LFQFP Cordless Phone ICs 35

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
LMX3161VBHX	Texas Instruments	CORDLESS TELEPHONE SUPPORT CIRCUIT	COMMERCIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS		3.6 V	3/5	FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	Other Telecom ICs	.5 mm	70 Cel	-10 Cel	Tin/Lead (Sn/Pb)	QUAD	S-PQFP-G48	1.6 mm	7 mm	Not Qualified	e0			7 mm
LMX3161VBH	Texas Instruments	CORDLESS TELEPHONE SUPPORT CIRCUIT	COMMERCIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS		3.6 V	3/5	FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	Other Telecom ICs	.5 mm	70 Cel	-10 Cel	Tin/Lead (Sn/Pb)	QUAD	S-PQFP-G48	1.6 mm	7 mm	Not Qualified	e0			7 mm
MC33411BFTA	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT	COMMERCIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS	20 mA	3.6 V	3.6	FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	Other Telecom ICs	.5 mm	70 Cel	-20 Cel	TIN LEAD	QUAD	S-PQFP-G48	1.6 mm	7 mm	Not Qualified	e0			7 mm
MC13111AFTA	NXP Semiconductors	CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT		GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1		10.5 mA	3.6 V		FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20		.5 mm	85 Cel	-40 Cel		QUAD	S-PQFP-G48	1.6 mm	7 mm					7 mm
MC13109AFTA	NXP Semiconductors	CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT		GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1		12 mA	2.6 V		FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20		.5 mm	85 Cel	-20 Cel		QUAD	S-PQFP-G48	1.6 mm	7 mm					7 mm
MC33411AFTA	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT	COMMERCIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS	20 mA	3.6 V	3.6	FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	Other Telecom ICs	.5 mm	70 Cel	-20 Cel	TIN LEAD	QUAD	S-PQFP-G48	1.6 mm	7 mm	Not Qualified	e0			7 mm
MC13110AFTA	NXP Semiconductors	CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT		GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1		10.5 mA	3.6 V		FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20		.5 mm	85 Cel	-40 Cel		QUAD	S-PQFP-G48	1.6 mm	7 mm					7 mm
SAA1575HLBE	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel		QUAD	S-PQFP-G100	1.6 mm	14 mm	Not Qualified				14 mm
PCD50922H-T	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT		GULL WING	80	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS				FLATPACK, LOW PROFILE, FINE PITCH			.5 mm			TIN	QUAD	S-PQFP-G80	1.6 mm	12 mm	Not Qualified	e3			12 mm
PCD50912H-T	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT		GULL WING	80	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS				FLATPACK, LOW PROFILE, FINE PITCH			.5 mm			TIN	QUAD	S-PQFP-G80	1.6 mm	12 mm	Not Qualified	e3			12 mm
935202550518	NXP Semiconductors	CORDLESS TELEPHONE SUPPORT CIRCUIT	OTHER	GULL WING	32	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS		3.6 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-30 Cel	TIN	QUAD	S-PQFP-G32	1.6 mm	5 mm	Not Qualified	e3			5 mm
PCD5041HZ-T	NXP Semiconductors	CORDLESS TELEPHONE BURST MODE CONTROLLER	OTHER	GULL WING	80	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	70 Cel	-25 Cel		QUAD	S-PQFP-G80	1.6 mm	12 mm	Not Qualified				12 mm
PCD5091HZ	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT		GULL WING	100	LFQFP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		3 V	3/3.3,5	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	Other Telecom ICs	.5 mm			TIN	QUAD	R-PQFP-G100	1.6 mm	14 mm	Not Qualified	e3			14 mm
PCD5042HZ	NXP Semiconductors	CORDLESS TELEPHONE BURST MODE CONTROLLER	OTHER	GULL WING	80	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	.012 mA	3 V	3/5	FLATPACK, LOW PROFILE, FINE PITCH	QFP80,.55SQ,20	Cordless Telephone ICs	.5 mm	70 Cel	-25 Cel		QUAD	S-PQFP-G80	1.6 mm	12 mm	Not Qualified				12 mm
PCD5041HZ	NXP Semiconductors	CORDLESS TELEPHONE BURST MODE CONTROLLER	OTHER	GULL WING	80	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	70 Cel	-25 Cel		QUAD	S-PQFP-G80	1.6 mm	12 mm	Not Qualified				12 mm
SAA1575HL/V2	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel		QUAD	S-PQFP-G100	1.6 mm	14 mm	Not Qualified				14 mm
PCD50912H	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT		GULL WING	80	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			3/3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP80,.55SQ,20	Other Telecom ICs	.5 mm			TIN	QUAD	S-PQFP-G80	1.6 mm	12 mm	Not Qualified	e3			12 mm
PCD5042HZ-T	NXP Semiconductors	CORDLESS TELEPHONE BURST MODE CONTROLLER	OTHER	GULL WING	80	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	70 Cel	-25 Cel		QUAD	S-PQFP-G80	1.6 mm	12 mm	Not Qualified				12 mm
UAA3545HL	NXP Semiconductors	CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT	COMMERCIAL	GULL WING	32	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS		3.2 V	3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP32,.28SQ,20	Cordless Telephone ICs	.5 mm	60 Cel	-10 Cel	MATTE TIN	QUAD	S-PQFP-G32	1.6 mm	5 mm	Not Qualified	e3			5 mm
PCD50922H	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT		GULL WING	80	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			3/3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP80,.55SQ,20	Other Telecom ICs	.5 mm			TIN	QUAD	S-PQFP-G80	1.6 mm	12 mm	Not Qualified	e3			12 mm
