RECTANGULAR Cordless Phone ICs 188

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Nominal Negative Supply Voltage	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
TA31161FN	Toshiba	CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT	OTHER	GULL WING	16	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			7.5 mA	3 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-35 Cel		DUAL	R-PDSO-G16		1.6 mm	4.4 mm	Not Qualified				5 mm
TA31136F	Toshiba	CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT	OTHER	GULL WING	16	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			4.6 mA	2 V		SMALL OUTLINE, SHRINK PITCH				85 Cel	-30 Cel		DUAL	R-PDSO-G16				Not Qualified
MC13156DWR2	Motorola	CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	24	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR	-3 V	8 mA			SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G24		2.65 mm	7.5 mm	Not Qualified				15.395 mm
AD6190ARS	Analog Devices	CORDLESS TELEPHONE BASEBAND CIRCUIT	OTHER	GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR			3.3 V	3.3	SMALL OUTLINE, SHRINK PITCH	SSOP28,.3	Other Telecom ICs	.65 mm	85 Cel	-20 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDSO-G28		2 mm	5.3 mm	Not Qualified	e0			10.2 mm
AD6190ARSRL	Analog Devices	CORDLESS TELEPHONE BASEBAND CIRCUIT	OTHER	GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR			3.3 V	3.3	SMALL OUTLINE, SHRINK PITCH	SSOP28,.3	Other Telecom ICs	.65 mm	85 Cel	-20 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDSO-G28		2 mm	5.3 mm	Not Qualified	e0			10.2 mm
CGY2032TS	NXP Semiconductors	CORDLESS TELEPHONE SUPPORT CIRCUIT	OTHER	GULL WING	16	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			400 mA	3.2 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-30 Cel		DUAL	R-PDSO-G16		1.5 mm	4.4 mm	Not Qualified				5.2 mm
MC13156DW	NXP Semiconductors	CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	24	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR	-3 V	8 mA			SMALL OUTLINE	SOP24,.4		1.27 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G24		2.65 mm	7.5 mm					15.395 mm
CGY2032TS-T	NXP Semiconductors	CORDLESS TELEPHONE SUPPORT CIRCUIT	OTHER	GULL WING	16	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			400 mA	3.2 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-30 Cel		DUAL	R-PDSO-G16		1.5 mm	4.4 mm	Not Qualified				5.2 mm
TEA1118M-T	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT	COMMERCIAL EXTENDED	GULL WING	16	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR			2.9 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	75 Cel	-25 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G16		1.5 mm	4.4 mm	Not Qualified	e4			5.2 mm
PCD5090H-T	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT		GULL WING	100	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS					FLATPACK			.65 mm				QUAD	R-PQFP-G100		3.2 mm	14 mm	Not Qualified				20 mm
SA58640DK	NXP Semiconductors	CORDLESS TELEPHONE SUPPORT CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				5 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	R-PDSO-G20	1	1.5 mm	4.4 mm	Not Qualified	e4	30	260	6.5 mm
TEA1118T	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT	COMMERCIAL EXTENDED	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR		.0014 mA	2.9 V	2.9	SMALL OUTLINE	SOP14,.25	Cordless Telephone ICs	1.27 mm	75 Cel	-25 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	R-PDSO-G14		1.75 mm	3.9 mm	Not Qualified	e4			8.65 mm
935277002112	NXP Semiconductors	CORDLESS TELEPHONE SUPPORT CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				5 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G20		1.5 mm	4.4 mm					6.5 mm
TEA1118AT	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT	COMMERCIAL EXTENDED	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR		.0014 mA	2.9 V	2.9	SMALL OUTLINE	SOP14,.25	Cordless Telephone ICs	1.27 mm	75 Cel	-25 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	R-PDSO-G14		1.75 mm	3.9 mm	Not Qualified	e4			8.65 mm
UAA2077AM-T	NXP Semiconductors	CORDLESS TELEPHONE SUPPORT CIRCUIT	OTHER	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS			4 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-30 Cel		DUAL	R-PDSO-G20		1.5 mm	4.4 mm	Not Qualified				6.5 mm
935237440112	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT	COMMERCIAL EXTENDED	GULL WING	16	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				2.9 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	75 Cel	-25 Cel		DUAL	R-PDSO-G16		1.5 mm	4.4 mm	Not Qualified				5.2 mm
