OTHER Cordless Phone ICs 73

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
TA31161FN	Toshiba	CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT	OTHER	GULL WING	16	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		7.5 mA	3 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-35 Cel		DUAL	R-PDSO-G16	1.6 mm	4.4 mm	Not Qualified				5 mm
TA31136F	Toshiba	CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT	OTHER	GULL WING	16	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		4.6 mA	2 V		SMALL OUTLINE, SHRINK PITCH				85 Cel	-30 Cel		DUAL	R-PDSO-G16			Not Qualified
AD6190ARS	Analog Devices	CORDLESS TELEPHONE BASEBAND CIRCUIT	OTHER	GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR		3.3 V	3.3	SMALL OUTLINE, SHRINK PITCH	SSOP28,.3	Other Telecom ICs	.65 mm	85 Cel	-20 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDSO-G28	2 mm	5.3 mm	Not Qualified	e0			10.2 mm
AD6190ARSRL	Analog Devices	CORDLESS TELEPHONE BASEBAND CIRCUIT	OTHER	GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR		3.3 V	3.3	SMALL OUTLINE, SHRINK PITCH	SSOP28,.3	Other Telecom ICs	.65 mm	85 Cel	-20 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDSO-G28	2 mm	5.3 mm	Not Qualified	e0			10.2 mm
CGY2032TS	NXP Semiconductors	CORDLESS TELEPHONE SUPPORT CIRCUIT	OTHER	GULL WING	16	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		400 mA	3.2 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-30 Cel		DUAL	R-PDSO-G16	1.5 mm	4.4 mm	Not Qualified				5.2 mm
CGY2032TS-T	NXP Semiconductors	CORDLESS TELEPHONE SUPPORT CIRCUIT	OTHER	GULL WING	16	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		400 mA	3.2 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-30 Cel		DUAL	R-PDSO-G16	1.5 mm	4.4 mm	Not Qualified				5.2 mm
UAA2077AM-T	NXP Semiconductors	CORDLESS TELEPHONE SUPPORT CIRCUIT	OTHER	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS		4 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-30 Cel		DUAL	R-PDSO-G20	1.5 mm	4.4 mm	Not Qualified				6.5 mm
PCD5041H-T	NXP Semiconductors	CORDLESS TELEPHONE BURST MODE CONTROLLER	OTHER	GULL WING	64	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		3 V		FLATPACK			1 mm	70 Cel	-25 Cel		QUAD	R-PQFP-G64	3.2 mm	14 mm	Not Qualified				20 mm
PCD5043H-T	NXP Semiconductors	CORDLESS TELEPHONE BURST MODE CONTROLLER	OTHER	GULL WING	64	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		3 V		FLATPACK			1 mm	70 Cel	-25 Cel		QUAD	R-PQFP-G64	3.2 mm	14 mm	Not Qualified				20 mm
935202550518	NXP Semiconductors	CORDLESS TELEPHONE SUPPORT CIRCUIT	OTHER	GULL WING	32	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS		3.6 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-30 Cel	TIN	QUAD	S-PQFP-G32	1.6 mm	5 mm	Not Qualified	e3			5 mm
PCD5041HZ-T	NXP Semiconductors	CORDLESS TELEPHONE BURST MODE CONTROLLER	OTHER	GULL WING	80	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	70 Cel	-25 Cel		QUAD	S-PQFP-G80	1.6 mm	12 mm	Not Qualified				12 mm
PCD5042H-T	NXP Semiconductors	CORDLESS TELEPHONE BURST MODE CONTROLLER	OTHER	GULL WING	64	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		3 V		FLATPACK			1 mm	70 Cel	-25 Cel		QUAD	R-PQFP-G64	3.2 mm	14 mm	Not Qualified				20 mm
PCD5042HZ	NXP Semiconductors	CORDLESS TELEPHONE BURST MODE CONTROLLER	OTHER	GULL WING	80	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	.012 mA	3 V	3/5	FLATPACK, LOW PROFILE, FINE PITCH	QFP80,.55SQ,20	Cordless Telephone ICs	.5 mm	70 Cel	-25 Cel		QUAD	S-PQFP-G80	1.6 mm	12 mm	Not Qualified				12 mm
