COMMERCIAL EXTENDED Cordless Phone ICs 64

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Maximum Seated Height	Width	Qualification	JESD-609 Code	Length
TEA1118M-T	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT	COMMERCIAL EXTENDED	GULL WING	16	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR		2.9 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	75 Cel	-25 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G16	1.5 mm	4.4 mm	Not Qualified	e4	5.2 mm
TEA1118T	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT	COMMERCIAL EXTENDED	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR	.0014 mA	2.9 V	2.9	SMALL OUTLINE	SOP14,.25	Cordless Telephone ICs	1.27 mm	75 Cel	-25 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	R-PDSO-G14	1.75 mm	3.9 mm	Not Qualified	e4	8.65 mm
TEA1118AT	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT	COMMERCIAL EXTENDED	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR	.0014 mA	2.9 V	2.9	SMALL OUTLINE	SOP14,.25	Cordless Telephone ICs	1.27 mm	75 Cel	-25 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	R-PDSO-G14	1.75 mm	3.9 mm	Not Qualified	e4	8.65 mm
935237440112	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT	COMMERCIAL EXTENDED	GULL WING	16	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			2.9 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	75 Cel	-25 Cel		DUAL	R-PDSO-G16	1.5 mm	4.4 mm	Not Qualified		5.2 mm
TEA1118TD	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT	COMMERCIAL EXTENDED	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR		1.6 V		SMALL OUTLINE			1.27 mm	75 Cel	-25 Cel		DUAL	R-PDSO-G14	1.75 mm	3.9 mm	Not Qualified		8.65 mm
935220640118	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT	COMMERCIAL EXTENDED	GULL WING	16	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			2.9 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	75 Cel	-25 Cel		DUAL	R-PDSO-G16	1.5 mm	4.4 mm	Not Qualified		5.2 mm
935237450518	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT	COMMERCIAL EXTENDED	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			2.9 V		SMALL OUTLINE			1.27 mm	75 Cel	-25 Cel		DUAL	R-PDSO-G14	1.75 mm	3.9 mm	Not Qualified		8.65 mm
TEA1118TD-T	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT	COMMERCIAL EXTENDED	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR		1.6 V		SMALL OUTLINE			1.27 mm	75 Cel	-25 Cel		DUAL	R-PDSO-G14	1.75 mm	3.9 mm	Not Qualified		8.65 mm
TEA1118AM-T	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT	COMMERCIAL EXTENDED	GULL WING	16	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR		2.9 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	75 Cel	-25 Cel		DUAL	R-PDSO-G16	1.5 mm	4.4 mm	Not Qualified		5.2 mm
TEA1118AT-T	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT	COMMERCIAL EXTENDED	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR		2.9 V		SMALL OUTLINE			1.27 mm	75 Cel	-25 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G14	1.75 mm	3.9 mm	Not Qualified	e4	8.65 mm
935237450512	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT	COMMERCIAL EXTENDED	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			2.9 V		SMALL OUTLINE			1.27 mm	75 Cel	-25 Cel		DUAL	R-PDSO-G14	1.75 mm	3.9 mm	Not Qualified		8.65 mm
TEA1118ATD	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT	COMMERCIAL EXTENDED	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR		1.6 V		SMALL OUTLINE			1.27 mm	75 Cel	-25 Cel		DUAL	R-PDSO-G14	1.75 mm	3.9 mm	Not Qualified		8.65 mm
935220650518	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT	COMMERCIAL EXTENDED	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			2.9 V		SMALL OUTLINE			1.27 mm	75 Cel	-25 Cel		DUAL	R-PDSO-G14	1.75 mm	3.9 mm	Not Qualified		8.65 mm
