Analog Devices Cellphone ICs 479

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
ADF4360-2BCPZ	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS		3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-XQCC-N24	3	1 mm	4 mm	Not Qualified	e3	30	260	4 mm
ADF7020-1BCPZ-RL7	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1			3 V	2.5/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-XQCC-N48	3	1 mm	7 mm	Not Qualified	e3	30	260	7 mm
MAX5865ETM+	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS		3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	QUAD	S-XQCC-N48	1	.8 mm	7 mm	Not Qualified	e3	30	260	7 mm
ADF4360-2BCPZRL7	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS		3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-XQCC-N24	3	1 mm	4 mm	Not Qualified	e3	30	260	4 mm
LTC5594IUH#PBF	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	105 Cel	-40 Cel	MATTE TIN	QUAD	S-PQCC-N32	1	.8 mm	5 mm		e3		260	5 mm
AD6636BBC	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1			1.8 V		GRID ARRAY			1 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B256	3	1.85 mm	17 mm				240	17 mm
AD6672BCPZ-250	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1		.145 mA	1.8 V	1.8	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-XQCC-N32	3	.8 mm	5 mm	Not Qualified	e3	30	260	5 mm
AD6672BCPZRL7-250	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1		.145 mA	1.8 V	1.8	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-XQCC-N32	3	.8 mm	5 mm	Not Qualified	e3	30	260	5 mm
ADF4360-2BCPZRL	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS		3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-XQCC-N24	3	1 mm	4 mm	Not Qualified	e3		260	4 mm
LT5527EUF#PBF	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-PQCC-N16	1	.8 mm	4 mm	Not Qualified	e3	30	260	4 mm
ADF4360-2BCP	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS		3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-XQCC-N24	3	1 mm	4 mm	Not Qualified	e0		240	4 mm
ADF4360-2BCPRL	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS		3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-XQCC-N24	3	1 mm	4 mm	Not Qualified	e0		240	4 mm
ADF4360-2BCPRL7	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS		3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-XQCC-N24	3	1 mm	4 mm	Not Qualified	e0		240	4 mm
ADF4360-3BCPZ	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS		3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-XQCC-N24	3	1 mm	4 mm	Not Qualified	e3	30	260	4 mm
ADF4360-3BCPZRL	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS		3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-XQCC-N24	3	1 mm	4 mm	Not Qualified	e3	30	260	4 mm
ADF7020BCPZ	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1			3 V	2.5/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-XQCC-N48	3	1 mm	7 mm	Not Qualified	e3	40	260	7 mm
HMC602LP4E	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-PQCC-N24	1	1 mm	4 mm	Not Qualified	e3	30	260	4 mm
HMC702LP6CE	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-PQCC-N40	1	.9 mm	6 mm	Not Qualified	e3			6 mm
ADF7021BCPZ-RL	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1			3 V	2.5/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-XQCC-N48	3	1 mm	7 mm	Not Qualified	e3		260	7 mm
ADRF5515ABCPZN	Analog Devices	RF FRONT END CIRCUIT																						3					30	260
ADRF5515ABCPZN-R7	Analog Devices	RF FRONT END CIRCUIT																						3					30	260
MAX9986AETP+T	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1			5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	QUAD	S-XQCC-N20	1	.8 mm	5 mm	Not Qualified	e3	30	260	5 mm
MAX9986AETP-T	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1			5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-XQCC-N20	1	.8 mm	5 mm	Not Qualified	e0			5 mm
ADRF5515BCPZN-RL	Analog Devices	RF AND BASEBAND CIRCUIT																						3					30	260
MAX4003EUA+	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1			3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL	S-PDSO-G8	1	1.1 mm	3 mm	Not Qualified	e3	30	260	3 mm
ADF4360-8BCPZ	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS		3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-XQCC-N24	3	1 mm	4 mm	Not Qualified	e3	30	260	4 mm
ADF4360-1BCPZ	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS		3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-XQCC-N24	3	1 mm	4 mm	Not Qualified	e3	30	260	4 mm
ADF7021-NBCPZ	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS		3 V	2.5/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-XQCC-N48	3	1 mm	7 mm	Not Qualified	e3	30	260	7 mm
MAX5864ETM+	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	QUAD	S-XQCC-N48	1	.8 mm	7 mm	Not Qualified	e3	30	260	7 mm
ADL5387ACPZ-WP	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BIPOLAR		5 V	5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-XQCC-N24	3	1 mm	4 mm	Not Qualified	e3		260	4 mm