PCD5041HZ	NXP Semiconductors	CORDLESS TELEPHONE BURST MODE CONTROLLER	OTHER	GULL WING	80	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	70 Cel	-25 Cel		QUAD	S-PQFP-G80	1.6 mm	12 mm	Not Qualified				12 mm
UAA2077AM	NXP Semiconductors	CORDLESS TELEPHONE SUPPORT CIRCUIT	OTHER	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS		4 V	4	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	SSOP20,.25	Other Telecom ICs	.65 mm	85 Cel	-30 Cel		DUAL	R-PDSO-G20	1.5 mm	4.4 mm	Not Qualified				6.5 mm
PCD5042HZ-T	NXP Semiconductors	CORDLESS TELEPHONE BURST MODE CONTROLLER	OTHER	GULL WING	80	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	70 Cel	-25 Cel		QUAD	S-PQFP-G80	1.6 mm	12 mm	Not Qualified				12 mm
UAA2067G-T	NXP Semiconductors	CORDLESS TELEPHONE SUPPORT CIRCUIT	OTHER	GULL WING	32	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS		3.6 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-30 Cel		QUAD	S-PQFP-G32	1.6 mm	5 mm	Not Qualified				5 mm
935202550557	NXP Semiconductors	CORDLESS TELEPHONE SUPPORT CIRCUIT	OTHER	GULL WING	32	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS		3.6 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-30 Cel	TIN	QUAD	S-PQFP-G32	1.6 mm	5 mm	Not Qualified	e3			5 mm
PCD4440T	NXP Semiconductors	CORDLESS TELEPHONE SCRAMBLER/DESCRAMBLER	OTHER	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		5 V		SMALL OUTLINE			1.27 mm	70 Cel	-25 Cel		DUAL	R-PDSO-G8	2.65 mm	7.5 mm	Not Qualified				7.55 mm
PCD5042H	NXP Semiconductors	CORDLESS TELEPHONE BURST MODE CONTROLLER	OTHER	GULL WING	64	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	.012 mA	3 V	3/5	FLATPACK	QFP64,.7X.95,40	Cordless Telephone ICs	1 mm	70 Cel	-25 Cel		QUAD	R-PQFP-G64	3.2 mm	14 mm	Not Qualified				20 mm
UAA2067G/C1	NXP Semiconductors	CORDLESS TELEPHONE SUPPORT CIRCUIT	OTHER	GULL WING	32	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS		3.6 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-30 Cel		QUAD	S-PQFP-G32	1.6 mm	5 mm	Not Qualified				5 mm
935202550551	NXP Semiconductors	CORDLESS TELEPHONE SUPPORT CIRCUIT	OTHER	GULL WING	32	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS		3.6 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-30 Cel	TIN	QUAD	S-PQFP-G32	1.6 mm	5 mm	Not Qualified	e3			5 mm
PCD5041H	NXP Semiconductors	CORDLESS TELEPHONE BURST MODE CONTROLLER	OTHER	GULL WING	64	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		3 V		FLATPACK			1 mm	70 Cel	-25 Cel		QUAD	R-PQFP-G64	3.2 mm	14 mm	Not Qualified				20 mm
PCD4440T-T	NXP Semiconductors	CORDLESS TELEPHONE SCRAMBLER/DESCRAMBLER	OTHER	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		5 V		SMALL OUTLINE			1.27 mm	70 Cel	-25 Cel		DUAL	R-PDSO-G8	2.65 mm	7.5 mm	Not Qualified				7.55 mm
PCD5043H	NXP Semiconductors	CORDLESS TELEPHONE BURST MODE CONTROLLER	OTHER	GULL WING	64	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	.012 mA	3 V	3/5	FLATPACK	QFP64,.7X.95,40	Cordless Telephone ICs	1 mm	70 Cel	-25 Cel		QUAD	R-PQFP-G64	3.2 mm	14 mm	Not Qualified				20 mm
UAA2067GBE	NXP Semiconductors	CORDLESS TELEPHONE SUPPORT CIRCUIT	OTHER	GULL WING	32	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS		3.6 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-30 Cel		QUAD	S-PQFP-G32	1.6 mm	5 mm	Not Qualified				5 mm
UAA2067G	NXP Semiconductors	CORDLESS TELEPHONE SUPPORT CIRCUIT	OTHER	GULL WING	32	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS		3.6 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-30 Cel		QUAD	S-PQFP-G32	1.6 mm	5 mm	Not Qualified				5 mm