953237440118	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT	COMMERCIAL EXTENDED	GULL WING	16	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR		1.6 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	75 Cel	-25 Cel		DUAL	R-PDSO-G16	1.5 mm	4.4 mm	Not Qualified		5.2 mm
TEA1118M	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT	COMMERCIAL EXTENDED	GULL WING	16	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR	.0014 mA	2.9 V	2.9	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	SSOP16,.25	Cordless Telephone ICs	.65 mm	75 Cel	-25 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	R-PDSO-G16	1.5 mm	4.4 mm	Not Qualified	e4	5.2 mm
TEA1118AT/C1	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT	COMMERCIAL EXTENDED	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR		1.6 V		SMALL OUTLINE			1.27 mm	75 Cel	-25 Cel		DUAL	R-PDSO-G14	1.75 mm	3.9 mm	Not Qualified		8.65 mm
TEA1118AM/C1	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT	COMMERCIAL EXTENDED	GULL WING	16	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR		1.6 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	75 Cel	-25 Cel		DUAL	R-PDSO-G16	1.5 mm	4.4 mm	Not Qualified		5.2 mm
953237440112	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT	COMMERCIAL EXTENDED	GULL WING	16	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR		1.6 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	75 Cel	-25 Cel		DUAL	R-PDSO-G16	1.5 mm	4.4 mm	Not Qualified		5.2 mm
UBA1706TS	NXP Semiconductors	CORDLESS TELEPHONE SUPPORT CIRCUIT	COMMERCIAL EXTENDED	GULL WING	24	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS	.0032 mA	3.3 V	3.3/5	SMALL OUTLINE, SHRINK PITCH	SSOP24,.3	Digital Transmission Interfaces	.65 mm	75 Cel	-25 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G24	2 mm	5.3 mm	Not Qualified	e4	8.2 mm
UBA1707T/C2	NXP Semiconductors	CORDLESS TELEPHONE SUPPORT CIRCUIT	COMMERCIAL EXTENDED	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS				SMALL OUTLINE			1.27 mm	75 Cel	-25 Cel		DUAL	R-PDSO-G28	2.65 mm	7.5 mm	Not Qualified		17.9 mm
953237450512	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT	COMMERCIAL EXTENDED	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR		1.6 V		SMALL OUTLINE			1.27 mm	75 Cel	-25 Cel		DUAL	R-PDSO-G14	1.75 mm	3.9 mm	Not Qualified		8.65 mm
UBA1707TS	NXP Semiconductors	CORDLESS TELEPHONE SUPPORT CIRCUIT	COMMERCIAL EXTENDED	GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS			3.3/5	SMALL OUTLINE	SSOP28,.3	Digital Transmission Interfaces	.65 mm	75 Cel	-25 Cel		DUAL	R-PDSO-G28	2 mm	5.3 mm	Not Qualified		10.2 mm
935220640112	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT	COMMERCIAL EXTENDED	GULL WING	16	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			2.9 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	75 Cel	-25 Cel		DUAL	R-PDSO-G16	1.5 mm	4.4 mm	Not Qualified		5.2 mm
UBA1707T	NXP Semiconductors	CORDLESS TELEPHONE SUPPORT CIRCUIT	COMMERCIAL EXTENDED	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS			3.3/5	SMALL OUTLINE	SOP28,.4	Digital Transmission Interfaces	1.27 mm	75 Cel	-25 Cel		DUAL	R-PDSO-G28	2.65 mm	7.5 mm	Not Qualified		17.9 mm
953220640118	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT	COMMERCIAL EXTENDED	GULL WING	16	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR		1.6 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	75 Cel	-25 Cel		DUAL	R-PDSO-G16	1.5 mm	4.4 mm	Not Qualified		5.2 mm
953220640112	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT	COMMERCIAL EXTENDED	GULL WING	16	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR		1.6 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	75 Cel	-25 Cel		DUAL	R-PDSO-G16	1.5 mm	4.4 mm	Not Qualified		5.2 mm