TEA1118TD	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT	COMMERCIAL EXTENDED	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR			1.6 V		SMALL OUTLINE			1.27 mm	75 Cel	-25 Cel		DUAL	R-PDSO-G14		1.75 mm	3.9 mm	Not Qualified				8.65 mm
PCD5041H-T	NXP Semiconductors	CORDLESS TELEPHONE BURST MODE CONTROLLER	OTHER	GULL WING	64	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			3 V		FLATPACK			1 mm	70 Cel	-25 Cel		QUAD	R-PQFP-G64		3.2 mm	14 mm	Not Qualified				20 mm
PCD5041-T	NXP Semiconductors	CORDLESS TELEPHONE BURST MODE CONTROLLER		GULL WING	64	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS					FLATPACK			1 mm				QUAD	R-PQFP-G64		3.2 mm	14 mm	Not Qualified				20 mm
PCD5043H-T	NXP Semiconductors	CORDLESS TELEPHONE BURST MODE CONTROLLER	OTHER	GULL WING	64	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			3 V		FLATPACK			1 mm	70 Cel	-25 Cel		QUAD	R-PQFP-G64		3.2 mm	14 mm	Not Qualified				20 mm
935220640118	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT	COMMERCIAL EXTENDED	GULL WING	16	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				2.9 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	75 Cel	-25 Cel		DUAL	R-PDSO-G16		1.5 mm	4.4 mm	Not Qualified				5.2 mm
PCD5097H-T	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT		GULL WING	100	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS					FLATPACK			.65 mm				QUAD	R-PQFP-G100		3.2 mm	14 mm	Not Qualified				20 mm
UAA2078M-T	NXP Semiconductors	CORDLESS TELEPHONE SUPPORT CIRCUIT	COMMERCIAL	GULL WING	16	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	70 Cel	-10 Cel		DUAL	R-PDSO-G16		1.5 mm	4.4 mm	Not Qualified				5.2 mm
935237450518	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT	COMMERCIAL EXTENDED	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				2.9 V		SMALL OUTLINE			1.27 mm	75 Cel	-25 Cel		DUAL	R-PDSO-G14		1.75 mm	3.9 mm	Not Qualified				8.65 mm
TEA1118TD-T	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT	COMMERCIAL EXTENDED	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR			1.6 V		SMALL OUTLINE			1.27 mm	75 Cel	-25 Cel		DUAL	R-PDSO-G14		1.75 mm	3.9 mm	Not Qualified				8.65 mm
PCD5091HZ	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT		GULL WING	100	LFQFP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			3 V	3/3.3,5	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	Other Telecom ICs	.5 mm			TIN	QUAD	R-PQFP-G100		1.6 mm	14 mm	Not Qualified	e3			14 mm
PCD5042H-T	NXP Semiconductors	CORDLESS TELEPHONE BURST MODE CONTROLLER	OTHER	GULL WING	64	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			3 V		FLATPACK			1 mm	70 Cel	-25 Cel		QUAD	R-PQFP-G64		3.2 mm	14 mm	Not Qualified				20 mm
TEA1118AM-T	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT	COMMERCIAL EXTENDED	GULL WING	16	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR			2.9 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	75 Cel	-25 Cel		DUAL	R-PDSO-G16		1.5 mm	4.4 mm	Not Qualified				5.2 mm
TEA1118AT-T	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT	COMMERCIAL EXTENDED	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR			2.9 V		SMALL OUTLINE			1.27 mm	75 Cel	-25 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G14		1.75 mm	3.9 mm	Not Qualified	e4			8.65 mm
935237450512	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT	COMMERCIAL EXTENDED	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				2.9 V		SMALL OUTLINE			1.27 mm	75 Cel	-25 Cel		DUAL	R-PDSO-G14		1.75 mm	3.9 mm	Not Qualified				8.65 mm
UAA2078M	NXP Semiconductors	CORDLESS TELEPHONE SUPPORT CIRCUIT	COMMERCIAL	GULL WING	16	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	70 Cel	-10 Cel		DUAL	R-PDSO-G16		1.5 mm	4.4 mm	Not Qualified				5.2 mm
UAA2077AM	NXP Semiconductors	CORDLESS TELEPHONE SUPPORT CIRCUIT	OTHER	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS			4 V	4	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	SSOP20,.25	Other Telecom ICs	.65 mm	85 Cel	-30 Cel		DUAL	R-PDSO-G20		1.5 mm	4.4 mm	Not Qualified				6.5 mm
TEA1118ATD	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT	COMMERCIAL EXTENDED	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR			1.6 V		SMALL OUTLINE			1.27 mm	75 Cel	-25 Cel		DUAL	R-PDSO-G14		1.75 mm	3.9 mm	Not Qualified				8.65 mm
SA58640DK,112	NXP Semiconductors	CORDLESS TELEPHONE SUPPORT CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				5 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G20	1	1.5 mm	4.4 mm	Not Qualified	e4			6.5 mm
PCD5091H	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT		GULL WING	100	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			3 V	3/3.3,5	FLATPACK	QFP100,.7X.9	Other Telecom ICs	.65 mm			TIN	QUAD	R-PQFP-G100		3.2 mm	14 mm	Not Qualified	e3			20 mm
