32 Cordless Phone ICs 13

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
MC13156FB	NXP Semiconductors	CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT		GULL WING	32	LQFP	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR	8 mA			FLATPACK, LOW PROFILE	QFP32,.35SQ,32		.8 mm	85 Cel	-40 Cel		QUAD	S-PQFP-G32	1	1.6 mm	7.025 mm					7.025 mm
MC13158FTB	NXP Semiconductors	CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	32	LQFP	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR	9.5 mA	3 V		FLATPACK, LOW PROFILE	QFP32,.35SQ,32		.8 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-PQFP-G32	1	1.6 mm	7 mm		e0			7 mm
935202550518	NXP Semiconductors	CORDLESS TELEPHONE SUPPORT CIRCUIT	OTHER	GULL WING	32	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS		3.6 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-30 Cel	TIN	QUAD	S-PQFP-G32		1.6 mm	5 mm	Not Qualified	e3			5 mm
UAA3545HL	NXP Semiconductors	CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT	COMMERCIAL	GULL WING	32	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS		3.2 V	3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP32,.28SQ,20	Cordless Telephone ICs	.5 mm	60 Cel	-10 Cel	MATTE TIN	QUAD	S-PQFP-G32		1.6 mm	5 mm	Not Qualified	e3			5 mm
UAA2067G-T	NXP Semiconductors	CORDLESS TELEPHONE SUPPORT CIRCUIT	OTHER	GULL WING	32	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS		3.6 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-30 Cel		QUAD	S-PQFP-G32		1.6 mm	5 mm	Not Qualified				5 mm
935202550557	NXP Semiconductors	CORDLESS TELEPHONE SUPPORT CIRCUIT	OTHER	GULL WING	32	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS		3.6 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-30 Cel	TIN	QUAD	S-PQFP-G32		1.6 mm	5 mm	Not Qualified	e3			5 mm
UAA3545HL/C1,118	NXP Semiconductors	CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT	COMMERCIAL	GULL WING	32	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS		3.2 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	60 Cel	-10 Cel		QUAD	S-PQFP-G32		1.6 mm	5 mm	Not Qualified		40	260	5 mm
UAA2067G/C1	NXP Semiconductors	CORDLESS TELEPHONE SUPPORT CIRCUIT	OTHER	GULL WING	32	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS		3.6 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-30 Cel		QUAD	S-PQFP-G32		1.6 mm	5 mm	Not Qualified				5 mm
935202550551	NXP Semiconductors	CORDLESS TELEPHONE SUPPORT CIRCUIT	OTHER	GULL WING	32	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS		3.6 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-30 Cel	TIN	QUAD	S-PQFP-G32		1.6 mm	5 mm	Not Qualified	e3			5 mm
UAA2068AHL	NXP Semiconductors	CORDLESS TELEPHONE SUPPORT CIRCUIT	COMMERCIAL	GULL WING	32	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS		3.6 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	60 Cel	-10 Cel	Tin (Sn)	QUAD	S-PQFP-G32		1.6 mm	5 mm	Not Qualified	e3			5 mm
UAA2068G	NXP Semiconductors	CORDLESS TELEPHONE SUPPORT CIRCUIT	COMMERCIAL	GULL WING	32	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS		3.6 V	3.6	FLATPACK, LOW PROFILE, FINE PITCH	QFP32,.28SQ,20	Other Telecom ICs	.5 mm	60 Cel	-10 Cel	TIN	QUAD	S-PQFP-G32		1.6 mm	5 mm	Not Qualified	e3			5 mm
UAA2067GBE	NXP Semiconductors	CORDLESS TELEPHONE SUPPORT CIRCUIT	OTHER	GULL WING	32	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS		3.6 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-30 Cel		QUAD	S-PQFP-G32		1.6 mm	5 mm	Not Qualified				5 mm
UAA2067G	NXP Semiconductors	CORDLESS TELEPHONE SUPPORT CIRCUIT	OTHER	GULL WING	32	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS		3.6 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-30 Cel		QUAD	S-PQFP-G32		1.6 mm	5 mm	Not Qualified				5 mm

Cordless Phone ICs

Cordless phone ICs (Integrated Circuits) are the electronic components that provide the processing power and functionality for modern cordless phones. They are responsible for a wide range of functions, including signal processing, data storage, and communication protocols.

Some common types of cordless phone ICs include:

1. Baseband processors: These ICs are responsible for handling the core functions of a cordless phone, such as making calls and sending messages. They also manage the phone's power consumption and system resources.

2. Radio frequency (RF) transceivers: These ICs are responsible for transmitting and receiving RF signals over the cordless phone's base station and handset. They also provide the ability to switch between different frequency bands and channels.

3. Audio codecs: These ICs are responsible for encoding and decoding audio signals for clear voice communication over the cordless phone.

4. Power management ICs: These ICs manage the power supply and battery life of a cordless phone. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

5. Memory ICs: These ICs provide storage for the cordless phone's operating system, contacts, and call history. They include flash memory, RAM, and other types of non-volatile memory.