OTHER Cordless Phone ICs 73

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
TA31137FN-TP2	Toshiba	CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT	OTHER	GULL WING	24	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		5.6 mA	3 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-30 Cel		DUAL	R-PDSO-G24	1.6 mm	5.6 mm	Not Qualified				7.8 mm
TA31136FN(ER)	Toshiba	CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT	OTHER	GULL WING	16	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES						SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-30 Cel		DUAL	R-PDSO-G16	1.6 mm	4.4 mm	Not Qualified				5 mm
TA31132FN-TP2	Toshiba	CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT	OTHER	GULL WING	24	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		5 mA	3.5 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-30 Cel		DUAL	R-PDSO-G24	1.6 mm	5.6 mm	Not Qualified				7.8 mm
TA31132F	Toshiba	CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT	OTHER	GULL WING	24	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		5 mA	3.5 V		SMALL OUTLINE, SHRINK PITCH			1 mm	85 Cel	-30 Cel		DUAL	R-PDSO-G24	2.2 mm	6 mm	Not Qualified				13 mm
TA31136FN(EL)	Toshiba	CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT	OTHER	GULL WING	16	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES						SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-30 Cel		DUAL	R-PDSO-G16	1.6 mm	4.4 mm	Not Qualified				5 mm
TA31136FN	Toshiba	CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT	OTHER	GULL WING	16	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES						SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-30 Cel		DUAL	R-PDSO-G16	1.6 mm	4.4 mm	Not Qualified				5 mm
TA7761P	Toshiba	CORDLESS TELEPHONE SUPPORT CIRCUIT	OTHER	THROUGH-HOLE	16	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1			3 V		IN-LINE			2.54 mm	85 Cel	-30 Cel	TIN LEAD	DUAL	R-PDIP-T16	4.45 mm	7.62 mm	Not Qualified	e0			19.25 mm
TA7761F	Toshiba	CORDLESS TELEPHONE SUPPORT CIRCUIT	OTHER	GULL WING	16	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3 V		SMALL OUTLINE, SHRINK PITCH			1 mm	85 Cel	-30 Cel		DUAL	R-PDSO-G16	1.9 mm	4.6 mm	Not Qualified				8.2 mm
TA31132FN	Toshiba	CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT	OTHER	GULL WING	24	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		5 mA	3.5 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-30 Cel		DUAL	R-PDSO-G24	1.6 mm	5.6 mm	Not Qualified				7.8 mm
TA31137FN	Toshiba	CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT	OTHER	GULL WING	24	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		5.6 mA	3 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-30 Cel	TIN LEAD	DUAL	R-PDSO-G24	1.6 mm	5.6 mm	Not Qualified	e0			7.8 mm
TA31161FN(ER)	Toshiba	CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT	OTHER	GULL WING	16	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		7.5 mA	3 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-35 Cel		DUAL	R-PDSO-G16	1.6 mm	4.4 mm	Not Qualified				5 mm
TA31136N	Toshiba		OTHER	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES			4.6 mA	2 V	2	SMALL OUTLINE	SOP16,.25	Cordless Telephone ICs	1.27 mm	85 Cel	-30 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDSO-G16			Not Qualified	e0
TA31137FN(EL)	Toshiba	CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT	OTHER	GULL WING	24	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		5.6 mA	3 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-30 Cel	TIN LEAD	DUAL	R-PDSO-G24	1.6 mm	5.6 mm	Not Qualified	e0			7.8 mm
TA31136FNG	Toshiba	CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT	OTHER	GULL WING	16	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR	.0046 mA	2 V	2	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	SSOP16,.25	Other Telecom ICs	.65 mm	85 Cel	-30 Cel		DUAL	R-PDSO-G16	1.6 mm	4.4 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	5 mm