PCD5090HZ	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT		GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS				FLATPACK, LOW PROFILE, FINE PITCH			.5 mm				QUAD	S-PQFP-G100	1.6 mm	14 mm	Not Qualified				14 mm
UAA2067G-T	NXP Semiconductors	CORDLESS TELEPHONE SUPPORT CIRCUIT	OTHER	GULL WING	32	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS		3.6 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-30 Cel		QUAD	S-PQFP-G32	1.6 mm	5 mm	Not Qualified				5 mm
935260577557	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel		QUAD	S-PQFP-G100	1.6 mm	14 mm	Not Qualified				14 mm
935202550557	NXP Semiconductors	CORDLESS TELEPHONE SUPPORT CIRCUIT	OTHER	GULL WING	32	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS		3.6 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-30 Cel	TIN	QUAD	S-PQFP-G32	1.6 mm	5 mm	Not Qualified	e3			5 mm
UAA3545HL/C1,118	NXP Semiconductors	CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT	COMMERCIAL	GULL WING	32	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS		3.2 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	60 Cel	-10 Cel		QUAD	S-PQFP-G32	1.6 mm	5 mm	Not Qualified		40	260	5 mm
PCD5090HZ-T	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT		GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS				FLATPACK, LOW PROFILE, FINE PITCH			.5 mm				QUAD	S-PQFP-G100	1.6 mm	14 mm	Not Qualified				14 mm
UAA2067G/C1	NXP Semiconductors	CORDLESS TELEPHONE SUPPORT CIRCUIT	OTHER	GULL WING	32	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS		3.6 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-30 Cel		QUAD	S-PQFP-G32	1.6 mm	5 mm	Not Qualified				5 mm
935202550551	NXP Semiconductors	CORDLESS TELEPHONE SUPPORT CIRCUIT	OTHER	GULL WING	32	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS		3.6 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-30 Cel	TIN	QUAD	S-PQFP-G32	1.6 mm	5 mm	Not Qualified	e3			5 mm
UAA2068AHL	NXP Semiconductors	CORDLESS TELEPHONE SUPPORT CIRCUIT	COMMERCIAL	GULL WING	32	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS		3.6 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	60 Cel	-10 Cel	Tin (Sn)	QUAD	S-PQFP-G32	1.6 mm	5 mm	Not Qualified	e3			5 mm
UAA2068G	NXP Semiconductors	CORDLESS TELEPHONE SUPPORT CIRCUIT	COMMERCIAL	GULL WING	32	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS		3.6 V	3.6	FLATPACK, LOW PROFILE, FINE PITCH	QFP32,.28SQ,20	Other Telecom ICs	.5 mm	60 Cel	-10 Cel	TIN	QUAD	S-PQFP-G32	1.6 mm	5 mm	Not Qualified	e3			5 mm
PCD5091HZ-T	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT		GULL WING	100	LFQFP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm				QUAD	R-PQFP-G100	1.6 mm	14 mm	Not Qualified				14 mm
UAA2067GBE	NXP Semiconductors	CORDLESS TELEPHONE SUPPORT CIRCUIT	OTHER	GULL WING	32	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS		3.6 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-30 Cel		QUAD	S-PQFP-G32	1.6 mm	5 mm	Not Qualified				5 mm
UAA3515AHL	NXP Semiconductors	CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT	COMMERCIAL EXTENDED	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS		3.3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	80 Cel	-20 Cel		QUAD	S-PQFP-G64	1.6 mm	10 mm	Not Qualified				10 mm
UAA2067G	NXP Semiconductors	CORDLESS TELEPHONE SUPPORT CIRCUIT	OTHER	GULL WING	32	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS		3.6 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-30 Cel		QUAD	S-PQFP-G32	1.6 mm	5 mm	Not Qualified				5 mm
HPMX-5002-TY1	Broadcom	CORDLESS TELEPHONE BASEBAND CIRCUIT		GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1			3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm				QUAD	S-PQFP-G48	1.6 mm	7 mm	Not Qualified				7 mm

Cordless Phone ICs

Cordless phone ICs (Integrated Circuits) are the electronic components that provide the processing power and functionality for modern cordless phones. They are responsible for a wide range of functions, including signal processing, data storage, and communication protocols.

Some common types of cordless phone ICs include:

1. Baseband processors: These ICs are responsible for handling the core functions of a cordless phone, such as making calls and sending messages. They also manage the phone's power consumption and system resources.

2. Radio frequency (RF) transceivers: These ICs are responsible for transmitting and receiving RF signals over the cordless phone's base station and handset. They also provide the ability to switch between different frequency bands and channels.

3. Audio codecs: These ICs are responsible for encoding and decoding audio signals for clear voice communication over the cordless phone.

4. Power management ICs: These ICs manage the power supply and battery life of a cordless phone. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

5. Memory ICs: These ICs provide storage for the cordless phone's operating system, contacts, and call history. They include flash memory, RAM, and other types of non-volatile memory.