Analog Devices Cellphone ICs 479

Reset All

Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
AD9361BBCZ	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1			1.3 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B144	3	1.7 mm	10 mm		e1		260	10 mm
AD9361BBCZ-REEL	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1			1.3 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B144	3	1.7 mm	10 mm		e1		260	10 mm
AD9361BBCZ-CSL	Analog Devices	RF AND BASEBAND CIRCUIT		BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1		150 mA	1.3 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA144,12X12,32		.8 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B144		1.7 mm	10 mm			NOT SPECIFIED	NOT SPECIFIED	10 mm
ADL5561ACPZ-R7	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-XQCC-N16	3	1 mm	3 mm		e3	30	260	3 mm
ADF4360-4BCPZRL	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS		3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-XQCC-N24	3	1 mm	4 mm	Not Qualified	e3	30	260	4 mm
ADF4360-7BCPZ	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS		3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-XQCC-N24	3	1 mm	4 mm	Not Qualified	e3	30	260	4 mm
ADF4360-4BCPZ	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS		3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-XQCC-N24	3	1 mm	4 mm	Not Qualified	e3	30	260	4 mm
ADF4360-4BCPZRL7	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS		3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-XQCC-N24	3	1 mm	4 mm	Not Qualified	e3	30	260	4 mm
ADL5561ACPZ-WP	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-XQCC-N16	3	1 mm	3 mm		e3	30	260	3 mm
MAX4003EUA+T	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1			3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL	S-PDSO-G8	1	1.1 mm	3 mm	Not Qualified	e3	30	260	3 mm
HMC832LP6GETR	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-PQCC-N40	1	.9 mm	6 mm		e3			6 mm
AD9361BBC-CSH	Analog Devices	RF AND BASEBAND CIRCUIT																											NOT SPECIFIED	NOT SPECIFIED
HMC830LP6GETR	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-PQCC-N40	1	.9 mm	6 mm		e3		260	6 mm
HMC832LP6GE	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-PQCC-N40	1	.9 mm	6 mm		e3		260	6 mm
ADF7021BCPZ-RL7	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1			3 V	2.5/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-XQCC-N48	3	1 mm	7 mm	Not Qualified	e3		260	7 mm
AD6636BBCZ	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		1.8 V		GRID ARRAY			1 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B256	3	1.85 mm	17 mm	Not Qualified	e1		260	17 mm
ADF4360-7BCPZRL7	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS		3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-XQCC-N24	3	1 mm	4 mm	Not Qualified	e3	30	260	4 mm
LT5526EUF#PBF	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-PQCC-N16	1	.8 mm	4 mm	Not Qualified	e3	30	260	4 mm
ADF4360-0BCPZ	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS		3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-XQCC-N24	3	1 mm	4 mm	Not Qualified	e3	30	260	4 mm
ADF7020-1BCPZ	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1			3 V	2.5/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-XQCC-N48	3	1 mm	7 mm	Not Qualified	e3	30	260	7 mm
AD607ARSZ	Analog Devices	BASEBAND CIRCUIT	OTHER	GULL WING	20	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3 V		SMALL OUTLINE, SHRINK PITCH			.65 mm	85 Cel	-25 Cel	MATTE TIN	DUAL	R-PDSO-G20	1	2 mm	5.3 mm	Not Qualified	e3		260	7.2 mm
AD607ARS	Analog Devices	BASEBAND CIRCUIT	OTHER	GULL WING	20	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3 V		SMALL OUTLINE, SHRINK PITCH			.65 mm	85 Cel	-25 Cel	TIN LEAD	DUAL	R-PDSO-G20	1	2 mm	5.3 mm	Not Qualified	e0		240	7.2 mm
ADF4360-7BCPZRL	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS		3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-XQCC-N24	3	1 mm	4 mm	Not Qualified	e3	30	260	4 mm
ADF4360-0BCPZRL7	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS		3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-XQCC-N24	3	1 mm	4 mm	Not Qualified	e3	30	260	4 mm
MAX2620EUA+T	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR		3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL	S-PDSO-G8	1	1.1 mm	3 mm	Not Qualified	e3	30	260	3 mm
ADF7021BCPZ	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1			3 V	2.5/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-XQCC-N48	3	1 mm	7 mm	Not Qualified	e3	40	260	7 mm
MAX2606EUT+T	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	6	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			2.75 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.95 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL	R-PDSO-G6	1	1.45 mm	1.625 mm	Not Qualified	e3	30	260	2.9 mm
HMC832ALP6GETR	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	1			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	TIN	QUAD	S-XQCC-N40	1	.9 mm	6 mm		e3	30	260	6 mm
