NO LEAD Cellphone ICs 1,033

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
MAX2365ETM+	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1		.09 mA	2.8 V	3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-XQCC-N48	1	.8 mm	7 mm	Not Qualified	e3	30	260	7 mm
MAX2396EGI	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	28	QCCN	RECTANGULAR	UNSPECIFIED	YES		BICMOS	.038 mA	3 V	3	CHIP CARRIER	LCC28,.2SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	R-XQCC-N28	1			Not Qualified	e0
MAX2021ETX	Maxim Integrated	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	36	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS	.315 mA	5 V	5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC36,.25SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-XQCC-N36	1	.8 mm	6 mm	Not Qualified	e0		245	6 mm
MAX2538ETI-T	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	28	VQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS		2.75 V		CHIP CARRIER, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-XQCC-N28	1	.9 mm	5 mm	Not Qualified	e0			5 mm
MAX9985ETX	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	36	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS		5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-XQCC-N36	1	.8 mm	6 mm	Not Qualified	e0			6 mm
MAX2029ETP	Maxim Integrated	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS		5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-XQCC-N20	1	.8 mm	5 mm	Not Qualified	e0		245	5 mm
MAX2369EGM-TD	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1			2.75 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-XQCC-N48	1	.8 mm	7 mm	Not Qualified	e0			7 mm
UPC8194K-E1	Renesas Electronics	BASEBAND CIRCUIT	OTHER	NO LEAD	20	VQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR	.0126 mA	3 V	3	CHIP CARRIER, VERY THIN PROFILE	LCC20,.12X.16,16	Other Telecom ICs	.4 mm	85 Cel	-25 Cel	TIN LEAD	QUAD	R-PQCC-N20		.9 mm	3 mm	Not Qualified	e0			4 mm
ZMD44102	Renesas Electronics	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	48	VQCCN	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		2.4 V		CHIP CARRIER, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD	S-PQCC-N48		.9 mm	7 mm	Not Qualified				7 mm
UPB1005K-E1	Renesas Electronics	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	36	VQCCN	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR		3 V		CHIP CARRIER, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-PQCC-N36		1 mm	6 mm	Not Qualified	e0			6 mm
UPC8195K-E1-A	Renesas Electronics	BASEBAND CIRCUIT	OTHER	NO LEAD	20	VQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR	.0126 mA	3 V	3	CHIP CARRIER, VERY THIN PROFILE	LCC20,.12X.16,16	Other Telecom ICs	.4 mm	85 Cel	-25 Cel	TIN BISMUTH	QUAD	R-PQCC-N20		.9 mm	3 mm	Not Qualified	e6			4 mm
UPC8158K-E1	Renesas Electronics	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	28	QCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR	.0376 mA	3 V	3	CHIP CARRIER	LCC28,.20X.22,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	Tin/Lead (Sn/Pb)	QUAD	R-PQCC-N28		1.05 mm	5.1 mm	Not Qualified	e0			5.5 mm
UPC8186K-E1	Renesas Electronics	RF AND BASEBAND CIRCUIT	COMMERCIAL EXTENDED	NO LEAD	24	QCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR	.041 mA	3 V	3	CHIP CARRIER	LCC24,.16X.2,20	Other Telecom ICs	.5 mm	80 Cel	-30 Cel	TIN LEAD	QUAD	R-PQCC-N24		1.05 mm	4.1 mm	Not Qualified	e0			5.1 mm
UPC8194K-E1-A	Renesas Electronics	BASEBAND CIRCUIT	OTHER	NO LEAD	20	VQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR	.0126 mA	3 V	3	CHIP CARRIER, VERY THIN PROFILE	LCC20,.12X.16,16	Other Telecom ICs	.4 mm	85 Cel	-25 Cel	TIN BISMUTH	QUAD	R-PQCC-N20		.9 mm	3 mm	Not Qualified	e6			4 mm
F6101NTGK8	Renesas Electronics	RF AND BASEBAND CIRCUIT		NO LEAD	40		SQUARE		YES	1	BICMOS								95 Cel	-40 Cel	TIN	QUAD	S-XQCC-N40	1				e3		260
UPC8190K-E1	Renesas Electronics	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	20	VQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR		3 V		CHIP CARRIER, VERY THIN PROFILE			.4 mm	85 Cel	-25 Cel		QUAD	R-PQCC-N20		.9 mm	3 mm					4 mm
