Cordless Phone ICs

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Part RoHS Manufacturer Telecom IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material Surface Mount No. of Functions Technology Nominal Negative Supply Voltage Maximum Supply Current Nominal Supply Voltage Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category Terminal Pitch Maximum Operating Temperature Minimum Operating Temperature Terminal Finish Terminal Position JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length

TA31136F-TP2

Toshiba

CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT

OTHER

GULL WING

16

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

SMALL OUTLINE, SHRINK PITCH

1 mm

85 Cel

-30 Cel

DUAL

R-PDSO-G16

1.9 mm

4.6 mm

Not Qualified

8.2 mm

TA31132F-TP2

Toshiba

CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT

OTHER

GULL WING

24

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 mA

3.5 V

SMALL OUTLINE, SHRINK PITCH

1 mm

85 Cel

-30 Cel

DUAL

R-PDSO-G24

2.2 mm

6 mm

Not Qualified

13 mm

TA31101AP

Toshiba

CORDLESS TELEPHONE SUPPORT CIRCUIT

COMMERCIAL EXTENDED

THROUGH-HOLE

16

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

BIPOLAR

5 mA

3 V

1.8/9

IN-LINE

DIP16,.3

Cordless Telephone ICs

2.54 mm

75 Cel

-25 Cel

TIN LEAD

DUAL

R-PDIP-T16

4.45 mm

7.62 mm

Not Qualified

e0

19.25 mm

TA31137FN(ER)

Toshiba

CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT

OTHER

GULL WING

24

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

5.6 mA

3 V

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

.65 mm

85 Cel

-30 Cel

DUAL

R-PDSO-G24

1.6 mm

5.6 mm

Not Qualified

7.8 mm

TA31132F-TP1

Toshiba

CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT

OTHER

GULL WING

24

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 mA

3.5 V

SMALL OUTLINE, SHRINK PITCH

1 mm

85 Cel

-30 Cel

TIN LEAD

DUAL

R-PDSO-G24

2.2 mm

6 mm

Not Qualified

e0

13 mm

TA31101F-TP1

Toshiba

CORDLESS TELEPHONE SUPPORT CIRCUIT

COMMERCIAL EXTENDED

GULL WING

16

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 mA

3 V

SMALL OUTLINE, SHRINK PITCH

1 mm

75 Cel

-25 Cel

TIN LEAD

DUAL

R-PDSO-G16

1.9 mm

4.6 mm

Not Qualified

e0

8.2 mm

TA31161FNG

Toshiba

CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT

OTHER

GULL WING

16

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

BIPOLAR

.0075 mA

3 V

3

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

SSOP16,.25

Other Telecom ICs

.65 mm

85 Cel

-35 Cel

DUAL

R-PDSO-G16

1.6 mm

4.4 mm

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

5 mm

TA31102F(EL)

Toshiba

CORDLESS TELEPHONE SUPPORT CIRCUIT

OTHER

GULL WING

16

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

6 mA

5 V

SMALL OUTLINE, SHRINK PITCH

1 mm

85 Cel

-30 Cel

TIN LEAD

DUAL

R-PDSO-G16

1.9 mm

4.6 mm

Not Qualified

e0

8.2 mm

TA31132FN(ER)

Toshiba

CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT

OTHER

GULL WING

24

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 mA

3.5 V

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

.65 mm

85 Cel

-30 Cel

DUAL

R-PDSO-G24

1.6 mm

5.6 mm

Not Qualified

7.8 mm

TA31188FNG

Toshiba

CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT

COMMERCIAL

GULL WING

24

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

BIPOLAR

.0085 mA

3 V

3

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

SSOP24,.3

Other Telecom ICs

.65 mm

70 Cel

-20 Cel

DUAL

R-PDSO-G24

1.6 mm

5.6 mm

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

7.8 mm

TA31101AF-TP1

Toshiba

CORDLESS TELEPHONE SUPPORT CIRCUIT

COMMERCIAL EXTENDED

GULL WING

16

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 mA

3 V

SMALL OUTLINE, SHRINK PITCH

1 mm

75 Cel

-25 Cel

TIN LEAD

DUAL

R-PDSO-G16

1.9 mm

4.6 mm

Not Qualified

e0

8.2 mm

TA31101F(EL)

Toshiba

CORDLESS TELEPHONE SUPPORT CIRCUIT

COMMERCIAL EXTENDED

GULL WING

16

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 mA

3 V

SMALL OUTLINE, SHRINK PITCH

1 mm

75 Cel

-25 Cel

TIN LEAD

DUAL

R-PDSO-G16

1.9 mm

4.6 mm

Not Qualified

e0

8.2 mm

TA31136F(ER)

