STMicroelectronics Cellphone ICs 35

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	No. of Transceivers	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
S2-LPQTR	STMicroelectronics	RF AND BASEBAND CIRCUIT																								3					NOT SPECIFIED	260
ST25R3911B-AQFT	STMicroelectronics	RF AND BASEBAND CIRCUIT																				MATTE TIN				3				e3		260
ST25R3916-AQWT	STMicroelectronics	RF AND BASEBAND CIRCUIT																													NOT SPECIFIED	NOT SPECIFIED
ST25R3912-AWLT	STMicroelectronics	RF AND BASEBAND CIRCUIT	AUTOMOTIVE	BALL	30	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				3.3 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	125 Cel	-40 Cel		BOTTOM		R-PBGA-B30		.68 mm	2.865 mm			NOT SPECIFIED	NOT SPECIFIED	3.065 mm
ST25R3911B-AQWT	STMicroelectronics	RF AND BASEBAND CIRCUIT																				MATTE TIN				3				e3		260
ST25R3918AQWT	STMicroelectronics	RF AND BASEBAND CIRCUIT
BALF-NRG-02D3	STMicroelectronics	RF AND BASEBAND CIRCUIT		BALL	4	VBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1						GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA4,2X2,40/16		1 mm	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		R-PBGA-B4		.69 mm	.855 mm		e1	30	260	1.385 mm
ST25R3920B-AQWT	STMicroelectronics	RF AND BASEBAND CIRCUIT
ST25R3912-AQWT	STMicroelectronics	RF AND BASEBAND CIRCUIT																													NOT SPECIFIED	NOT SPECIFIED
ST25R3911B-ASWB	STMicroelectronics	RF AND BASEBAND CIRCUIT																													NOT SPECIFIED	NOT SPECIFIED
ST25R3920AQWT	STMicroelectronics	RF AND BASEBAND CIRCUIT
S2-LPCBQTR	STMicroelectronics	RF AND BASEBAND CIRCUIT																													NOT SPECIFIED	NOT SPECIFIED
S2-LPTXQTR	STMicroelectronics	RF AND BASEBAND CIRCUIT		NO LEAD	24	HVQCCN	SQUARE		YES	1				3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20		.5 mm	105 Cel	-40 Cel		QUAD		S-XQCC-N24		1 mm	4 mm			NOT SPECIFIED	NOT SPECIFIED	4 mm
ST25R3912-AQFT	STMicroelectronics	RF AND BASEBAND CIRCUIT	AUTOMOTIVE	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	125 Cel	-40 Cel		QUAD		S-XQCC-N32		1 mm	5 mm			NOT SPECIFIED	NOT SPECIFIED	5 mm
STA8089FGTR	STMicroelectronics	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS			1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N56	3	.9 mm	7 mm		e3	30	260	7 mm
STA8088EXA	STMicroelectronics	RF FRONT END CIRCUIT	INDUSTRIAL	BALL	169	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			1.2 V		GRID ARRAY, THIN PROFILE, FINE PITCH			.65 mm	85 Cel	-40 Cel		BOTTOM		S-PBGA-B169		1.2 mm	9 mm			NOT SPECIFIED	NOT SPECIFIED	9 mm
ST25R3913-AQFT	STMicroelectronics	RF AND BASEBAND CIRCUIT	AUTOMOTIVE	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	125 Cel	-40 Cel		QUAD		S-XQCC-N32		1 mm	5 mm			NOT SPECIFIED	NOT SPECIFIED	5 mm
STA8089FGB	STMicroelectronics	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS			1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N56	3	.9 mm	7 mm		e3	30	260	7 mm
STLC4560	STMicroelectronics	RF AND BASEBAND CIRCUIT	OTHER	BALL	240	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		1	.006 mA	3.6 V	1.86,3.6	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA240,15X16,20	Network Interfaces	.5 mm	85 Cel	-30 Cel		BOTTOM	54 Mbps	R-PBGA-B240		1.4 mm	8 mm	Not Qualified				8.5 mm
STA8089FGBTR	STMicroelectronics	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS			1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N56	3	.9 mm	7 mm		e3	30	260	7 mm
TN100-MOD	STMicroelectronics	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	44		RECTANGULAR	UNSPECIFIED	YES	1						MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		UNSPECIFIED		R-XXMA-N44
