NXP Semiconductors Cellphone ICs 251

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
SA638	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS		3 V	3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP24,.25	Other Telecom ICs	.65 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G24		1.2 mm	4.4 mm	Not Qualified	e4			7.8 mm
AFSC5G23D37T2	NXP Semiconductors	RF AND BASEBAND CIRCUIT																						3					40	260
TEF8102EN/N1Y	NXP Semiconductors	RF AND BASEBAND CIRCUIT																						2						260
MC13202FCR2	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			2.7 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	TIN	QUAD	S-PQCC-N32	3	1 mm	5 mm	Not Qualified	e3	40	260	5 mm
MC13142D	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G16		1.75 mm	3.9 mm					9.9 mm
935322312528	NXP Semiconductors	RF AND BASEBAND CIRCUIT																			TIN			3				e3	40	260
935322319528	NXP Semiconductors	RF AND BASEBAND CIRCUIT																			TIN			3				e3	40	260
935294197115	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD	S-PQCC-N32		.85 mm	5 mm					5 mm
935318586557	NXP Semiconductors	RF AND BASEBAND CIRCUIT																			TIN			3				e3	40	260
935299973518	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	16	HQCCN	SQUARE	PLASTIC/EPOXY	YES	1			5 V		CHIP CARRIER, HEAT SINK/SLUG			1.42 mm	85 Cel	-40 Cel		QUAD	S-PQCC-N16		1.4 mm	8 mm					8 mm
LTE3401LX	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BUTT	6	BCC	RECTANGULAR	PLASTIC/EPOXY	YES	1			1.8 V		CHIP CARRIER			.4 mm	85 Cel	-40 Cel		BOTTOM	R-PBCC-B6	1	.4 mm	.7 mm				260	1.1 mm
MD7IC21100NBR1	NXP Semiconductors	RF AND BASEBAND CIRCUIT
935345736528	NXP Semiconductors	RF AND BASEBAND CIRCUIT																			NICKEL GOLD			3				e4	40	260
935295245515	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD	S-PQCC-N32		1 mm	5 mm					5 mm
935323261528	NXP Semiconductors	RF AND BASEBAND CIRCUIT																			TIN			3				e3	40	260
MC13191FCR2	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS		2.7 V	2.7	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		QUAD	S-PQCC-N32	3	1 mm	5 mm	Not Qualified		40	260	5 mm
935296759115	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	16	HQCCN	SQUARE	PLASTIC/EPOXY	YES	1			5 V		CHIP CARRIER, HEAT SINK/SLUG			1.42 mm	85 Cel	-40 Cel		QUAD	S-PQCC-N16		1.4 mm	8 mm					8 mm
935354631115	NXP Semiconductors	RF AND BASEBAND CIRCUIT
935373052528	NXP Semiconductors	RF AND BASEBAND CIRCUIT																						3					40	260
MC13770FC	NXP Semiconductors	RF FRONT END CIRCUIT	INDUSTRIAL	NO LEAD	12	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS		2.75 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD	S-PQCC-N12		1 mm	3 mm					3 mm
MD7IC2250GNR1	NXP Semiconductors	RF AND BASEBAND CIRCUIT		GULL WING	14		RECTANGULAR	PLASTIC/EPOXY	YES	1			28 V		FLANGE MOUNT						TIN	DUAL	R-PDFM-G14	3			Not Qualified	e3	40	260
935383952557	NXP Semiconductors	RF AND BASEBAND CIRCUIT																			NICKEL GOLD			3				e4	40	260
MC13191	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS		2.7 V	2.7	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		QUAD	S-PQCC-N32		1 mm	5 mm	Not Qualified				5 mm
MD7IC2251GNR1	NXP Semiconductors	RF AND BASEBAND CIRCUIT																			TIN			3				e3	40	260
MC13751FCR2	NXP Semiconductors	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS		2.78 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-30 Cel		QUAD	S-PQCC-N24		1 mm	4 mm					4 mm
935293417515	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD	S-PQCC-N32		1 mm	5 mm					5 mm
935300584518	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	16	HQCCN	SQUARE	PLASTIC/EPOXY	YES	1			5 V		CHIP CARRIER, HEAT SINK/SLUG			1.42 mm	85 Cel	-40 Cel		QUAD	S-PQCC-N16		1.4 mm	8 mm					8 mm
