NO LEAD Cellphone ICs 1,033

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Nominal Supply Voltage	Package Style (Meter)	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Peak Reflow Temperature (C)	Length
ACMD-4102-TR1	Broadcom	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	9	QCCN	SQUARE	UNSPECIFIED	YES	1			CHIP CARRIER		85 Cel	-20 Cel	GOLD	BOTTOM	S-XBCC-N9	3	1.05 mm	2.4 mm	Not Qualified	e4		2.4 mm
ACPM-7081-TR1	Broadcom	RF AND BASEBAND CIRCUIT		NO LEAD	24		RECTANGULAR	UNSPECIFIED	YES	1		3.4 V	MICROELECTRONIC ASSEMBLY	.64 mm				QUAD	R-XQMA-N24		1 mm	5 mm				7.5 mm
ACPM-7353-BLK	Broadcom	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	14		RECTANGULAR	UNSPECIFIED	NO	2	BIPOLAR	3.4 V	MICROELECTRONIC ASSEMBLY	.73 mm	85 Cel	-30 Cel		DUAL	R-XDMA-N14	3	1 mm	4 mm			260	5 mm
ACFM-7107-BLK	Broadcom	RF FRONT END CIRCUIT	INDUSTRIAL	NO LEAD	5		RECTANGULAR	UNSPECIFIED	NO	1			MICROELECTRONIC ASSEMBLY	2.15 mm	85 Cel	-40 Cel	GOLD	DUAL	R-XDMA-N5	3	1.1 mm	4 mm		e4		7 mm
ACPM-7251-TR1	Broadcom	RF AND BASEBAND CIRCUIT		NO LEAD	24		RECTANGULAR	UNSPECIFIED	YES	1		3.4 V	MICROELECTRONIC ASSEMBLY	.64 mm				QUAD	R-XQMA-N24		1 mm	5 mm				7.5 mm
ALM-2506-BLKG	Broadcom	RF AND BASEBAND CIRCUIT		NO LEAD	6	HTSON	SQUARE	PLASTIC/EPOXY	YES	1		2.85 V	SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE	.65 mm				DUAL	S-PDSO-N6		1.2 mm	2 mm	Not Qualified			2 mm
ACMD-7610-BLK	Broadcom	RF AND BASEBAND CIRCUIT		NO LEAD	8		RECTANGULAR	UNSPECIFIED	YES				UNCASED CHIP				GOLD	UPPER	R-XUUC-N8	3			Not Qualified	e4
ACFM-7325-TR1	Broadcom	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	5	QCCN	RECTANGULAR	UNSPECIFIED	YES	1			CHIP CARRIER		85 Cel	-40 Cel	GOLD	QUAD	R-XQCC-N5	3	1.2 mm	4 mm		e4		7 mm
ALM-1522-BLKG	Broadcom	BASEBAND CIRCUIT		NO LEAD	22		RECTANGULAR	UNSPECIFIED	YES	1		5 V	MICROELECTRONIC ASSEMBLY					QUAD	R-XQMA-N22	2			Not Qualified		260
ACPM-7831-TR1	Broadcom	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	6		RECTANGULAR	UNSPECIFIED	NO	1		3.4 V	MICROELECTRONIC ASSEMBLY		85 Cel	-30 Cel	TIN LEAD	DUAL	R-XDMA-N6				Not Qualified	e0
ACMD-7610-TR1	Broadcom	RF AND BASEBAND CIRCUIT		NO LEAD	8		RECTANGULAR	UNSPECIFIED	YES				UNCASED CHIP				GOLD	UPPER	R-XUUC-N8	3			Not Qualified	e4
ACPM-7831-BLK	Broadcom	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	6		RECTANGULAR	UNSPECIFIED	NO	1		3.4 V	MICROELECTRONIC ASSEMBLY		85 Cel	-30 Cel	TIN LEAD	DUAL	R-XDMA-N6				Not Qualified	e0
ACFM-7107-TR1	Broadcom	RF FRONT END CIRCUIT	INDUSTRIAL	NO LEAD	5		RECTANGULAR	UNSPECIFIED	NO	1			MICROELECTRONIC ASSEMBLY	2.15 mm	85 Cel	-40 Cel	GOLD	DUAL	R-XDMA-N5	3	1.1 mm	4 mm		e4		7 mm
ACFM-7110-TR1	Broadcom	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	5	QCCN	RECTANGULAR	UNSPECIFIED	YES	1			CHIP CARRIER		85 Cel	-40 Cel	GOLD	QUAD	R-XQCC-N5	3	1.05 mm	3 mm		e4		5 mm
ACPM-7355-BLK	Broadcom	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	14		RECTANGULAR	UNSPECIFIED	NO	2	BIPOLAR	3.4 V	MICROELECTRONIC ASSEMBLY	.73 mm	85 Cel	-30 Cel		DUAL	R-XDMA-N14	3	1.05 mm	4 mm			260	5 mm
ACFM-7103-TR1	Broadcom	RF FRONT END CIRCUIT		NO LEAD	7		RECTANGULAR	UNSPECIFIED	NO				MICROELECTRONIC ASSEMBLY					DUAL	R-XDMA-N7
