SOP Cellphone ICs 50

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Maximum Gain Tolerance	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Linear Coding	Width	Qualification	Companding Law	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Filter
MC13142D	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel			DUAL	R-PDSO-G16		1.75 mm		3.9 mm						9.9 mm
TCM320AC57CDW	Texas Instruments	BASEBAND CIRCUIT	COMMERCIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	.0099 mA	5 V	5	SMALL OUTLINE	SOP20,.4	Codecs	1.27 mm	70 Cel	0 Cel	1 dB		DUAL	R-PDSO-G20		2.65 mm	13-BIT	7.5 mm	Not Qualified	A-LAW		NOT SPECIFIED	NOT SPECIFIED	12.8 mm	YES
TLV321AC36CDW	Texas Instruments	BASEBAND CIRCUIT	COMMERCIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		3 V		SMALL OUTLINE			1.27 mm	70 Cel	0 Cel			DUAL	R-PDSO-G20		2.65 mm		7.5 mm	Not Qualified					12.8 mm
TLV320AC57DWR	Texas Instruments	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel			DUAL	R-PDSO-G20		2.65 mm		7.5 mm	Not Qualified					12.8 mm
TCM320AC57IDW	Texas Instruments	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	.0099 mA	5 V	5	SMALL OUTLINE	SOP20,.4	Codecs	1.27 mm	85 Cel	-40 Cel	1 dB		DUAL	R-PDSO-G20		2.65 mm	13-BIT	7.5 mm	Not Qualified	A-LAW		NOT SPECIFIED	NOT SPECIFIED	12.8 mm	YES
TLV321AC37CDW	Texas Instruments	BASEBAND CIRCUIT	COMMERCIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		3 V		SMALL OUTLINE			1.27 mm	70 Cel	0 Cel			DUAL	R-PDSO-G20		2.65 mm		7.5 mm	Not Qualified					12.8 mm
TCM320AC56IDWR	Texas Instruments	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		5 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel			DUAL	R-PDSO-G20		2.65 mm		7.5 mm	Not Qualified					12.8 mm
TLV320AC57DW	Texas Instruments	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel			DUAL	R-PDSO-G20		2.65 mm		7.5 mm	Not Qualified					12.8 mm
TCM320AC56DWR	Texas Instruments	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			5 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel			DUAL	R-PDSO-G20		2.65 mm		7.5 mm	Not Qualified					12.8 mm
TLV320AC56CDW	Texas Instruments	BASEBAND CIRCUIT	COMMERCIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	.0075 mA	3 V	3	SMALL OUTLINE	SOP20,.4	Codecs	1.27 mm	70 Cel	0 Cel	1 dB		DUAL	R-PDSO-G20		2.65 mm	13-BIT	7.5 mm	Not Qualified	MU-LAW		NOT SPECIFIED	NOT SPECIFIED	12.8 mm	YES
TCM320AC56CDWR	Texas Instruments	BASEBAND CIRCUIT	COMMERCIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		5 V		SMALL OUTLINE			1.27 mm	70 Cel	0 Cel			DUAL	R-PDSO-G20		2.65 mm		7.5 mm	Not Qualified					12.8 mm
TLV320AC57CDWR	Texas Instruments	BASEBAND CIRCUIT	COMMERCIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		3 V		SMALL OUTLINE			1.27 mm	70 Cel	0 Cel			DUAL	R-PDSO-G20		2.65 mm		7.5 mm	Not Qualified					12.8 mm
TLV321AC37IDW	Texas Instruments	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		3 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel			DUAL	R-PDSO-G20		2.65 mm		7.5 mm	Not Qualified					12.8 mm
TCM320AC56DW	Texas Instruments	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			5 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel			DUAL	R-PDSO-G20		2.65 mm		7.5 mm	Not Qualified					12.8 mm
TLV320AC56IDWR	Texas Instruments	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		3 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel			DUAL	R-PDSO-G20		2.65 mm		7.5 mm	Not Qualified					12.8 mm
TCM320AC56CDW	Texas Instruments	BASEBAND CIRCUIT	COMMERCIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	.0099 mA	5 V	5	SMALL OUTLINE	SOP20,.4	Codecs	1.27 mm	70 Cel	0 Cel	1 dB		DUAL	R-PDSO-G20		2.65 mm	13-BIT	7.5 mm	Not Qualified	MU-LAW		NOT SPECIFIED	NOT SPECIFIED	12.8 mm	YES
TCM320AC57DW	Texas Instruments	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			5 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel			DUAL	R-PDSO-G20		2.65 mm		7.5 mm	Not Qualified					12.8 mm