TA31137FNG	Toshiba	CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT	OTHER	GULL WING	24	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR		3 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-30 Cel		DUAL	R-PDSO-G24	1.6 mm	5.6 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	7.8 mm
TA31137FN-TP1	Toshiba	CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT	OTHER	GULL WING	24	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		5.6 mA	3 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-30 Cel		DUAL	R-PDSO-G24	1.6 mm	5.6 mm	Not Qualified				7.8 mm
TA31136F-TP2	Toshiba	CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT	OTHER	GULL WING	16	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES						SMALL OUTLINE, SHRINK PITCH			1 mm	85 Cel	-30 Cel		DUAL	R-PDSO-G16	1.9 mm	4.6 mm	Not Qualified				8.2 mm
TA31132F-TP2	Toshiba	CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT	OTHER	GULL WING	24	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		5 mA	3.5 V		SMALL OUTLINE, SHRINK PITCH			1 mm	85 Cel	-30 Cel		DUAL	R-PDSO-G24	2.2 mm	6 mm	Not Qualified				13 mm
TA31137FN(ER)	Toshiba	CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT	OTHER	GULL WING	24	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		5.6 mA	3 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-30 Cel		DUAL	R-PDSO-G24	1.6 mm	5.6 mm	Not Qualified				7.8 mm
TA31132F-TP1	Toshiba	CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT	OTHER	GULL WING	24	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		5 mA	3.5 V		SMALL OUTLINE, SHRINK PITCH			1 mm	85 Cel	-30 Cel	TIN LEAD	DUAL	R-PDSO-G24	2.2 mm	6 mm	Not Qualified	e0			13 mm
TA31161FNG	Toshiba	CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT	OTHER	GULL WING	16	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR	.0075 mA	3 V	3	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	SSOP16,.25	Other Telecom ICs	.65 mm	85 Cel	-35 Cel		DUAL	R-PDSO-G16	1.6 mm	4.4 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	5 mm
TA31102F(EL)	Toshiba	CORDLESS TELEPHONE SUPPORT CIRCUIT	OTHER	GULL WING	16	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		6 mA	5 V		SMALL OUTLINE, SHRINK PITCH			1 mm	85 Cel	-30 Cel	TIN LEAD	DUAL	R-PDSO-G16	1.9 mm	4.6 mm	Not Qualified	e0			8.2 mm
TA31132FN(ER)	Toshiba	CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT	OTHER	GULL WING	24	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		5 mA	3.5 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-30 Cel		DUAL	R-PDSO-G24	1.6 mm	5.6 mm	Not Qualified				7.8 mm
TA31136F(ER)	Toshiba	CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT	OTHER	GULL WING	16	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES						SMALL OUTLINE, SHRINK PITCH			1 mm	85 Cel	-30 Cel		DUAL	R-PDSO-G16	1.9 mm	4.6 mm	Not Qualified				8.2 mm
TA31136FN-TP1	Toshiba	CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT	OTHER	GULL WING	16	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES						SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-30 Cel		DUAL	R-PDSO-G16	1.6 mm	4.4 mm	Not Qualified				5 mm
TA31132F(ER)	Toshiba	CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT	OTHER	GULL WING	24	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		5 mA	3.5 V		SMALL OUTLINE, SHRINK PITCH			1 mm	85 Cel	-30 Cel		DUAL	R-PDSO-G24	2.2 mm	6 mm	Not Qualified				13 mm
TA31136F(EL)	Toshiba	CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT	OTHER	GULL WING	16	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES						SMALL OUTLINE, SHRINK PITCH			1 mm	85 Cel	-30 Cel		DUAL	R-PDSO-G16	1.9 mm	4.6 mm	Not Qualified				8.2 mm
