SOP Cordless Phone ICs 36

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Nominal Negative Supply Voltage	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Maximum Seated Height	Width	Qualification	JESD-609 Code	Length
MC13156DWR2	Motorola	CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	24	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR	-3 V	8 mA			SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G24	2.65 mm	7.5 mm	Not Qualified		15.395 mm
MC13156DW	NXP Semiconductors	CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	24	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR	-3 V	8 mA			SMALL OUTLINE	SOP24,.4		1.27 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G24	2.65 mm	7.5 mm			15.395 mm
TEA1118T	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT	COMMERCIAL EXTENDED	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR		.0014 mA	2.9 V	2.9	SMALL OUTLINE	SOP14,.25	Cordless Telephone ICs	1.27 mm	75 Cel	-25 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	R-PDSO-G14	1.75 mm	3.9 mm	Not Qualified	e4	8.65 mm
TEA1118AT	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT	COMMERCIAL EXTENDED	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR		.0014 mA	2.9 V	2.9	SMALL OUTLINE	SOP14,.25	Cordless Telephone ICs	1.27 mm	75 Cel	-25 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	R-PDSO-G14	1.75 mm	3.9 mm	Not Qualified	e4	8.65 mm
TEA1118TD	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT	COMMERCIAL EXTENDED	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR			1.6 V		SMALL OUTLINE			1.27 mm	75 Cel	-25 Cel		DUAL	R-PDSO-G14	1.75 mm	3.9 mm	Not Qualified		8.65 mm
935237450518	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT	COMMERCIAL EXTENDED	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				2.9 V		SMALL OUTLINE			1.27 mm	75 Cel	-25 Cel		DUAL	R-PDSO-G14	1.75 mm	3.9 mm	Not Qualified		8.65 mm
TEA1118TD-T	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT	COMMERCIAL EXTENDED	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR			1.6 V		SMALL OUTLINE			1.27 mm	75 Cel	-25 Cel		DUAL	R-PDSO-G14	1.75 mm	3.9 mm	Not Qualified		8.65 mm
TEA1118AT-T	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT	COMMERCIAL EXTENDED	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR			2.9 V		SMALL OUTLINE			1.27 mm	75 Cel	-25 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G14	1.75 mm	3.9 mm	Not Qualified	e4	8.65 mm
935237450512	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT	COMMERCIAL EXTENDED	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				2.9 V		SMALL OUTLINE			1.27 mm	75 Cel	-25 Cel		DUAL	R-PDSO-G14	1.75 mm	3.9 mm	Not Qualified		8.65 mm
TEA1118ATD	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT	COMMERCIAL EXTENDED	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR			1.6 V		SMALL OUTLINE			1.27 mm	75 Cel	-25 Cel		DUAL	R-PDSO-G14	1.75 mm	3.9 mm	Not Qualified		8.65 mm
935220650518	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT	COMMERCIAL EXTENDED	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				2.9 V		SMALL OUTLINE			1.27 mm	75 Cel	-25 Cel		DUAL	R-PDSO-G14	1.75 mm	3.9 mm	Not Qualified		8.65 mm
TEA1118AT/C1	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT	COMMERCIAL EXTENDED	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR			1.6 V		SMALL OUTLINE			1.27 mm	75 Cel	-25 Cel		DUAL	R-PDSO-G14	1.75 mm	3.9 mm	Not Qualified		8.65 mm
PCD4440T	NXP Semiconductors	CORDLESS TELEPHONE SCRAMBLER/DESCRAMBLER	OTHER	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			5 V		SMALL OUTLINE			1.27 mm	70 Cel	-25 Cel		DUAL	R-PDSO-G8	2.65 mm	7.5 mm	Not Qualified		7.55 mm