ST25R36911B-AQFT	STMicroelectronics	RF AND BASEBAND CIRCUIT
ST25R3911B-AQWB	STMicroelectronics	RF AND BASEBAND CIRCUIT																				MATTE TIN				3				e3		260
STRAFT-P98L15	STMicroelectronics	RF AND BASEBAND CIRCUIT	OTHER	BUTT	15	TFLGA	RECTANGULAR	UNSPECIFIED	YES	1						GRID ARRAY, THIN PROFILE, FINE PITCH			.75 mm	85 Cel	-25 Cel		BOTTOM		R-XBGA-B15		1.1 mm	2.7 mm					3.8 mm
STA8088TGATR	STMicroelectronics	RF AND BASEBAND CIRCUIT																				MATTE TIN				3				e3	40	260
ST25R3911B-ASWT	STMicroelectronics	RF AND BASEBAND CIRCUIT																				MATTE TIN				3				e3		260
STA8089FG	STMicroelectronics	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS			1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N56	3	.9 mm	7 mm		e3		260	7 mm
STLC4560TRAY	STMicroelectronics	RF AND BASEBAND CIRCUIT	OTHER	BALL	240	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		1	.006 mA	3.6 V	1.86,3.6	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA240,15X16,20	Network Interfaces	.5 mm	85 Cel	-30 Cel		BOTTOM	54 Mbps	R-PBGA-B240		1.4 mm	8 mm	Not Qualified				8.5 mm
DSL01-010SC5	STMicroelectronics	BASEBAND CIRCUIT		GULL WING	5		RECTANGULAR	PLASTIC/EPOXY	YES							SMALL OUTLINE						NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G5	1			Not Qualified	e4	30	260
DSL01-024SC5	STMicroelectronics	BASEBAND CIRCUIT		GULL WING	5		RECTANGULAR	PLASTIC/EPOXY	YES							SMALL OUTLINE						NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G5	1			Not Qualified	e4	30	260
ST25R3911B-AQFB	STMicroelectronics	RF AND BASEBAND CIRCUIT																				MATTE TIN				3				e3		260
ST25R3913-AWLT	STMicroelectronics	RF AND BASEBAND CIRCUIT
ST25R3913-AQWT	STMicroelectronics	RF AND BASEBAND CIRCUIT
STA8088EX	STMicroelectronics	RF FRONT END CIRCUIT	INDUSTRIAL	BALL	169	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			1.2 V		GRID ARRAY, THIN PROFILE, FINE PITCH			.65 mm	85 Cel	-40 Cel		BOTTOM		S-PBGA-B169		1.2 mm	9 mm			NOT SPECIFIED	NOT SPECIFIED	9 mm
STLC4420A	STMicroelectronics	RF AND BASEBAND CIRCUIT	COMMERCIAL EXTENDED	BALL	228	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		1		3.6 V	1.8,3.6	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA228,13X24,20	Network Interfaces	.5 mm	85 Cel	-30 Cel		BOTTOM	54 Mbps	R-PBGA-B228		1.4 mm	7 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	12.5 mm

Cellphone ICs

Cellphone ICs (Integrated Circuits) are the electronic components that provide the processing power and functionality for modern cellphones. They are responsible for a wide range of functions, including signal processing, data storage, and communication protocols.

Some common types of cellphone ICs include:

1. Baseband processors: These ICs are responsible for handling the core functions of a cellphone, such as making calls and sending messages. They also manage the cellphone's power consumption and system resources.

2. Radio frequency (RF) transceivers: These ICs are responsible for transmitting and receiving RF signals over cellular networks. They also provide the ability to switch between different network bands and frequencies.

3. Power management ICs: These ICs manage the power supply and battery life of a cellphone. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

4. Memory ICs: These ICs provide storage for the cellphone's operating system, applications, and user data. They include flash memory, RAM, and other types of non-volatile memory.

5. Sensor ICs: These ICs provide sensing capabilities, such as accelerometers, gyroscopes, and proximity sensors. They enable the cellphone to detect motion, orientation, and other environmental conditions.