TEA1118M/C2	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT	COMMERCIAL EXTENDED	GULL WING	16	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR		1.6 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	75 Cel	-25 Cel		DUAL	R-PDSO-G16	1.5 mm	4.4 mm	Not Qualified		5.2 mm
TEA1118T-T	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT	COMMERCIAL EXTENDED	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR		2.9 V		SMALL OUTLINE			1.27 mm	75 Cel	-25 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G14	1.75 mm	3.9 mm	Not Qualified	e4	8.65 mm
TEA1118MDK-T	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT	COMMERCIAL EXTENDED	GULL WING	16	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR		1.6 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	75 Cel	-25 Cel		DUAL	R-PDSO-G16	1.5 mm	4.4 mm	Not Qualified		5.2 mm
953237450518	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT	COMMERCIAL EXTENDED	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR		1.6 V		SMALL OUTLINE			1.27 mm	75 Cel	-25 Cel		DUAL	R-PDSO-G14	1.75 mm	3.9 mm	Not Qualified		8.65 mm
UBA1707TS/C2	NXP Semiconductors	CORDLESS TELEPHONE SUPPORT CIRCUIT	COMMERCIAL EXTENDED	GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS				SMALL OUTLINE, SHRINK PITCH			.65 mm	75 Cel	-25 Cel		DUAL	R-PDSO-G28	2 mm	5.3 mm	Not Qualified		10.2 mm
TEA1118ATD-T	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT	COMMERCIAL EXTENDED	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR		1.6 V		SMALL OUTLINE			1.27 mm	75 Cel	-25 Cel		DUAL	R-PDSO-G14	1.75 mm	3.9 mm	Not Qualified		8.65 mm
TEA1118T/C2	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT	COMMERCIAL EXTENDED	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR		1.6 V		SMALL OUTLINE			1.27 mm	75 Cel	-25 Cel		DUAL	R-PDSO-G14	1.75 mm	3.9 mm	Not Qualified		8.65 mm
935237440118	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT	COMMERCIAL EXTENDED	GULL WING	16	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			2.9 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	75 Cel	-25 Cel		DUAL	R-PDSO-G16	1.5 mm	4.4 mm	Not Qualified		5.2 mm
UBA1707T-T	NXP Semiconductors	CORDLESS TELEPHONE SUPPORT CIRCUIT	COMMERCIAL EXTENDED	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS				SMALL OUTLINE			1.27 mm	75 Cel	-25 Cel		DUAL	R-PDSO-G28	2.65 mm	7.5 mm	Not Qualified		17.9 mm
935220650512	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT	COMMERCIAL EXTENDED	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			2.9 V		SMALL OUTLINE			1.27 mm	75 Cel	-25 Cel		DUAL	R-PDSO-G14	1.75 mm	3.9 mm	Not Qualified		8.65 mm
UBA1707TS-T	NXP Semiconductors	CORDLESS TELEPHONE SUPPORT CIRCUIT	COMMERCIAL EXTENDED	GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS				SMALL OUTLINE			.65 mm	75 Cel	-25 Cel		DUAL	R-PDSO-G28	2 mm	5.3 mm	Not Qualified		10.2 mm
953220650512	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT	COMMERCIAL EXTENDED	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR		1.6 V		SMALL OUTLINE			1.27 mm	75 Cel	-25 Cel		DUAL	R-PDSO-G14	1.75 mm	3.9 mm	Not Qualified		8.65 mm
TEA1118AM	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT	COMMERCIAL EXTENDED	GULL WING	16	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR	.0014 mA	2.9 V	2.9	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	SSOP16,.25	Cordless Telephone ICs	.65 mm	75 Cel	-25 Cel		DUAL	R-PDSO-G16	1.5 mm	4.4 mm	Not Qualified		5.2 mm