UBA1707T/C2	NXP Semiconductors	CORDLESS TELEPHONE SUPPORT CIRCUIT	COMMERCIAL EXTENDED	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS					SMALL OUTLINE			1.27 mm	75 Cel	-25 Cel		DUAL	R-PDSO-G28	2.65 mm	7.5 mm	Not Qualified		17.9 mm
953237450512	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT	COMMERCIAL EXTENDED	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR			1.6 V		SMALL OUTLINE			1.27 mm	75 Cel	-25 Cel		DUAL	R-PDSO-G14	1.75 mm	3.9 mm	Not Qualified		8.65 mm
UBA1707T	NXP Semiconductors	CORDLESS TELEPHONE SUPPORT CIRCUIT	COMMERCIAL EXTENDED	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS				3.3/5	SMALL OUTLINE	SOP28,.4	Digital Transmission Interfaces	1.27 mm	75 Cel	-25 Cel		DUAL	R-PDSO-G28	2.65 mm	7.5 mm	Not Qualified		17.9 mm
TEA1118T-T	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT	COMMERCIAL EXTENDED	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR			2.9 V		SMALL OUTLINE			1.27 mm	75 Cel	-25 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G14	1.75 mm	3.9 mm	Not Qualified	e4	8.65 mm
PCD4440T-T	NXP Semiconductors	CORDLESS TELEPHONE SCRAMBLER/DESCRAMBLER	OTHER	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			5 V		SMALL OUTLINE			1.27 mm	70 Cel	-25 Cel		DUAL	R-PDSO-G8	2.65 mm	7.5 mm	Not Qualified		7.55 mm
953237450518	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT	COMMERCIAL EXTENDED	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR			1.6 V		SMALL OUTLINE			1.27 mm	75 Cel	-25 Cel		DUAL	R-PDSO-G14	1.75 mm	3.9 mm	Not Qualified		8.65 mm
TEA1118ATD-T	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT	COMMERCIAL EXTENDED	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR			1.6 V		SMALL OUTLINE			1.27 mm	75 Cel	-25 Cel		DUAL	R-PDSO-G14	1.75 mm	3.9 mm	Not Qualified		8.65 mm
TEA1118T/C2	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT	COMMERCIAL EXTENDED	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR			1.6 V		SMALL OUTLINE			1.27 mm	75 Cel	-25 Cel		DUAL	R-PDSO-G14	1.75 mm	3.9 mm	Not Qualified		8.65 mm
UBA1707T-T	NXP Semiconductors	CORDLESS TELEPHONE SUPPORT CIRCUIT	COMMERCIAL EXTENDED	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS					SMALL OUTLINE			1.27 mm	75 Cel	-25 Cel		DUAL	R-PDSO-G28	2.65 mm	7.5 mm	Not Qualified		17.9 mm
935220650512	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT	COMMERCIAL EXTENDED	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				2.9 V		SMALL OUTLINE			1.27 mm	75 Cel	-25 Cel		DUAL	R-PDSO-G14	1.75 mm	3.9 mm	Not Qualified		8.65 mm
953220650512	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT	COMMERCIAL EXTENDED	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR			1.6 V		SMALL OUTLINE			1.27 mm	75 Cel	-25 Cel		DUAL	R-PDSO-G14	1.75 mm	3.9 mm	Not Qualified		8.65 mm
953220650518	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT	COMMERCIAL EXTENDED	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR			1.6 V		SMALL OUTLINE			1.27 mm	75 Cel	-25 Cel		DUAL	R-PDSO-G14	1.75 mm	3.9 mm	Not Qualified		8.65 mm
TA31136N	Toshiba		OTHER	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES				4.6 mA	2 V	2	SMALL OUTLINE	SOP16,.25	Cordless Telephone ICs	1.27 mm	85 Cel	-30 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDSO-G16			Not Qualified	e0
KS8804B	Samsung	CORDLESS TELEPHONE SUPPORT CIRCUIT	COMMERCIAL EXTENDED	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		.007 mA	5 V		SMALL OUTLINE	DIP16,.3	Other Telecom ICs	2.54 mm	75 Cel	-30 Cel	TIN LEAD	DUAL	R-PDSO-G16			Not Qualified	e0
