TRF3705IRGET

Texas Instruments

TRF3705IRGET by Texas Instruments is a 24-terminal cellphone IC with 3.3V supply voltage, operating b/w -40 to 85°C. It features RF and baseband circuitry in a square chip carrier package with nickel palladium gold finish, suitable for industrial telecom applications.
AFE7921IABJ by Texas Instruments

AFE7921IABJ

Texas Instruments

AFE7921IABJ by Texas Instruments is a Cellphone IC with 400 terminals in a GRID ARRAY, FINE PITCH package. It operates b/w -40 to 85°C, suitable for industrial use. This RF and baseband circuit has a compact size of 17x17 mm and is surface mountable.