UAA3515AHL	NXP Semiconductors	CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT	COMMERCIAL EXTENDED	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS		3.3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	80 Cel	-20 Cel		QUAD	S-PQFP-G64	1.6 mm	10 mm	Not Qualified		10 mm
953220650518	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT	COMMERCIAL EXTENDED	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR		1.6 V		SMALL OUTLINE			1.27 mm	75 Cel	-25 Cel		DUAL	R-PDSO-G14	1.75 mm	3.9 mm	Not Qualified		8.65 mm
TA31101AP	Toshiba	CORDLESS TELEPHONE SUPPORT CIRCUIT	COMMERCIAL EXTENDED	THROUGH-HOLE	16	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	BIPOLAR	5 mA	3 V	1.8/9	IN-LINE	DIP16,.3	Cordless Telephone ICs	2.54 mm	75 Cel	-25 Cel	TIN LEAD	DUAL	R-PDIP-T16	4.45 mm	7.62 mm	Not Qualified	e0	19.25 mm
TA31101F-TP1	Toshiba	CORDLESS TELEPHONE SUPPORT CIRCUIT	COMMERCIAL EXTENDED	GULL WING	16	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		5 mA	3 V		SMALL OUTLINE, SHRINK PITCH			1 mm	75 Cel	-25 Cel	TIN LEAD	DUAL	R-PDSO-G16	1.9 mm	4.6 mm	Not Qualified	e0	8.2 mm
TA31101AF-TP1	Toshiba	CORDLESS TELEPHONE SUPPORT CIRCUIT	COMMERCIAL EXTENDED	GULL WING	16	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		5 mA	3 V		SMALL OUTLINE, SHRINK PITCH			1 mm	75 Cel	-25 Cel	TIN LEAD	DUAL	R-PDSO-G16	1.9 mm	4.6 mm	Not Qualified	e0	8.2 mm
TA31101F(EL)	Toshiba	CORDLESS TELEPHONE SUPPORT CIRCUIT	COMMERCIAL EXTENDED	GULL WING	16	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		5 mA	3 V		SMALL OUTLINE, SHRINK PITCH			1 mm	75 Cel	-25 Cel	TIN LEAD	DUAL	R-PDSO-G16	1.9 mm	4.6 mm	Not Qualified	e0	8.2 mm
TA31101AF(EL)	Toshiba	CORDLESS TELEPHONE SUPPORT CIRCUIT	COMMERCIAL EXTENDED	GULL WING	16	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		5 mA	3 V		SMALL OUTLINE, SHRINK PITCH			1 mm	75 Cel	-25 Cel	TIN LEAD	DUAL	R-PDSO-G16	1.9 mm	4.6 mm	Not Qualified	e0	8.2 mm
TA31101F	Toshiba	CORDLESS TELEPHONE SUPPORT CIRCUIT	COMMERCIAL EXTENDED	GULL WING	16	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR	5 mA	3 V	1.8/9	SMALL OUTLINE, SHRINK PITCH	SOP16,.25,40	Cordless Telephone ICs	1 mm	75 Cel	-25 Cel	TIN LEAD	DUAL	R-PDSO-G16	1.9 mm	4.6 mm	Not Qualified	e0	8.2 mm
TA31101AF	Toshiba	CORDLESS TELEPHONE SUPPORT CIRCUIT	COMMERCIAL EXTENDED	GULL WING	16	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR	5 mA	3 V	1.8/9	SMALL OUTLINE, SHRINK PITCH	SOP16,.25,40	Cordless Telephone ICs	1 mm	75 Cel	-25 Cel	TIN LEAD	DUAL	R-PDSO-G16	1.9 mm	4.6 mm	Not Qualified	e0	8.2 mm

Cordless Phone ICs

Cordless phone ICs (Integrated Circuits) are the electronic components that provide the processing power and functionality for modern cordless phones. They are responsible for a wide range of functions, including signal processing, data storage, and communication protocols.

Some common types of cordless phone ICs include:

1. Baseband processors: These ICs are responsible for handling the core functions of a cordless phone, such as making calls and sending messages. They also manage the phone's power consumption and system resources.

2. Radio frequency (RF) transceivers: These ICs are responsible for transmitting and receiving RF signals over the cordless phone's base station and handset. They also provide the ability to switch between different frequency bands and channels.

3. Audio codecs: These ICs are responsible for encoding and decoding audio signals for clear voice communication over the cordless phone.

4. Power management ICs: These ICs manage the power supply and battery life of a cordless phone. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

5. Memory ICs: These ICs provide storage for the cordless phone's operating system, contacts, and call history. They include flash memory, RAM, and other types of non-volatile memory.