HMC830LP6GE	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-PQCC-N40	1	.9 mm	6 mm	Not Qualified	e3		260	6 mm
AD607ARS-REEL	Analog Devices	BASEBAND CIRCUIT	OTHER	GULL WING	20	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3 V		SMALL OUTLINE, SHRINK PITCH			.65 mm	85 Cel	-25 Cel	TIN LEAD	DUAL	R-PDSO-G20	1	2 mm	5.3 mm	Not Qualified	e0		240	7.2 mm
AD607ARSZ-REEL	Analog Devices	BASEBAND CIRCUIT	OTHER	GULL WING	20	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3 V		SMALL OUTLINE, SHRINK PITCH			.65 mm	85 Cel	-25 Cel	MATTE TIN	DUAL	R-PDSO-G20	1	2 mm	5.3 mm	Not Qualified	e3		260	7.2 mm
ADF4360-0BCPZRL	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS		3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-XQCC-N24	3	1 mm	4 mm	Not Qualified	e3	30	260	4 mm
HMC832ALP6GE	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	1			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	TIN	QUAD	S-XQCC-N40	1	.9 mm	6 mm		e3	30	260	6 mm
LT5575EUF#TRPBF	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-PQCC-N16	1	.8 mm	4 mm	Not Qualified	e3	30	260	4 mm
AD9082BBPZ-2D2AC	Analog Devices	RF AND BASEBAND CIRCUIT																											NOT SPECIFIED	NOT SPECIFIED
ADF4360-8BCPZRL7	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS		3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-XQCC-N24	3	1 mm	4 mm	Not Qualified	e3	30	260	4 mm
MAX2620EUA+	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR		3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL	S-PDSO-G8	1	1.1 mm	3 mm	Not Qualified	e3	30	260	3 mm
MAX5865ETM+T	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS		3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	QUAD	S-XQCC-N48	1	.8 mm	7 mm	Not Qualified	e3	30	260	7 mm
LT5575EUF#PBF	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-PQCC-N16	1	.8 mm	4 mm	Not Qualified	e3	30	260	4 mm
AD8348ARU	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR		5 V	5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP28,.25	Other Telecom ICs	.65 mm	85 Cel	-40 Cel	TIN LEAD	DUAL	R-PDSO-G28	1	1.2 mm	4.4 mm	Not Qualified	e0		240	9.7 mm
AD8348ARU-REEL7	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR		5 V	5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP28,.25	Other Telecom ICs	.65 mm	85 Cel	-40 Cel	TIN LEAD	DUAL	R-PDSO-G28	1	1.2 mm	4.4 mm	Not Qualified	e0		240	9.7 mm
MAX2674EWT+T	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	6	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS		3.3 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-40 Cel	TIN SILVER COPPER NICKEL	BOTTOM	R-PBGA-B6	1	.69 mm	.865 mm	Not Qualified	e2	30	260	1.27 mm
AD6673BCPZ-250	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS	.282 mA	1.8 V	1.8	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-XQCC-N48	3	.8 mm	7 mm	Not Qualified	e3	30	260	7 mm
ADF4360-3BCPZRL7	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS		3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-XQCC-N24	3	1 mm	4 mm	Not Qualified	e3	30	260	4 mm
HMC602LP4	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-PQCC-N24	1	1 mm	4 mm	Not Qualified	e0			4 mm
HMC786LP4ETR	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS		5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-PQCC-N24	1	1 mm	4 mm		e3	30	260	4 mm
LT5558EUF#PBF	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-PQCC-N16	1	.8 mm	4 mm	Not Qualified	e3	30	260	4 mm
HMC786LP4E	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS		5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	R-PQCC-N24	1	1 mm	4 mm	Not Qualified	e3		260	4 mm

Cellphone ICs

Cellphone ICs (Integrated Circuits) are the electronic components that provide the processing power and functionality for modern cellphones. They are responsible for a wide range of functions, including signal processing, data storage, and communication protocols.

Some common types of cellphone ICs include:

1. Baseband processors: These ICs are responsible for handling the core functions of a cellphone, such as making calls and sending messages. They also manage the cellphone's power consumption and system resources.

2. Radio frequency (RF) transceivers: These ICs are responsible for transmitting and receiving RF signals over cellular networks. They also provide the ability to switch between different network bands and frequencies.

3. Power management ICs: These ICs manage the power supply and battery life of a cellphone. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

4. Memory ICs: These ICs provide storage for the cellphone's operating system, applications, and user data. They include flash memory, RAM, and other types of non-volatile memory.

5. Sensor ICs: These ICs provide sensing capabilities, such as accelerometers, gyroscopes, and proximity sensors. They enable the cellphone to detect motion, orientation, and other environmental conditions.