ACFM-7110-BLK	Broadcom	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	5	QCCN	RECTANGULAR	UNSPECIFIED	YES	1			CHIP CARRIER		85 Cel	-40 Cel	GOLD	QUAD	R-XQCC-N5	3	1.05 mm	3 mm		e4		5 mm
ALM-1522-TR2G	Broadcom	BASEBAND CIRCUIT		NO LEAD	22		RECTANGULAR	UNSPECIFIED	YES	1		5 V	MICROELECTRONIC ASSEMBLY					QUAD	R-XQMA-N22	2			Not Qualified		260
ACFM-7109-BLK	Broadcom	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	5	QCCN	RECTANGULAR	UNSPECIFIED	YES	1			CHIP CARRIER		85 Cel	-40 Cel	GOLD	QUAD	R-XQCC-N5	3	1.05 mm	3 mm		e4		5 mm
AJAV-5602-TR1	Broadcom	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	10	HVSON	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	3.8 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	.6 mm	90 Cel	-30 Cel	TIN	DUAL	S-PDSO-N10	1	.9 mm	3 mm		e3	260	3 mm
ACPM-7788-TR1	Broadcom	RF FRONT END CIRCUIT		NO LEAD	42		RECTANGULAR		YES	1								QUAD	R-XQCC-N42		.9 mm	5 mm				7 mm
AJAV-5601-BLK	Broadcom	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	10	HVSON	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	3.8 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	.6 mm	90 Cel	-30 Cel	TIN	DUAL	S-PDSO-N10	1	.9 mm	3 mm		e3	260	3 mm
AJAV-5508-TR1	Broadcom	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	10	HVSON	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	3.8 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	.6 mm	90 Cel	-30 Cel	TIN	DUAL	S-PDSO-N10	1	.9 mm	3 mm		e3	260	3 mm
S1M8674X01-G0T0	Samsung	RF AND BASEBAND CIRCUIT	COMMERCIAL EXTENDED	NO LEAD	24	VQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS	3 V	CHIP CARRIER, VERY THIN PROFILE	.5 mm	80 Cel	-30 Cel		QUAD	R-PQCC-N24		1 mm	3.5 mm	Not Qualified			4.5 mm
S1M8673X01-G0T0	Samsung	RF AND BASEBAND CIRCUIT	COMMERCIAL EXTENDED	NO LEAD	24	VQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS	3 V	CHIP CARRIER, VERY THIN PROFILE	.5 mm	80 Cel	-30 Cel		QUAD	R-PQCC-N24		1 mm	3.5 mm	Not Qualified			4.5 mm

Cellphone ICs

Cellphone ICs (Integrated Circuits) are the electronic components that provide the processing power and functionality for modern cellphones. They are responsible for a wide range of functions, including signal processing, data storage, and communication protocols.

Some common types of cellphone ICs include:

1. Baseband processors: These ICs are responsible for handling the core functions of a cellphone, such as making calls and sending messages. They also manage the cellphone's power consumption and system resources.

2. Radio frequency (RF) transceivers: These ICs are responsible for transmitting and receiving RF signals over cellular networks. They also provide the ability to switch between different network bands and frequencies.

3. Power management ICs: These ICs manage the power supply and battery life of a cellphone. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

4. Memory ICs: These ICs provide storage for the cellphone's operating system, applications, and user data. They include flash memory, RAM, and other types of non-volatile memory.

5. Sensor ICs: These ICs provide sensing capabilities, such as accelerometers, gyroscopes, and proximity sensors. They enable the cellphone to detect motion, orientation, and other environmental conditions.