UPB1005K	Renesas Electronics	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	36	VQCCN	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR		3 V		CHIP CARRIER, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-PQCC-N36		1 mm	6 mm	Not Qualified	e0			6 mm
UPC8195K-E1	Renesas Electronics	BASEBAND CIRCUIT	OTHER	NO LEAD	20	VQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR	.0126 mA	3 V	3	CHIP CARRIER, VERY THIN PROFILE	LCC20,.12X.16,16	Other Telecom ICs	.4 mm	85 Cel	-25 Cel	TIN LEAD	QUAD	R-PQCC-N20		.9 mm	3 mm	Not Qualified	e0			4 mm
IDTF1130NBGI	Renesas Electronics	RF AND BASEBAND CIRCUIT		NO LEAD	48	HVQCCN	SQUARE		YES	1			5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20		.5 mm	105 Cel	-40 Cel		QUAD	S-XQCC-N48		.8 mm	7 mm					7 mm
F1180NBGI	Renesas Electronics	RF AND BASEBAND CIRCUIT		NO LEAD	48	HVQCCN	SQUARE		YES	1		410 mA	5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20		.5 mm	105 Cel	-40 Cel	TIN	QUAD	S-XQCC-N48	1	.8 mm	7 mm		e3		260	7 mm
UPC8191K-E1	Renesas Electronics	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	20	VQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR		3 V		CHIP CARRIER, VERY THIN PROFILE			.4 mm	85 Cel	-25 Cel		QUAD	R-PQCC-N20		.9 mm	3 mm					4 mm
RP-M110A	Littelfuse	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	45		RECTANGULAR	UNSPECIFIED	YES	1			1.5 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		QUAD	R-XQMA-N45		2.6 mm	14.9 mm					17.9 mm
RP-M100A	Littelfuse	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	45		RECTANGULAR	UNSPECIFIED	YES	1			1.5 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		QUAD	R-XQMA-N45		2.6 mm	14.9 mm					17.9 mm
RP-M2470BW	Littelfuse	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	48		RECTANGULAR	UNSPECIFIED	YES	1			1.8 V		MICROELECTRONIC ASSEMBLY				70 Cel	-20 Cel		UNSPECIFIED	R-XXMA-N48		2.4 mm	15 mm					18 mm
RP-M2455AP	Littelfuse	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	38		RECTANGULAR	UNSPECIFIED	YES	1			1.5 V		MICROELECTRONIC ASSEMBLY			1.3 mm	70 Cel	-20 Cel		QUAD	R-XQMA-N38			16 mm					22 mm
ACMD-4102-BLK	Broadcom	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	9	QCCN	SQUARE	UNSPECIFIED	YES	1					CHIP CARRIER				85 Cel	-20 Cel	GOLD	BOTTOM	S-XBCC-N9	3	1.05 mm	2.4 mm	Not Qualified	e4			2.4 mm
ACPM-7051-TR1	Broadcom	RF AND BASEBAND CIRCUIT		NO LEAD	24		RECTANGULAR	UNSPECIFIED	YES	1			3.4 V		MICROELECTRONIC ASSEMBLY			.64 mm				QUAD	R-XQMA-N24	3	1 mm	5 mm				260	7.5 mm
AJAV-5602-BLK	Broadcom	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	10	HVSON	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.8 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.6 mm	90 Cel	-30 Cel	TIN	DUAL	S-PDSO-N10	1	.9 mm	3 mm		e3		260	3 mm
AJAV-5601-TR1	Broadcom	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	10	HVSON	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.8 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.6 mm	90 Cel	-30 Cel	TIN	DUAL	S-PDSO-N10	1	.9 mm	3 mm		e3		260	3 mm
WS1405-TR1	Broadcom	RF AND BASEBAND CIRCUIT		NO LEAD	8	HQCCN	SQUARE		YES	1		520 mA	3.4 V		CHIP CARRIER, HEAT SINK/SLUG	SOLCC8,.16,32		.8 mm	85 Cel	-30 Cel		DUAL	S-XQCC-N8		1.1 mm	3 mm					3 mm
ACPM-7355-TR1	Broadcom	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	14		RECTANGULAR	UNSPECIFIED	NO	2	BIPOLAR		3.4 V		MICROELECTRONIC ASSEMBLY			.73 mm	85 Cel	-30 Cel		DUAL	R-XDMA-N14	3	1.05 mm	4 mm				260	5 mm
ACFM-7325-BLK	Broadcom	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	5	QCCN	RECTANGULAR	UNSPECIFIED	YES	1					CHIP CARRIER				85 Cel	-40 Cel	GOLD	QUAD	R-XQCC-N5	3	1.2 mm	4 mm		e4			7 mm
ACFM-7103-BLK	Broadcom	RF FRONT END CIRCUIT		NO LEAD	7		RECTANGULAR	UNSPECIFIED	NO						MICROELECTRONIC ASSEMBLY							DUAL	R-XDMA-N7
ACPM-7051-BLK	Broadcom	RF AND BASEBAND CIRCUIT		NO LEAD	24		RECTANGULAR	UNSPECIFIED	YES	1			3.4 V		MICROELECTRONIC ASSEMBLY			.64 mm				QUAD	R-XQMA-N24	3	1 mm	5 mm				260	7.5 mm