TA31132FN-TP1	Toshiba	CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT	OTHER	GULL WING	24	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		5 mA	3.5 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-30 Cel	TIN LEAD	DUAL	R-PDSO-G24	1.6 mm	5.6 mm	Not Qualified	e0			7.8 mm
TA31161FN(EL)	Toshiba	CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT	OTHER	GULL WING	16	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		7.5 mA	3 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-35 Cel		DUAL	R-PDSO-G16	1.6 mm	4.4 mm	Not Qualified				5 mm
TA31161FN-TP1	Toshiba	CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT	OTHER	GULL WING	16	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		7.5 mA	3 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-35 Cel	TIN LEAD	DUAL	R-PDSO-G16	1.6 mm	4.4 mm	Not Qualified	e0			5 mm
TA31132FN(EL)	Toshiba	CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT	OTHER	GULL WING	24	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		5 mA	3.5 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-30 Cel	TIN LEAD	DUAL	R-PDSO-G24	1.6 mm	5.6 mm	Not Qualified	e0			7.8 mm
TA31102F-TP2	Toshiba	CORDLESS TELEPHONE SUPPORT CIRCUIT	OTHER	GULL WING	16	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		6 mA	5 V		SMALL OUTLINE, SHRINK PITCH			1 mm	85 Cel	-30 Cel	TIN LEAD	DUAL	R-PDSO-G16	1.9 mm	4.6 mm	Not Qualified	e0			8.2 mm
TA31132F(EL)	Toshiba	CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT	OTHER	GULL WING	24	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		5 mA	3.5 V		SMALL OUTLINE, SHRINK PITCH			1 mm	85 Cel	-30 Cel		DUAL	R-PDSO-G24	2.2 mm	6 mm	Not Qualified				13 mm
TA31102F(ER)	Toshiba	CORDLESS TELEPHONE SUPPORT CIRCUIT	OTHER	GULL WING	16	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		6 mA	5 V		SMALL OUTLINE, SHRINK PITCH			1 mm	85 Cel	-30 Cel	TIN LEAD	DUAL	R-PDSO-G16	1.9 mm	4.6 mm	Not Qualified	e0			8.2 mm
TA31136F-TP1	Toshiba	CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT	OTHER	GULL WING	16	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES						SMALL OUTLINE, SHRINK PITCH			1 mm	85 Cel	-30 Cel		DUAL	R-PDSO-G16	1.9 mm	4.6 mm	Not Qualified				8.2 mm

Cordless Phone ICs

Cordless phone ICs (Integrated Circuits) are the electronic components that provide the processing power and functionality for modern cordless phones. They are responsible for a wide range of functions, including signal processing, data storage, and communication protocols.

Some common types of cordless phone ICs include:

1. Baseband processors: These ICs are responsible for handling the core functions of a cordless phone, such as making calls and sending messages. They also manage the phone's power consumption and system resources.

2. Radio frequency (RF) transceivers: These ICs are responsible for transmitting and receiving RF signals over the cordless phone's base station and handset. They also provide the ability to switch between different frequency bands and channels.

3. Audio codecs: These ICs are responsible for encoding and decoding audio signals for clear voice communication over the cordless phone.

4. Power management ICs: These ICs manage the power supply and battery life of a cordless phone. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

5. Memory ICs: These ICs provide storage for the cordless phone's operating system, contacts, and call history. They include flash memory, RAM, and other types of non-volatile memory.