Toshiba

CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT

OTHER

GULL WING

16

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

SMALL OUTLINE, SHRINK PITCH

1 mm

85 Cel

-30 Cel

DUAL

R-PDSO-G16

1.9 mm

4.6 mm

Not Qualified

8.2 mm

TA31136FN-TP1

Toshiba

CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT

OTHER

GULL WING

16

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

.65 mm

85 Cel

-30 Cel

DUAL

R-PDSO-G16

1.6 mm

4.4 mm

Not Qualified

5 mm

TA31101AF(EL)

Toshiba

CORDLESS TELEPHONE SUPPORT CIRCUIT

COMMERCIAL EXTENDED

GULL WING

16

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 mA

3 V

SMALL OUTLINE, SHRINK PITCH

1 mm

75 Cel

-25 Cel

TIN LEAD

DUAL

R-PDSO-G16

1.9 mm

4.6 mm

Not Qualified

e0

8.2 mm

TA31132F(ER)

Toshiba

CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT

OTHER

GULL WING

24

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 mA

3.5 V

SMALL OUTLINE, SHRINK PITCH

1 mm

85 Cel

-30 Cel

DUAL

R-PDSO-G24

2.2 mm

6 mm

Not Qualified

13 mm

TB31262F

Toshiba

CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT

COMMERCIAL

GULL WING

52

QFP

SQUARE

PLASTIC/EPOXY

YES

1

BICMOS

3.6 V

FLATPACK

.65 mm

70 Cel

-20 Cel

QUAD

S-PQFP-G52

2.45 mm

10 mm

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

10 mm

TA31103FN(ER)

Toshiba

CORDLESS TELEPHONE SUPPORT CIRCUIT

COMMERCIAL

GULL WING

24

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

9.5 mA

3 V

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

.65 mm

70 Cel

-20 Cel

TIN LEAD

DUAL

R-PDSO-G24

1.6 mm

5.6 mm

Not Qualified

e0

7.8 mm

TA31136F(EL)

Toshiba

CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT

OTHER

GULL WING

16

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

SMALL OUTLINE, SHRINK PITCH

1 mm

85 Cel

-30 Cel

DUAL

R-PDSO-G16

1.9 mm

4.6 mm

Not Qualified

8.2 mm

TA31103F

Toshiba

CORDLESS TELEPHONE SUPPORT CIRCUIT

COMMERCIAL

GULL WING

24

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

9.5 mA

3 V

SMALL OUTLINE, SHRINK PITCH

1 mm

70 Cel

-20 Cel

TIN LEAD

DUAL

R-PDSO-G24

2.2 mm

6 mm

Not Qualified

e0

13 mm

TA31132FN-TP1

Toshiba

CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT

OTHER

GULL WING

24

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 mA

3.5 V

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

.65 mm

85 Cel

-30 Cel

TIN LEAD

DUAL

R-PDSO-G24

1.6 mm

5.6 mm

Not Qualified

e0

7.8 mm

TA31170FN(EL)

Toshiba

CORDLESS TELEPHONE SUPPORT CIRCUIT

COMMERCIAL

GULL WING

16

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

9 mA

3.2 V

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

.65 mm

70 Cel

-20 Cel

DUAL

R-PDSO-G16

1.6 mm

4.4 mm

Not Qualified

5 mm

TA31101F

Toshiba

CORDLESS TELEPHONE SUPPORT CIRCUIT

COMMERCIAL EXTENDED

GULL WING

16

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

BIPOLAR

5 mA

3 V

1.8/9

SMALL OUTLINE, SHRINK PITCH

SOP16,.25,40

Cordless Telephone ICs

1 mm

75 Cel

-25 Cel

TIN LEAD

DUAL

R-PDSO-G16

1.9 mm

4.6 mm

Not Qualified

e0

8.2 mm

TA31101AF

Toshiba

CORDLESS TELEPHONE SUPPORT CIRCUIT

COMMERCIAL EXTENDED

GULL WING

16

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

BIPOLAR

5 mA

3 V

1.8/9

SMALL OUTLINE, SHRINK PITCH

SOP16,.25,40

Cordless Telephone ICs

1 mm

75 Cel

-25 Cel

TIN LEAD

DUAL

R-PDSO-G16

1.9 mm

4.6 mm

Not Qualified

e0

8.2 mm

TA31161FN(EL)