ACPM-9005-BLK	Broadcom	RF AND BASEBAND CIRCUIT		NO LEAD	10	DMA	RECTANGULAR	UNSPECIFIED	YES	1					MICROELECTRONIC ASSEMBLY							DUAL	R-XDMA-N10		.92 mm	2 mm					2.5 mm
ACPM-7353-TR1G	Broadcom	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	14		RECTANGULAR	UNSPECIFIED	NO	2	BIPOLAR		3.4 V		MICROELECTRONIC ASSEMBLY			.73 mm	85 Cel	-30 Cel		DUAL	R-XDMA-N14	3	1 mm	4 mm				260	5 mm
ALM-2506-TR1G	Broadcom	RF AND BASEBAND CIRCUIT		NO LEAD	6	HTSON	SQUARE	PLASTIC/EPOXY	YES	1			2.85 V		SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE			.65 mm				DUAL	S-PDSO-N6		1.2 mm	2 mm	Not Qualified				2 mm
AJAV-5508-BLK	Broadcom	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	10	HVSON	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.8 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.6 mm	90 Cel	-30 Cel	TIN	DUAL	S-PDSO-N10	1	.9 mm	3 mm		e3		260	3 mm
ALM-2506-TR2G	Broadcom	RF AND BASEBAND CIRCUIT		NO LEAD	6	HTSON	SQUARE	PLASTIC/EPOXY	YES	1			2.85 V		SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE			.65 mm				DUAL	S-PDSO-N6		1.2 mm	2 mm	Not Qualified				2 mm
ACMD-7410-BLK	Broadcom	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	9		RECTANGULAR	UNSPECIFIED	YES	1					MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel	GOLD	UNSPECIFIED	R-XXMA-N9	3	.95 mm		Not Qualified	e4
ALM-1522-TR1G	Broadcom	BASEBAND CIRCUIT		NO LEAD	22		RECTANGULAR	UNSPECIFIED	YES	1			5 V		MICROELECTRONIC ASSEMBLY							QUAD	R-XQMA-N22	2			Not Qualified			260
ACFM-9025-BLK	Broadcom	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	5		RECTANGULAR	UNSPECIFIED	NO	1					MICROELECTRONIC ASSEMBLY			2.15 mm	85 Cel	-40 Cel		DUAL	R-XDMA-N5		1.1 mm	4 mm					7 mm
ACPM-7251-BLK	Broadcom	RF AND BASEBAND CIRCUIT		NO LEAD	24		RECTANGULAR	UNSPECIFIED	YES	1			3.4 V		MICROELECTRONIC ASSEMBLY			.64 mm				QUAD	R-XQMA-N24		1 mm	5 mm					7.5 mm
ACFM-9025-TR1	Broadcom	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	5		RECTANGULAR	UNSPECIFIED	NO	1					MICROELECTRONIC ASSEMBLY			2.15 mm	85 Cel	-40 Cel		DUAL	R-XDMA-N5		1.1 mm	4 mm					7 mm
WS1405-BLK	Broadcom	RF AND BASEBAND CIRCUIT		NO LEAD	8	HQCCN	SQUARE		YES	1		520 mA	3.4 V		CHIP CARRIER, HEAT SINK/SLUG	SOLCC8,.16,32		.8 mm	85 Cel	-30 Cel		DUAL	S-XQCC-N8		1.1 mm	3 mm					3 mm
ACFM-7109-TR1	Broadcom	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	5	QCCN	RECTANGULAR	UNSPECIFIED	YES	1					CHIP CARRIER				85 Cel	-40 Cel	GOLD	QUAD	R-XQCC-N5	3	1.05 mm	3 mm		e4			5 mm
ACPM-9001-BLK	Broadcom	RF AND BASEBAND CIRCUIT		NO LEAD	10	DMA	RECTANGULAR	UNSPECIFIED	YES	1					MICROELECTRONIC ASSEMBLY							DUAL	R-XDMA-N10		.92 mm	2 mm					2.5 mm
ACPM-7081-BLK	Broadcom	RF AND BASEBAND CIRCUIT		NO LEAD	24		RECTANGULAR	UNSPECIFIED	YES	1			3.4 V		MICROELECTRONIC ASSEMBLY			.64 mm				QUAD	R-XQMA-N24		1 mm	5 mm					7.5 mm

Cellphone ICs

Cellphone ICs (Integrated Circuits) are the electronic components that provide the processing power and functionality for modern cellphones. They are responsible for a wide range of functions, including signal processing, data storage, and communication protocols.

Some common types of cellphone ICs include:

1. Baseband processors: These ICs are responsible for handling the core functions of a cellphone, such as making calls and sending messages. They also manage the cellphone's power consumption and system resources.

2. Radio frequency (RF) transceivers: These ICs are responsible for transmitting and receiving RF signals over cellular networks. They also provide the ability to switch between different network bands and frequencies.

3. Power management ICs: These ICs manage the power supply and battery life of a cellphone. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

4. Memory ICs: These ICs provide storage for the cellphone's operating system, applications, and user data. They include flash memory, RAM, and other types of non-volatile memory.

5. Sensor ICs: These ICs provide sensing capabilities, such as accelerometers, gyroscopes, and proximity sensors. They enable the cellphone to detect motion, orientation, and other environmental conditions.