KA3361CD	Samsung	CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT	COMMERCIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				4 V		SMALL OUTLINE			1.27 mm	70 Cel	-20 Cel		DUAL	R-PDSO-G16	1.95 mm	4.5 mm	Not Qualified		10 mm
S1A0429A01-S0BA	Samsung	CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT	COMMERCIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			.008 mA	3 V	3	SMALL OUTLINE	SOP16,.25	Other Telecom ICs	1.27 mm	70 Cel	-10 Cel		DUAL	R-PDSO-G16	1.95 mm	3.95 mm	Not Qualified		9.9 mm
KS8801D	Samsung		OTHER	GULL WING	18	SOP	RECTANGULAR	PLASTIC/EPOXY	YES		CMOS		13 mA		3.3/5	SMALL OUTLINE	SOP18,.3	Cordless Telephone ICs	1.27 mm	70 Cel	-25 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDSO-G18			Not Qualified	e0
KS8805B	Samsung	CORDLESS TELEPHONE SUPPORT CIRCUIT	COMMERCIAL EXTENDED	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		.007 mA	3 V	3.3/5	SMALL OUTLINE	DIP16,.3	Other Telecom ICs	2.54 mm	75 Cel	-30 Cel	TIN LEAD	DUAL	R-PDSO-G14			Not Qualified	e0
KS8804BD	Samsung	CORDLESS TELEPHONE SUPPORT CIRCUIT	COMMERCIAL EXTENDED	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		.007 mA	5 V		SMALL OUTLINE	SOP16,.25	Other Telecom ICs	1.27 mm	75 Cel	-30 Cel	TIN LEAD	DUAL	R-PDSO-G16	1.95 mm	3.95 mm	Not Qualified	e0	9.9 mm
KS8800D	Samsung		OTHER	GULL WING	18	SOP	RECTANGULAR	PLASTIC/EPOXY	YES		CMOS		15 mA		3.3/5	SMALL OUTLINE	SOP18,.3	Cordless Telephone ICs	1.27 mm	70 Cel	-25 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDSO-G18			Not Qualified	e0
KS8803BD	Samsung	CORDLESS TELEPHONE SUPPORT CIRCUIT	COMMERCIAL EXTENDED	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		.007 mA	5 V		SMALL OUTLINE	SOP16,.25	Other Telecom ICs	1.27 mm	75 Cel	-30 Cel	TIN LEAD	DUAL	R-PDSO-G16	1.95 mm	3.95 mm	Not Qualified	e0	9.9 mm
KS8805BD	Samsung	CORDLESS TELEPHONE SUPPORT CIRCUIT	COMMERCIAL EXTENDED	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		.007 mA	3 V	3.3/5	SMALL OUTLINE	SOP16,.25	Other Telecom ICs	1.27 mm	75 Cel	-30 Cel		DUAL	R-PDSO-G16	1.95 mm	3.95 mm	Not Qualified		9.9 mm
KA8532	Samsung	CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT	COMMERCIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE			1.27 mm	70 Cel	-10 Cel		DUAL	R-PDSO-G16	1.95 mm	3.95 mm	Not Qualified		9.9 mm

Cordless Phone ICs

Cordless phone ICs (Integrated Circuits) are the electronic components that provide the processing power and functionality for modern cordless phones. They are responsible for a wide range of functions, including signal processing, data storage, and communication protocols.

Some common types of cordless phone ICs include:

1. Baseband processors: These ICs are responsible for handling the core functions of a cordless phone, such as making calls and sending messages. They also manage the phone's power consumption and system resources.

2. Radio frequency (RF) transceivers: These ICs are responsible for transmitting and receiving RF signals over the cordless phone's base station and handset. They also provide the ability to switch between different frequency bands and channels.

3. Audio codecs: These ICs are responsible for encoding and decoding audio signals for clear voice communication over the cordless phone.

4. Power management ICs: These ICs manage the power supply and battery life of a cordless phone. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

5. Memory ICs: These ICs provide storage for the cordless phone's operating system, contacts, and call history. They include flash memory, RAM, and other types of non-volatile memory.