TCM320AC57DWR	Texas Instruments	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			5 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel			DUAL	R-PDSO-G20		2.65 mm		7.5 mm	Not Qualified					12.8 mm
TCM320AC56IDW	Texas Instruments	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	.0099 mA	5 V	5	SMALL OUTLINE	SOP20,.4	Codecs	1.27 mm	85 Cel	-40 Cel	1 dB		DUAL	R-PDSO-G20		2.65 mm	13-BIT	7.5 mm	Not Qualified	MU-LAW		NOT SPECIFIED	NOT SPECIFIED	12.8 mm	YES
TLV320AC56DWR	Texas Instruments	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel			DUAL	R-PDSO-G20		2.65 mm		7.5 mm	Not Qualified					12.8 mm
TLV321AC36IDW	Texas Instruments	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		3 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel			DUAL	R-PDSO-G20		2.65 mm		7.5 mm	Not Qualified					12.8 mm
TLV320AC56IDW	Texas Instruments	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	.0075 mA	3 V	3	SMALL OUTLINE	SOP20,.4	Codecs	1.27 mm	85 Cel	-40 Cel	1 dB		DUAL	R-PDSO-G20		2.65 mm	13-BIT	7.5 mm	Not Qualified	MU-LAW		NOT SPECIFIED	NOT SPECIFIED	12.8 mm	YES
TCM320AC57CDWR	Texas Instruments	BASEBAND CIRCUIT	COMMERCIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		5 V		SMALL OUTLINE			1.27 mm	70 Cel	0 Cel			DUAL	R-PDSO-G20		2.65 mm		7.5 mm	Not Qualified					12.8 mm
TLV320AC56CDWR	Texas Instruments	BASEBAND CIRCUIT	COMMERCIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		3 V		SMALL OUTLINE			1.27 mm	70 Cel	0 Cel			DUAL	R-PDSO-G20		2.65 mm		7.5 mm	Not Qualified					12.8 mm
TLV320AC57CDW	Texas Instruments	BASEBAND CIRCUIT	COMMERCIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	.0075 mA	3 V	3	SMALL OUTLINE	SOP20,.4	Codecs	1.27 mm	70 Cel	0 Cel	1 dB		DUAL	R-PDSO-G20		2.65 mm	13-BIT	7.5 mm	Not Qualified	A-LAW		NOT SPECIFIED	NOT SPECIFIED	12.8 mm	YES
TLV320AC56DW	Texas Instruments	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel			DUAL	R-PDSO-G20		2.65 mm		7.5 mm	Not Qualified					12.8 mm
TLV320AC57IDW	Texas Instruments	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	.0075 mA	3 V	3	SMALL OUTLINE	SOP20,.4	Codecs	1.27 mm	85 Cel	-40 Cel	1 dB		DUAL	R-PDSO-G20		2.65 mm	13-BIT	7.5 mm	Not Qualified	A-LAW		NOT SPECIFIED	NOT SPECIFIED	12.8 mm	YES
TLV320AC57IDWR	Texas Instruments	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		3 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel			DUAL	R-PDSO-G20		2.65 mm		7.5 mm	Not Qualified					12.8 mm
TCM320AC57IDWR	Texas Instruments	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		5 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel			DUAL	R-PDSO-G20		2.65 mm		7.5 mm	Not Qualified					12.8 mm
MC13143D	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel			DUAL	R-PDSO-G8		1.75 mm		3.9 mm						4.9 mm
BLM6G10-30G,118	NXP Semiconductors	BASEBAND CIRCUIT		GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			28 V		SMALL OUTLINE			1.37 mm				TIN	DUAL	R-PDSO-G16	3	3.6 mm		11 mm			e3	30	245	15.9 mm
934060893135	NXP Semiconductors	BASEBAND CIRCUIT		GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			28 V		SMALL OUTLINE			1.37 mm					DUAL	R-PDSO-G16		3.6 mm		11 mm						15.9 mm
934060893127	NXP Semiconductors	BASEBAND CIRCUIT		GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			28 V		SMALL OUTLINE			1.37 mm					DUAL	R-PDSO-G16		3.6 mm		11 mm						15.9 mm
934060304118	NXP Semiconductors	BASEBAND CIRCUIT		GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			28 V		SMALL OUTLINE								DUAL	R-PDSO-G16		3.6 mm		11 mm						15.9 mm
UMF1000T-T	NXP Semiconductors	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		5 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel			DUAL	R-PDSO-G28		2.65 mm		7.5 mm	Not Qualified					17.9 mm