PCD5092H	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT		GULL WING	100	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			3 V	3/3.3,5	FLATPACK	QFP100,.7X.9	Other Telecom ICs	.65 mm			TIN	QUAD	R-PQFP-G100		3.2 mm	14 mm	Not Qualified	e3			20 mm
PCD5090H	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT		GULL WING	100	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS					FLATPACK			.65 mm				QUAD	R-PQFP-G100		3.2 mm	14 mm	Not Qualified				20 mm
SA58641DK,112	NXP Semiconductors	CORDLESS TELEPHONE SUPPORT CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				5 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G20	1	1.5 mm	4.4 mm	Not Qualified	e4			6.5 mm
935277007112	NXP Semiconductors	CORDLESS TELEPHONE SUPPORT CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				5 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G20		1.5 mm	4.4 mm					6.5 mm
935220650518	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT	COMMERCIAL EXTENDED	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				2.9 V		SMALL OUTLINE			1.27 mm	75 Cel	-25 Cel		DUAL	R-PDSO-G14		1.75 mm	3.9 mm	Not Qualified				8.65 mm
PCD5097H	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT		GULL WING	100	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS					FLATPACK			.65 mm				QUAD	R-PQFP-G100		3.2 mm	14 mm	Not Qualified				20 mm
953237440118	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT	COMMERCIAL EXTENDED	GULL WING	16	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR			1.6 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	75 Cel	-25 Cel		DUAL	R-PDSO-G16		1.5 mm	4.4 mm	Not Qualified				5.2 mm
TEA1118M	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT	COMMERCIAL EXTENDED	GULL WING	16	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR		.0014 mA	2.9 V	2.9	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	SSOP16,.25	Cordless Telephone ICs	.65 mm	75 Cel	-25 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	R-PDSO-G16		1.5 mm	4.4 mm	Not Qualified	e4			5.2 mm
TEA1118AT/C1	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT	COMMERCIAL EXTENDED	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR			1.6 V		SMALL OUTLINE			1.27 mm	75 Cel	-25 Cel		DUAL	R-PDSO-G14		1.75 mm	3.9 mm	Not Qualified				8.65 mm
PCD5041	NXP Semiconductors	CORDLESS TELEPHONE BURST MODE CONTROLLER		GULL WING	64	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS					FLATPACK			1 mm				QUAD	R-PQFP-G64		3.2 mm	14 mm	Not Qualified				20 mm
PCD4440T	NXP Semiconductors	CORDLESS TELEPHONE SCRAMBLER/DESCRAMBLER	OTHER	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			5 V		SMALL OUTLINE			1.27 mm	70 Cel	-25 Cel		DUAL	R-PDSO-G8		2.65 mm	7.5 mm	Not Qualified				7.55 mm
SA58641DK	NXP Semiconductors	CORDLESS TELEPHONE SUPPORT CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				5 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	R-PDSO-G20	1	1.5 mm	4.4 mm	Not Qualified	e4	30	260	6.5 mm
TEA1118AM/C1	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT	COMMERCIAL EXTENDED	GULL WING	16	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR			1.6 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	75 Cel	-25 Cel		DUAL	R-PDSO-G16		1.5 mm	4.4 mm	Not Qualified				5.2 mm

Cordless Phone ICs

Cordless phone ICs (Integrated Circuits) are the electronic components that provide the processing power and functionality for modern cordless phones. They are responsible for a wide range of functions, including signal processing, data storage, and communication protocols.

Some common types of cordless phone ICs include:

1. Baseband processors: These ICs are responsible for handling the core functions of a cordless phone, such as making calls and sending messages. They also manage the phone's power consumption and system resources.

2. Radio frequency (RF) transceivers: These ICs are responsible for transmitting and receiving RF signals over the cordless phone's base station and handset. They also provide the ability to switch between different frequency bands and channels.

3. Audio codecs: These ICs are responsible for encoding and decoding audio signals for clear voice communication over the cordless phone.

4. Power management ICs: These ICs manage the power supply and battery life of a cordless phone. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

5. Memory ICs: These ICs provide storage for the cordless phone's operating system, contacts, and call history. They include flash memory, RAM, and other types of non-volatile memory.