MAX2902ETI+	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	28	HVQCCN	SQUARE	UNSPECIFIED	YES	1			4.5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	QUAD	S-XQCC-N28	1	.9 mm	5 mm	Not Qualified	e3	30	260	5 mm
ADL5387ACPZ-R7	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BIPOLAR		5 V	5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-XQCC-N24	3	1 mm	4 mm	Not Qualified	e3		260	4 mm
LT5521EUF#PBF	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-PQCC-N16	1	.8 mm	4 mm	Not Qualified	e3	30	260	4 mm
AD6688BBPZ-3000	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1			.975 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B196	3	1.53 mm	12 mm			30	260	12 mm
AD8348ARUZ-REEL7	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR		5 V	5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP28,.25	Other Telecom ICs	.65 mm	85 Cel	-40 Cel	MATTE TIN	DUAL	R-PDSO-G28	1	1.2 mm	4.4 mm	Not Qualified	e3	30	260	9.7 mm
ADF7020BCPZ-RL	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1			3 V	2.5/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-XQCC-N48	3	1 mm	7 mm	Not Qualified	e3		260	7 mm
ADF7021-VBCPZ	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1			3 V	2.5/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-XQCC-N48	3	1 mm	7 mm	Not Qualified	e3	30	260	7 mm
ADRF6701ACPZ-R7	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	40	QCCN	SQUARE	PLASTIC/EPOXY	YES		BICMOS		5 V	5	CHIP CARRIER	LCC40,.24SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		QUAD	S-PQCC-N40				Not Qualified		NOT SPECIFIED	NOT SPECIFIED
HMC422MS8ETR	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1			3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	MATTE TIN	DUAL	S-PDSO-G8	1	1.1 mm	3 mm		e3		260	3 mm
HMC689LP4ETR	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS		5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-PQCC-N24	1	1 mm	4 mm		e3	30	260	4 mm
HMC422MS8	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1			3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	TIN LEAD	DUAL	S-PDSO-G8	1	1.1 mm	3 mm	Not Qualified	e0		235	3 mm
AD6642BBCZ	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	.291 mA	1.8 V	1.8	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA144,12X12,32	Other Telecom ICs	.8 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B144	3	1.4 mm	10 mm	Not Qualified	e1	30	260	10 mm
AD6657BBCZRL	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1			1.8 V	1.8	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA144,12X12,32	Other Telecom ICs	.8 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B144	3	1.4 mm	10 mm	Not Qualified	e1	30	260	10 mm
LTC5598IUF#TRPBF	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	QUAD	S-PQCC-N24	1	.8 mm	4 mm	Not Qualified	e3	30	260	4 mm
AD6643BCPZ-250	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	64	HVQCCN	SQUARE	UNSPECIFIED	YES	2	CMOS	.275 mA	1.8 V	1.8	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC64,.35SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-XQCC-N64	3	1 mm	9 mm	Not Qualified	e3	30	260	9 mm
HMC381LP6TR	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	28	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	85 Cel	-40 Cel		QUAD	S-PQCC-N28		1 mm	6 mm					6 mm
HMC900LP5ETR	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD	S-PQCC-N32		1 mm	5 mm			NOT SPECIFIED	NOT SPECIFIED	5 mm
ADRV9010BBCZ-REEL	Analog Devices	RF AND BASEBAND CIRCUIT		BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1			1 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32		.8 mm	110 Cel	-40 Cel		BOTTOM	S-PBGA-B289		1.43 mm	14 mm			NOT SPECIFIED	NOT SPECIFIED	14 mm

Cellphone ICs

Cellphone ICs (Integrated Circuits) are the electronic components that provide the processing power and functionality for modern cellphones. They are responsible for a wide range of functions, including signal processing, data storage, and communication protocols.

Some common types of cellphone ICs include:

1. Baseband processors: These ICs are responsible for handling the core functions of a cellphone, such as making calls and sending messages. They also manage the cellphone's power consumption and system resources.

2. Radio frequency (RF) transceivers: These ICs are responsible for transmitting and receiving RF signals over cellular networks. They also provide the ability to switch between different network bands and frequencies.

3. Power management ICs: These ICs manage the power supply and battery life of a cellphone. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

4. Memory ICs: These ICs provide storage for the cellphone's operating system, applications, and user data. They include flash memory, RAM, and other types of non-volatile memory.

5. Sensor ICs: These ICs provide sensing capabilities, such as accelerometers, gyroscopes, and proximity sensors. They enable the cellphone to detect motion, orientation, and other environmental conditions.