MC13192	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS		2.7 V	2.7	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		QUAD	S-PQCC-N32		1 mm	5 mm	Not Qualified				5 mm
MC13760	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	104	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1					GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	85 Cel	-40 Cel		BOTTOM	R-PBGA-B104		1.6 mm	10 mm					10 mm
935383953557	NXP Semiconductors	RF AND BASEBAND CIRCUIT																			NICKEL GOLD			3				e4	40	260
935296759518	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	16	HQCCN	SQUARE	PLASTIC/EPOXY	YES	1			5 V		CHIP CARRIER, HEAT SINK/SLUG			1.42 mm	85 Cel	-40 Cel		QUAD	S-PQCC-N16		1.4 mm	8 mm					8 mm
935316196528	NXP Semiconductors	RF AND BASEBAND CIRCUIT																			TIN			3				e3	40	260
935307899551	NXP Semiconductors	RF AND BASEBAND CIRCUIT
935363153528	NXP Semiconductors	RF AND BASEBAND CIRCUIT
935308612518	NXP Semiconductors	RF AND BASEBAND CIRCUIT
935314394528	NXP Semiconductors	RF AND BASEBAND CIRCUIT																			TIN			3				e3	40	260
MD7IC21100NR1	NXP Semiconductors	RF AND BASEBAND CIRCUIT
935314724528	NXP Semiconductors	RF AND BASEBAND CIRCUIT
935296762518	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	16	HQCCN	SQUARE	PLASTIC/EPOXY	YES	1			5 V		CHIP CARRIER, HEAT SINK/SLUG			1.42 mm	85 Cel	-40 Cel		QUAD	S-PQCC-N16		1.4 mm	8 mm					8 mm
MHT2001NR1	NXP Semiconductors	RF AND BASEBAND CIRCUIT																			TIN			3				e3	40	260
935293417115	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD	S-PQCC-N32		1 mm	5 mm					5 mm
935318954557	NXP Semiconductors	RF AND BASEBAND CIRCUIT																			TIN			3				e3	40	260
935307775518	NXP Semiconductors	RF AND BASEBAND CIRCUIT
935292558515	NXP Semiconductors	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD	S-PQCC-N32		.85 mm	5 mm					5 mm
MC13150FTA	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	24	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR	3 mA	3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-PQFP-G24		1.6 mm	4 mm	Not Qualified	e0			4 mm
MD7IC18120NR1	NXP Semiconductors	RF AND BASEBAND CIRCUIT
MD7IC2250NBR1	NXP Semiconductors	RF AND BASEBAND CIRCUIT		THROUGH-HOLE	14		RECTANGULAR	PLASTIC/EPOXY	NO	1			28 V		FLANGE MOUNT						TIN	DUAL	R-PDFM-T14	3			Not Qualified	e3	40	260
MC13192FCR2	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS		2.7 V	2.7	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		QUAD	S-PQCC-N32	3	1 mm	5 mm	Not Qualified		40	260	5 mm

Cellphone ICs

Cellphone ICs (Integrated Circuits) are the electronic components that provide the processing power and functionality for modern cellphones. They are responsible for a wide range of functions, including signal processing, data storage, and communication protocols.

Some common types of cellphone ICs include:

1. Baseband processors: These ICs are responsible for handling the core functions of a cellphone, such as making calls and sending messages. They also manage the cellphone's power consumption and system resources.

2. Radio frequency (RF) transceivers: These ICs are responsible for transmitting and receiving RF signals over cellular networks. They also provide the ability to switch between different network bands and frequencies.

3. Power management ICs: These ICs manage the power supply and battery life of a cellphone. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

4. Memory ICs: These ICs provide storage for the cellphone's operating system, applications, and user data. They include flash memory, RAM, and other types of non-volatile memory.

5. Sensor ICs: These ICs provide sensing capabilities, such as accelerometers, gyroscopes, and proximity sensors. They enable the cellphone to detect motion, orientation, and other environmental conditions.