INDUSTRIAL Cellphone ICs 1,308

Reset All

Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Output Code	No. of Channels	Technology	Screening Level	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Resolution (um)	Minimum Operating Temperature	Terminal Finish	Maximum Output Voltage	Terminal Position	JESD-30 Code	Output (V)	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Input Type	Maximum Analog Input	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
MAX2620EUA+T	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1			BIPOLAR			3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel		-40 Cel	Matte Tin (Sn) - annealed		DUAL	S-PDSO-G8		1	1.1 mm	3 mm	Not Qualified			e3	30	260	3 mm
NRF9160-SIBA-B1A-R	Nordic Semiconductor Asa	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	127	LGA	RECTANGULAR	UNSPECIFIED	YES	1						3.8 V		GRID ARRAY	LGA127,21X30,20		.5 mm	85 Cel		-40 Cel			BOTTOM	R-XBGA-N127			1.1 mm	10.5 mm							16 mm
1185	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			CMOS			3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	85 Cel		-40 Cel			QUAD	S-PQCC-N16			.95 mm	4 mm	Not Qualified						4 mm
ADF7021BCPZ	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1						3 V	2.5/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel	MATTE TIN		QUAD	S-XQCC-N48		3	1 mm	7 mm	Not Qualified			e3	40	260	7 mm
SX8652IWLTRT	Semtech	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	14	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1						1.8 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel		-40 Cel	MATTE TIN		DUAL	R-PDSO-N14		2	.8 mm	3 mm	Not Qualified			e3		260	4 mm
MAX2606EUT-T	Maxim Integrated	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	6	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1						2.75 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.95 mm	85 Cel		-40 Cel	TIN LEAD		DUAL	R-PDSO-G6		1	1.45 mm	1.625 mm	Not Qualified			e0			2.9 mm
MAX2606EUT+T	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	6	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1						2.75 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.95 mm	85 Cel		-40 Cel	Matte Tin (Sn) - annealed		DUAL	R-PDSO-G6		1	1.45 mm	1.625 mm	Not Qualified			e3	30	260	2.9 mm
MAX-7W-0	U-blox Ag	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	18		RECTANGULAR	UNSPECIFIED	NO	1				AEC-Q100		3 V		MICROELECTRONIC ASSEMBLY			1.1 mm	85 Cel		-40 Cel			DUAL	R-XDMA-N18		4	2.7 mm	9.7 mm							10.1 mm
HMC832ALP6GETR	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	1						3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel		-40 Cel	TIN		QUAD	S-XQCC-N40		1	.9 mm	6 mm				e3	30	260	6 mm
HMC830LP6GE	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1						3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel		-40 Cel	MATTE TIN		QUAD	S-PQCC-N40		1	.9 mm	6 mm	Not Qualified			e3		260	6 mm
LMH2110TM	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	6	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1						4.5 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel		-40 Cel			BOTTOM	R-PBGA-B6			.675 mm	.84 mm	Not Qualified						1.24 mm
CC115LRTKR	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1						3.6 V	1.8/3.6	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC20,.16SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD		QUAD	S-PQCC-N20		3	.9 mm	4 mm	Not Qualified			e4	30	260	4 mm
ADF4360-0BCPZRL	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1			BICMOS			3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel	MATTE TIN		QUAD	S-XQCC-N24		3	1 mm	4 mm	Not Qualified			e3	30	260	4 mm
CC2591RGVR	Texas Instruments	RF FRONT END CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					4 mA	3 V	3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.16SQ,25	Other Telecom ICs	.65 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD		QUAD	S-PQCC-N16		2	1 mm	4 mm	Not Qualified			e4	30	260	4 mm
HMC832ALP6GE	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	1						3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel		-40 Cel	TIN		QUAD	S-XQCC-N40		1	.9 mm	6 mm				e3	30	260	6 mm
AT86RF231-ZF	Microchip Technology	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1			CMOS			3 V	1.8,3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel	MATTE TIN		QUAD	S-XQCC-N32			1 mm	5 mm	Not Qualified			e3			5 mm
LT5575EUF#TRPBF	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1						5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	85 Cel		-40 Cel	MATTE TIN		QUAD	S-PQCC-N16		1	.8 mm	4 mm	Not Qualified			e3	30	260	4 mm