TA31136FN-TP2	Toshiba	CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT	OTHER	GULL WING	16	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES						SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-30 Cel		DUAL	R-PDSO-G16	1.6 mm	4.4 mm	Not Qualified				5 mm
TA31161FN-TP2	Toshiba	CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT	OTHER	GULL WING	16	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		7.5 mA	3 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-35 Cel	TIN LEAD	DUAL	R-PDSO-G16	1.6 mm	4.4 mm	Not Qualified	e0			5 mm
TA31102F	Toshiba	CORDLESS TELEPHONE SUPPORT CIRCUIT	OTHER	GULL WING	16	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		6 mA	5 V		SMALL OUTLINE, SHRINK PITCH			1 mm	85 Cel	-30 Cel	TIN LEAD	DUAL	R-PDSO-G16	1.9 mm	4.6 mm	Not Qualified	e0			8.2 mm
TA31136FG	Toshiba	CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT	OTHER	GULL WING	16	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR	.0046 mA	2 V	2	SMALL OUTLINE, SHRINK PITCH	SOP16,.25,40	Other Telecom ICs	1 mm	85 Cel	-30 Cel	TIN SILVER	DUAL	R-PDSO-G16	1.9 mm	4.6 mm	Not Qualified	e2			8.2 mm
TA31102F-TP1	Toshiba	CORDLESS TELEPHONE SUPPORT CIRCUIT	OTHER	GULL WING	16	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		6 mA	5 V		SMALL OUTLINE, SHRINK PITCH			1 mm	85 Cel	-30 Cel	TIN LEAD	DUAL	R-PDSO-G16	1.9 mm	4.6 mm	Not Qualified	e0			8.2 mm
KA8508	Samsung		OTHER	THROUGH-HOLE	16	DIP	RECTANGULAR	PLASTIC/EPOXY	NO			4.3 mA	4 V	4	IN-LINE	DIP16,.3	Cordless Telephone ICs	2.54 mm	70 Cel	-30 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDIP-T16			Not Qualified	e0
KS8800N	Samsung		OTHER	THROUGH-HOLE	18	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		CMOS	15 mA		3.3/5	IN-LINE	DIP18,.3	Cordless Telephone ICs	2.54 mm	70 Cel	-25 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDIP-T18			Not Qualified	e0
KS8801D	Samsung		OTHER	GULL WING	18	SOP	RECTANGULAR	PLASTIC/EPOXY	YES		CMOS	13 mA		3.3/5	SMALL OUTLINE	SOP18,.3	Cordless Telephone ICs	1.27 mm	70 Cel	-25 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDSO-G18			Not Qualified	e0
KA8508A	Samsung		OTHER	THROUGH-HOLE	16	DIP	RECTANGULAR	PLASTIC/EPOXY	NO			5.3 mA	4 V	4	IN-LINE	DIP16,.3	Cordless Telephone ICs	2.54 mm	70 Cel	-30 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDIP-T16			Not Qualified	e0
KS8800D	Samsung		OTHER	GULL WING	18	SOP	RECTANGULAR	PLASTIC/EPOXY	YES		CMOS	15 mA		3.3/5	SMALL OUTLINE	SOP18,.3	Cordless Telephone ICs	1.27 mm	70 Cel	-25 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDSO-G18			Not Qualified	e0
KS8801N	Samsung		OTHER	THROUGH-HOLE	18	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		CMOS	13 mA		3.3/5	IN-LINE	DIP18,.3	Cordless Telephone ICs	2.54 mm	70 Cel	-25 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDIP-T18			Not Qualified	e0

Cordless Phone ICs

Cordless phone ICs (Integrated Circuits) are the electronic components that provide the processing power and functionality for modern cordless phones. They are responsible for a wide range of functions, including signal processing, data storage, and communication protocols.

Some common types of cordless phone ICs include:

1. Baseband processors: These ICs are responsible for handling the core functions of a cordless phone, such as making calls and sending messages. They also manage the phone's power consumption and system resources.

2. Radio frequency (RF) transceivers: These ICs are responsible for transmitting and receiving RF signals over the cordless phone's base station and handset. They also provide the ability to switch between different frequency bands and channels.

3. Audio codecs: These ICs are responsible for encoding and decoding audio signals for clear voice communication over the cordless phone.

4. Power management ICs: These ICs manage the power supply and battery life of a cordless phone. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

5. Memory ICs: These ICs provide storage for the cordless phone's operating system, contacts, and call history. They include flash memory, RAM, and other types of non-volatile memory.