UMA1002T	NXP Semiconductors	BASEBAND CIRCUIT	OTHER	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	.0018 mA	3 V	3/5	SMALL OUTLINE	SOP28,.4	Cordless Telephone ICs	1.27 mm	70 Cel	-30 Cel		NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G28		2.65 mm		7.5 mm	Not Qualified		e4			17.9 mm
934060304135	NXP Semiconductors	BASEBAND CIRCUIT		GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			28 V		SMALL OUTLINE								DUAL	R-PDSO-G16		3.6 mm		11 mm						15.9 mm
UMA1002TD-T	NXP Semiconductors	BASEBAND CIRCUIT	OTHER	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		3 V		SMALL OUTLINE			1.27 mm	70 Cel	-30 Cel			DUAL	R-PDSO-G28		2.65 mm		7.5 mm	Not Qualified					17.9 mm
BLM6G10-30G,135	NXP Semiconductors	BASEBAND CIRCUIT		GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			28 V		SMALL OUTLINE			1.37 mm				Tin (Sn)	DUAL	R-PDSO-G16		3.6 mm		11 mm			e3			15.9 mm
UMA1002T-T	NXP Semiconductors	BASEBAND CIRCUIT	OTHER	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		3 V		SMALL OUTLINE			1.27 mm	70 Cel	-30 Cel			DUAL	R-PDSO-G28		2.65 mm		7.5 mm	Not Qualified					17.9 mm
UMA1000LT	NXP Semiconductors	BASEBAND CIRCUIT	OTHER	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		5 V		SMALL OUTLINE			1.27 mm	70 Cel	-30 Cel			DUAL	R-PDSO-G28		2.65 mm		7.5 mm	Not Qualified					17.9 mm
UMA1000TD-T	NXP Semiconductors	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		5 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel			DUAL	R-PDSO-G28		2.65 mm		7.5 mm	Not Qualified					17.9 mm
UMA1000LT-T	NXP Semiconductors	BASEBAND CIRCUIT	OTHER	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		5 V		SMALL OUTLINE			1.27 mm	70 Cel	-30 Cel			DUAL	R-PDSO-G28		2.65 mm		7.5 mm	Not Qualified					17.9 mm
UMF1000T	NXP Semiconductors	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		5 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel			DUAL	R-PDSO-G28		2.65 mm		7.5 mm	Not Qualified					17.9 mm
BLM6G10-30G,127	NXP Semiconductors	BASEBAND CIRCUIT		GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			28 V		SMALL OUTLINE			1.37 mm				Tin (Sn)	DUAL	R-PDSO-G16		3.6 mm		11 mm			e3			15.9 mm
UMA1000TD	NXP Semiconductors	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		5 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel			DUAL	R-PDSO-G28		2.65 mm		7.5 mm	Not Qualified					17.9 mm
934060893118	NXP Semiconductors	BASEBAND CIRCUIT		GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			28 V		SMALL OUTLINE			1.37 mm					DUAL	R-PDSO-G16		3.6 mm		11 mm						15.9 mm
934060304127	NXP Semiconductors	BASEBAND CIRCUIT		GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			28 V		SMALL OUTLINE								DUAL	R-PDSO-G16		3.6 mm		11 mm						15.9 mm

Cellphone ICs

Cellphone ICs (Integrated Circuits) are the electronic components that provide the processing power and functionality for modern cellphones. They are responsible for a wide range of functions, including signal processing, data storage, and communication protocols.

Some common types of cellphone ICs include:

1. Baseband processors: These ICs are responsible for handling the core functions of a cellphone, such as making calls and sending messages. They also manage the cellphone's power consumption and system resources.

2. Radio frequency (RF) transceivers: These ICs are responsible for transmitting and receiving RF signals over cellular networks. They also provide the ability to switch between different network bands and frequencies.

3. Power management ICs: These ICs manage the power supply and battery life of a cellphone. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

4. Memory ICs: These ICs provide storage for the cellphone's operating system, applications, and user data. They include flash memory, RAM, and other types of non-volatile memory.

5. Sensor ICs: These ICs provide sensing capabilities, such as accelerometers, gyroscopes, and proximity sensors. They enable the cellphone to detect motion, orientation, and other environmental conditions.