48 Cordless Phone ICs 11

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Maximum Seated Height	Width	Qualification	JESD-609 Code	Peak Reflow Temperature (C)	Length
LMX3161VBHX	Texas Instruments	CORDLESS TELEPHONE SUPPORT CIRCUIT	COMMERCIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS		3.6 V	3/5	FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	Other Telecom ICs	.5 mm	70 Cel	-10 Cel	Tin/Lead (Sn/Pb)	QUAD	S-PQFP-G48	1.6 mm	7 mm	Not Qualified	e0		7 mm
LMX3161VBH	Texas Instruments	CORDLESS TELEPHONE SUPPORT CIRCUIT	COMMERCIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS		3.6 V	3/5	FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	Other Telecom ICs	.5 mm	70 Cel	-10 Cel	Tin/Lead (Sn/Pb)	QUAD	S-PQFP-G48	1.6 mm	7 mm	Not Qualified	e0		7 mm
MC33411BFTA	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT	COMMERCIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS	20 mA	3.6 V	3.6	FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	Other Telecom ICs	.5 mm	70 Cel	-20 Cel	TIN LEAD	QUAD	S-PQFP-G48	1.6 mm	7 mm	Not Qualified	e0		7 mm
MC13111AFTA	NXP Semiconductors	CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT		GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1		10.5 mA	3.6 V		FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20		.5 mm	85 Cel	-40 Cel		QUAD	S-PQFP-G48	1.6 mm	7 mm				7 mm
MC13109AFTA	NXP Semiconductors	CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT		GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1		12 mA	2.6 V		FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20		.5 mm	85 Cel	-20 Cel		QUAD	S-PQFP-G48	1.6 mm	7 mm				7 mm
MC33411AFTA	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT	COMMERCIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS	20 mA	3.6 V	3.6	FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	Other Telecom ICs	.5 mm	70 Cel	-20 Cel	TIN LEAD	QUAD	S-PQFP-G48	1.6 mm	7 mm	Not Qualified	e0		7 mm
MC13110AFTA	NXP Semiconductors	CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT		GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1		10.5 mA	3.6 V		FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20		.5 mm	85 Cel	-40 Cel		QUAD	S-PQFP-G48	1.6 mm	7 mm				7 mm
UAA2062TS	NXP Semiconductors	CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT	COMMERCIAL	GULL WING	48	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS	.036 mA	3.6 V	3.6	SMALL OUTLINE, SHRINK PITCH	SSOP48,.4	Cordless Telephone ICs	.635 mm	70 Cel	-10 Cel		DUAL	R-PDSO-G48	2.8 mm	7.5 mm	Not Qualified			15.875 mm
HPMX-5002-TY1	Broadcom	CORDLESS TELEPHONE BASEBAND CIRCUIT		GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1			3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm				QUAD	S-PQFP-G48	1.6 mm	7 mm	Not Qualified			7 mm
S1T8528X01-Q0R0	Samsung	CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT	COMMERCIAL	GULL WING	48	QFP	SQUARE	PLASTIC/EPOXY	YES	1			3.6 V	3.6	FLATPACK	QFP48,.5SQ,30	Other Telecom ICs	.75 mm	70 Cel	-20 Cel	TIN LEAD	QUAD	S-PQFP-G48	2.3 mm	10 mm	Not Qualified	e0	240	10 mm
S1T8527C01-Q0R0	Samsung	CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT	COMMERCIAL	GULL WING	48	QFP	SQUARE	PLASTIC/EPOXY	YES	1			3.6 V		FLATPACK			.75 mm	70 Cel	-20 Cel		QUAD	S-PQFP-G48	2.3 mm	10 mm	Not Qualified			10 mm

Cordless Phone ICs

Cordless phone ICs (Integrated Circuits) are the electronic components that provide the processing power and functionality for modern cordless phones. They are responsible for a wide range of functions, including signal processing, data storage, and communication protocols.

Some common types of cordless phone ICs include:

1. Baseband processors: These ICs are responsible for handling the core functions of a cordless phone, such as making calls and sending messages. They also manage the phone's power consumption and system resources.

2. Radio frequency (RF) transceivers: These ICs are responsible for transmitting and receiving RF signals over the cordless phone's base station and handset. They also provide the ability to switch between different frequency bands and channels.

3. Audio codecs: These ICs are responsible for encoding and decoding audio signals for clear voice communication over the cordless phone.

4. Power management ICs: These ICs manage the power supply and battery life of a cordless phone. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

5. Memory ICs: These ICs provide storage for the cordless phone's operating system, contacts, and call history. They include flash memory, RAM, and other types of non-volatile memory.