ADF4360-8BCPZRL7	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1			BICMOS			3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel	MATTE TIN		QUAD	S-XQCC-N24		3	1 mm	4 mm	Not Qualified			e3	30	260	4 mm
MAX2620EUA	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1			BIPOLAR			3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel		-40 Cel	TIN LEAD		DUAL	S-PDSO-G8		1	1.1 mm	3 mm	Not Qualified			e0	20	240	3 mm
MAX2620EUA+	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1			BIPOLAR			3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel		-40 Cel	Matte Tin (Sn) - annealed		DUAL	S-PDSO-G8		1	1.1 mm	3 mm	Not Qualified			e3	30	260	3 mm
SI4136-F-GM	Silicon Labs	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	28	HVQCCN	SQUARE	UNSPECIFIED	YES	1			CMOS		.031 mA	3 V	3/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC28,.2SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel	MATTE TIN		QUAD	S-XQCC-N28		3	.9 mm	5 mm	Not Qualified			e3		260	5 mm
MAX5865ETM-T	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1	OFFSET BINARY	2	CMOS			3 V	1.8,3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	Codecs	.5 mm	85 Cel	8	-40 Cel	TIN LEAD	3 V	QUAD	S-XQCC-N48	VOLTAGE		.8 mm	7 mm	Not Qualified	DIFFERENTIAL	1.5 V	e0			7 mm
MAX5865ETM+T	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1			CMOS			3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel		-40 Cel	Matte Tin (Sn) - annealed		QUAD	S-XQCC-N48		1	.8 mm	7 mm	Not Qualified			e3	30	260	7 mm
CC1000PWR	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			CMOS		.001 mA	3 V	2.5/3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP28,.25	Other Telecom ICs	.65 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD		DUAL	R-PDSO-G28		3	1.2 mm	4.4 mm	Not Qualified			e4	30	260	9.7 mm
LT5575EUF#PBF	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1						5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	85 Cel		-40 Cel	MATTE TIN		QUAD	S-PQCC-N16		1	.8 mm	4 mm	Not Qualified			e3	30	260	4 mm
RFFM6903SR	Qorvo	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BUTT	28	HLGA	SQUARE	PLASTIC/EPOXY	YES	1						3.6 V		GRID ARRAY, HEAT SINK/SLUG				85 Cel		-40 Cel	NICKEL PALLADIUM GOLD		BOTTOM	S-PBGA-B28		3	1.05 mm	6 mm				e4	30	260	6 mm
AD8348ARU	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			BIPOLAR			5 V	5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP28,.25	Other Telecom ICs	.65 mm	85 Cel		-40 Cel	TIN LEAD		DUAL	R-PDSO-G28		1	1.2 mm	4.4 mm	Not Qualified			e0		240	9.7 mm
AD8348ARU-REEL7	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			BIPOLAR			5 V	5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP28,.25	Other Telecom ICs	.65 mm	85 Cel		-40 Cel	TIN LEAD		DUAL	R-PDSO-G28		1	1.2 mm	4.4 mm	Not Qualified			e0		240	9.7 mm
MAX2674EWT+T	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	6	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			BICMOS			3.3 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel		-40 Cel	TIN SILVER COPPER NICKEL		BOTTOM	R-PBGA-B6		1	.69 mm	.865 mm	Not Qualified			e2	30	260	1.27 mm
MAX2674EWT+T10	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	6	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			BICMOS			3.3 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel		-40 Cel	TIN SILVER COPPER NICKEL		BOTTOM	R-PBGA-B6		1	.69 mm	.865 mm				e2	30	260	1.27 mm
CC1110F32RSP	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	36	HVQCCN	SQUARE	UNSPECIFIED	YES	1			CMOS			3 V	3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC36,.25SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD		QUAD	S-XQCC-N36		3	.9 mm	6 mm	Not Qualified			e4	30	260	6 mm
AD6673BCPZ-250	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1			CMOS		.282 mA	1.8 V	1.8	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel	MATTE TIN		QUAD	S-XQCC-N48		3	.8 mm	7 mm	Not Qualified			e3	30	260	7 mm
ADF4360-3BCPZRL7	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1			BICMOS			3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel	MATTE TIN		QUAD	S-XQCC-N24		3	1 mm	4 mm	Not Qualified			e3	30	260	4 mm
SI4136-F-BT	Silicon Labs	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			CMOS		.031 mA	3 V	3/3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP24,.25	Other Telecom ICs	.65 mm	85 Cel		-40 Cel			DUAL	R-PDSO-G24			1.2 mm	4.4 mm	Not Qualified				NOT SPECIFIED	NOT SPECIFIED	7.8 mm
