HLGA Cellphone ICs 7

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Nominal Supply Voltage	Package Style (Meter)	Package Equivalence Code	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
RFFM6903SR	Qorvo	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BUTT	28	HLGA	SQUARE	PLASTIC/EPOXY	YES	1		3.6 V	GRID ARRAY, HEAT SINK/SLUG			85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	S-PBGA-B28	3	1.05 mm	6 mm	e4	30	260	6 mm
RFFM6903	Qorvo	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BUTT	28	HLGA	SQUARE	PLASTIC/EPOXY	YES	1		3.6 V	GRID ARRAY, HEAT SINK/SLUG			85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	S-PBGA-B28	3	1.05 mm	6 mm	e4	30	260	6 mm
RFFM6903TR13	Qorvo	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BUTT	28	HLGA	SQUARE	PLASTIC/EPOXY	YES	1		3.6 V	GRID ARRAY, HEAT SINK/SLUG			85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	S-PBGA-B28	3	1.05 mm	6 mm	e4	30	260	6 mm
RFFM6903TR7	Qorvo	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BUTT	28	HLGA	SQUARE	PLASTIC/EPOXY	YES	1		3.6 V	GRID ARRAY, HEAT SINK/SLUG			85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	S-PBGA-B28	3	1.05 mm	6 mm	e4	30	260	6 mm
BGSX24MU16E6327XUSA1	Infineon Technologies	RF AND BASEBAND CIRCUIT		NO LEAD	16	HLGA	SQUARE	UNSPECIFIED	YES	1	RFCMOS	2.8 V	GRID ARRAY, HEAT SINK/SLUG	LGA16,5X5,16	.4 mm	85 Cel	-40 Cel		BOTTOM	S-XBGA-N16	3	.64 mm	2 mm				2 mm
AJAV-5501-BLK	Broadcom	RF AND BASEBAND CIRCUIT	OTHER	BUTT	10	HLGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	3.8 V	GRID ARRAY, HEAT SINK/SLUG		.6 mm	90 Cel	-30 Cel		BOTTOM	S-PBGA-B10	3	1.1 mm	3 mm			260	3 mm
AJAV-5501-TR1	Broadcom	RF AND BASEBAND CIRCUIT	OTHER	BUTT	10	HLGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	3.8 V	GRID ARRAY, HEAT SINK/SLUG		.6 mm	90 Cel	-30 Cel		BOTTOM	S-PBGA-B10	3	1.1 mm	3 mm			260	3 mm

Cellphone ICs

Cellphone ICs (Integrated Circuits) are the electronic components that provide the processing power and functionality for modern cellphones. They are responsible for a wide range of functions, including signal processing, data storage, and communication protocols.

Some common types of cellphone ICs include:

1. Baseband processors: These ICs are responsible for handling the core functions of a cellphone, such as making calls and sending messages. They also manage the cellphone's power consumption and system resources.

2. Radio frequency (RF) transceivers: These ICs are responsible for transmitting and receiving RF signals over cellular networks. They also provide the ability to switch between different network bands and frequencies.

3. Power management ICs: These ICs manage the power supply and battery life of a cellphone. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

4. Memory ICs: These ICs provide storage for the cellphone's operating system, applications, and user data. They include flash memory, RAM, and other types of non-volatile memory.

5. Sensor ICs: These ICs provide sensing capabilities, such as accelerometers, gyroscopes, and proximity sensors. They enable the cellphone to detect motion, orientation, and other environmental conditions.