MC13156FB by NXP Semiconductors | Telecommunications

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Manufacturer	NXP Semiconductors
Manufacturer's Part Number	MC13156FB
Description	CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 32; Package Code: LQFP; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;
Datasheet	MC13156FB Datasheet
In Stock	3,828

NAME	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Telecom IC Type:	CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT
Maximum Seated Height:	1.6 mm
Surface Mount:	YES
Maximum Supply Current:	8 mA
Minimum Operating Temperature:	-40 Cel
No. of Functions:	1
No. of Terminals:	32
Package Equivalence Code:	QFP32,.35SQ,32
Terminal Position:	QUAD
Package Style (Meter):	FLATPACK, LOW PROFILE
Length:	7.025 mm
Technology:	BIPOLAR
JESD-30 Code:	S-PQFP-G32
Package Shape:	SQUARE
Terminal Form:	GULL WING
Maximum Operating Temperature:	85 Cel
Package Code:	LQFP
Width:	7.025 mm
Terminal Pitch:	.8 mm
Moisture Sensitivity Level (MSL):	1

Pricing (USD)

Qty.	Unit Price	Ext. Price
3,828	-	-

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