SI4136-F-GT	Silicon Labs	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			CMOS		.031 mA	3 V	3/3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP24,.25	Other Telecom ICs	.65 mm	85 Cel		-40 Cel	MATTE TIN		DUAL	R-PDSO-G24		3	1.2 mm	4.4 mm	Not Qualified			e3		260	7.8 mm
SI4136-F-GTR	Silicon Labs	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1						3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel		-40 Cel	MATTE TIN		DUAL	R-PDSO-G24		3	1.2 mm	4.4 mm	Not Qualified			e3		260	7.8 mm
SKY66101-11	Skyworks Solutions	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	36		SQUARE	UNSPECIFIED	YES	1						3.6 V		MICROELECTRONIC ASSEMBLY			.5 mm	85 Cel		-40 Cel			QUAD	S-XQMA-N36			1 mm	6 mm					NOT SPECIFIED	NOT SPECIFIED	6 mm
HMC602LP4	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1						5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel		-40 Cel	TIN LEAD		QUAD	S-PQCC-N24		1	1 mm	4 mm	Not Qualified			e0			4 mm
HMC786LP4ETR	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			BICMOS			5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel		-40 Cel	MATTE TIN		QUAD	S-PQCC-N24		1	1 mm	4 mm				e3	30	260	4 mm
LT5558EUF#PBF	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1						5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	85 Cel		-40 Cel	MATTE TIN		QUAD	S-PQCC-N16		1	.8 mm	4 mm	Not Qualified			e3	30	260	4 mm
MAX4003EUA/GH9-T	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1						3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel		-40 Cel			DUAL	S-PDSO-G8		1	1.1 mm	3 mm							3 mm
MAX4003EBL+	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	8	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1						3 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM	S-PBGA-B8		1	.67 mm	1.52 mm	Not Qualified			e1	30	260	1.52 mm
MAX4003EBL	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	8	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1						3 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel		-40 Cel	TIN LEAD		BOTTOM	S-PBGA-B8		1	.67 mm	1.52 mm	Not Qualified			e0			1.52 mm
MAX4003EBL-T	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	8	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1			CMOS			3 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel		-40 Cel	TIN LEAD		BOTTOM	S-PBGA-B8		1	.67 mm	1.52 mm	Not Qualified			e0			1.52 mm
MAX4003EBL+T	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	8	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1			CMOS			3 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM	S-PBGA-B8		1	.67 mm	1.52 mm	Not Qualified			e1	30	260	1.52 mm
SI4136-F-GMR	Silicon Labs	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	28	HVQCCN	SQUARE	UNSPECIFIED	YES	1						3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel		-40 Cel	MATTE TIN		QUAD	S-XQCC-N28		3	.9 mm	5 mm	Not Qualified			e3		260	5 mm
HMC786LP4E	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1			BICMOS			5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel		-40 Cel	MATTE TIN		QUAD	R-PQCC-N24		1	1 mm	4 mm	Not Qualified			e3		260	4 mm
TRF372017IRGZT	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					.25 mA	3.3 V	3.3,5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD SILVER		QUAD	S-PQCC-N48		2	1 mm	7 mm	Not Qualified			e4	30	260	7 mm

Cellphone ICs

Cellphone ICs (Integrated Circuits) are the electronic components that provide the processing power and functionality for modern cellphones. They are responsible for a wide range of functions, including signal processing, data storage, and communication protocols.

Some common types of cellphone ICs include:

1. Baseband processors: These ICs are responsible for handling the core functions of a cellphone, such as making calls and sending messages. They also manage the cellphone's power consumption and system resources.

2. Radio frequency (RF) transceivers: These ICs are responsible for transmitting and receiving RF signals over cellular networks. They also provide the ability to switch between different network bands and frequencies.

3. Power management ICs: These ICs manage the power supply and battery life of a cellphone. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

4. Memory ICs: These ICs provide storage for the cellphone's operating system, applications, and user data. They include flash memory, RAM, and other types of non-volatile memory.

5. Sensor ICs: These ICs provide sensing capabilities, such as accelerometers, gyroscopes, and proximity sensors. They enable the cellphone to detect motion, orientation, and other environmental conditions.