LFBGA Cellphone ICs 22

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	No. of Transceivers	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
AD9361BBCZ	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1				1.3 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B144	3	1.7 mm	10 mm		e1		260	10 mm
AD9361BBCZ-REEL	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1				1.3 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B144	3	1.7 mm	10 mm		e1		260	10 mm
AD9361BBCZ-CSL	Analog Devices	RF AND BASEBAND CIRCUIT		BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1			150 mA	1.3 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA144,12X12,32		.8 mm	85 Cel	-40 Cel		BOTTOM		S-PBGA-B144		1.7 mm	10 mm			NOT SPECIFIED	NOT SPECIFIED	10 mm
AD6688BBPZ-3000	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1				.975 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	85 Cel	-40 Cel		BOTTOM		S-PBGA-B196	3	1.53 mm	12 mm			30	260	12 mm
TCM4400EGGM	Texas Instruments	BASEBAND CIRCUIT	OTHER	BALL	80	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS		.03 mA	3 V	3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA80,10X10,32	Other Telecom ICs	.8 mm	85 Cel	-25 Cel		BOTTOM		S-PBGA-B80		1.4 mm	10 mm	Not Qualified				10 mm
AD6642BBCZ	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		.291 mA	1.8 V	1.8	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA144,12X12,32	Other Telecom ICs	.8 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B144	3	1.4 mm	10 mm	Not Qualified	e1	30	260	10 mm
AD6657BBCZRL	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1				1.8 V	1.8	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA144,12X12,32	Other Telecom ICs	.8 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B144	3	1.4 mm	10 mm	Not Qualified	e1	30	260	10 mm
ADRV9010BBCZ-REEL	Analog Devices	RF AND BASEBAND CIRCUIT		BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1				1 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32		.8 mm	110 Cel	-40 Cel		BOTTOM		S-PBGA-B289		1.43 mm	14 mm			NOT SPECIFIED	NOT SPECIFIED	14 mm
AD6688BBPZRL-3000	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1				.975 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	85 Cel	-40 Cel		BOTTOM		S-PBGA-B196	3	1.53 mm	12 mm			30	260	12 mm
AD6642BBCZRL	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		.291 mA	1.8 V	1.8	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA144,12X12,32	Other Telecom ICs	.8 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	BOTTOM		S-PBGA-B144	1	1.4 mm	10 mm	Not Qualified	e3			10 mm
AD6657BBCZ	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1				1.8 V	1.8	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA144,12X12,32	Other Telecom ICs	.8 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B144	3	1.4 mm	10 mm	Not Qualified	e1			10 mm
AD6657ABBCZRL	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1			.51 mA	1.8 V	1.8	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA144,12X12,32	Other Telecom ICs	.8 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B144	3	1.4 mm	10 mm	Not Qualified	e1	30	260	10 mm
ADRV9010BBCZ-A-RL	Analog Devices	RF AND BASEBAND CIRCUIT		BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1				1 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32		.8 mm	110 Cel	-40 Cel		BOTTOM		S-PBGA-B289		1.43 mm	14 mm					14 mm
AD6657ABBCZ	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1			.51 mA	1.8 V	1.8	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA144,12X12,32	Other Telecom ICs	.8 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B144	3	1.4 mm	10 mm	Not Qualified	e1	30	260	10 mm
ADRV9010BBCZ	Analog Devices	RF AND BASEBAND CIRCUIT		BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1				1 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32		.8 mm	110 Cel	-40 Cel		BOTTOM		S-PBGA-B289		1.43 mm	14 mm			NOT SPECIFIED	NOT SPECIFIED	14 mm
ADRV9010BBCZ-A	Analog Devices	RF AND BASEBAND CIRCUIT		BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1				1 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32		.8 mm	110 Cel	-40 Cel		BOTTOM		S-PBGA-B289		1.43 mm	14 mm			NOT SPECIFIED	NOT SPECIFIED	14 mm
STLC4560	STMicroelectronics	RF AND BASEBAND CIRCUIT	OTHER	BALL	240	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		1	.006 mA	3.6 V	1.86,3.6	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA240,15X16,20	Network Interfaces	.5 mm	85 Cel	-30 Cel		BOTTOM	54 Mbps	R-PBGA-B240		1.4 mm	8 mm	Not Qualified				8.5 mm
STLC4560TRAY	STMicroelectronics	RF AND BASEBAND CIRCUIT	OTHER	BALL	240	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		1	.006 mA	3.6 V	1.86,3.6	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA240,15X16,20	Network Interfaces	.5 mm	85 Cel	-30 Cel		BOTTOM	54 Mbps	R-PBGA-B240		1.4 mm	8 mm	Not Qualified				8.5 mm
STLC4420A	STMicroelectronics	RF AND BASEBAND CIRCUIT	COMMERCIAL EXTENDED	BALL	228	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		1		3.6 V	1.8,3.6	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA228,13X24,20	Network Interfaces	.5 mm	85 Cel	-30 Cel		BOTTOM	54 Mbps	R-PBGA-B228		1.4 mm	7 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	12.5 mm
MC13760	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	104	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1						GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	85 Cel	-40 Cel		BOTTOM		R-PBGA-B104		1.6 mm	10 mm					10 mm
ISL5216KI	Renesas Electronics	BASEBAND CIRCUIT	INDUSTRIAL	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1			700 mA	2.5 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA196,14X14,32		.8 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM		S-PBGA-B196	3	1.5 mm	12 mm		e0			12 mm
HSP50216KIZ	Renesas Electronics	BASEBAND CIRCUIT	INDUSTRIAL	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B196	3	1.5 mm	12 mm	Not Qualified	e1			12 mm

Cellphone ICs

Cellphone ICs (Integrated Circuits) are the electronic components that provide the processing power and functionality for modern cellphones. They are responsible for a wide range of functions, including signal processing, data storage, and communication protocols.

Some common types of cellphone ICs include:

1. Baseband processors: These ICs are responsible for handling the core functions of a cellphone, such as making calls and sending messages. They also manage the cellphone's power consumption and system resources.

2. Radio frequency (RF) transceivers: These ICs are responsible for transmitting and receiving RF signals over cellular networks. They also provide the ability to switch between different network bands and frequencies.

3. Power management ICs: These ICs manage the power supply and battery life of a cellphone. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

4. Memory ICs: These ICs provide storage for the cellphone's operating system, applications, and user data. They include flash memory, RAM, and other types of non-volatile memory.

5. Sensor ICs: These ICs provide sensing capabilities, such as accelerometers, gyroscopes, and proximity sensors. They enable the cellphone to detect motion, orientation, and other environmental conditions.