Toshiba

CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT

OTHER

GULL WING

16

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

7.5 mA

3 V

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

.65 mm

85 Cel

-35 Cel

DUAL

R-PDSO-G16

1.6 mm

4.4 mm

Not Qualified

5 mm

TA31103F-TP2

Toshiba

CORDLESS TELEPHONE SUPPORT CIRCUIT

COMMERCIAL

GULL WING

24

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

9.5 mA

3 V

SMALL OUTLINE, SHRINK PITCH

1 mm

70 Cel

-20 Cel

TIN LEAD

DUAL

R-PDSO-G24

2.2 mm

6 mm

Not Qualified

e0

13 mm

TA31161FN-TP1

Toshiba

CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT

OTHER

GULL WING

16

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

7.5 mA

3 V

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

.65 mm

85 Cel

-35 Cel

TIN LEAD

DUAL

R-PDSO-G16

1.6 mm

4.4 mm

Not Qualified

e0

5 mm

TA31180FN

Toshiba

COMMERCIAL

GULL WING

24

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

BIPOLAR

9 mA

2 V

2

SMALL OUTLINE, SHRINK PITCH

SSOP24,.3

Cordless Telephone ICs

.635 mm

70 Cel

-20 Cel

DUAL

R-PDSO-G24

Not Qualified

TA31132FN(EL)

Toshiba

CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT

OTHER

GULL WING

24

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 mA

3.5 V

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

.65 mm

85 Cel

-30 Cel

TIN LEAD

DUAL

R-PDSO-G24

1.6 mm

5.6 mm

Not Qualified

e0

7.8 mm

TA31103FN(EL)

Toshiba

CORDLESS TELEPHONE SUPPORT CIRCUIT

COMMERCIAL

GULL WING

24

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

9.5 mA

3 V

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

.65 mm

70 Cel

-20 Cel

TIN LEAD

DUAL

R-PDSO-G24

1.6 mm

5.6 mm

Not Qualified

e0

7.8 mm

TA31102F-TP2

Toshiba

CORDLESS TELEPHONE SUPPORT CIRCUIT

OTHER

GULL WING

16

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

6 mA

5 V

SMALL OUTLINE, SHRINK PITCH

1 mm

85 Cel

-30 Cel

TIN LEAD

DUAL

R-PDSO-G16

1.9 mm

4.6 mm

Not Qualified

e0

8.2 mm

TA31132F(EL)

Toshiba

CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT

OTHER

GULL WING

24

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 mA

3.5 V

SMALL OUTLINE, SHRINK PITCH

1 mm

85 Cel

-30 Cel

DUAL

R-PDSO-G24

2.2 mm

6 mm

Not Qualified

13 mm

TA31102F(ER)

Toshiba

CORDLESS TELEPHONE SUPPORT CIRCUIT

OTHER

GULL WING

16

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

6 mA

5 V

SMALL OUTLINE, SHRINK PITCH

1 mm

85 Cel

-30 Cel

TIN LEAD

DUAL

R-PDSO-G16

1.9 mm

4.6 mm

Not Qualified

e0

8.2 mm

TA8103F

Toshiba

CORDLESS TELEPHONE SUPPORT CIRCUIT

COMMERCIAL EXTENDED

GULL WING

24

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

2.5 V

SMALL OUTLINE, SHRINK PITCH

1 mm

80 Cel

-30 Cel

DUAL

R-PDSO-G24

2.2 mm

6 mm

Not Qualified

13 mm

TA31136F-TP1

Toshiba

CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT

OTHER

GULL WING

16

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

SMALL OUTLINE, SHRINK PITCH

1 mm

85 Cel

-30 Cel

DUAL

R-PDSO-G16

1.9 mm

4.6 mm

Not Qualified

8.2 mm

TA31137FN-TP2

Toshiba

CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT

OTHER

GULL WING

24

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

5.6 mA

3 V

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

.65 mm

85 Cel

-30 Cel

DUAL

R-PDSO-G24

1.6 mm

5.6 mm

Not Qualified

7.8 mm

TB31261AF

Toshiba

CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT

COMMERCIAL

GULL WING

52

QFP

SQUARE

PLASTIC/EPOXY

YES

1

BICMOS

.0333 mA

3.6 V

3.6

FLATPACK

QFP52,.52SQ

Cordless Telephone ICs

.65 mm

70 Cel

-20 Cel

QUAD

S-PQFP-G52

2.45 mm

10 mm

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

10 mm

TA31136FN(ER)

Toshiba

CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT

OTHER

GULL WING

16

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

.65 mm

85 Cel

-30 Cel

DUAL

R-PDSO-G16

1.6 mm

4.4 mm

Not Qualified

5 mm

TA31101P

Toshiba

CORDLESS TELEPHONE SUPPORT CIRCUIT

COMMERCIAL EXTENDED

THROUGH-HOLE

16

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

BIPOLAR

5 mA

3 V

1.8/9

IN-LINE

DIP16,.3

Cordless Telephone ICs

2.54 mm

75 Cel

-25 Cel

TIN LEAD

DUAL

R-PDIP-T16

4.45 mm

7.62 mm

Not Qualified

e0

19.25 mm

TA2056FNG

Toshiba

CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT

COMMERCIAL EXTENDED

GULL WING

24

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

BIPOLAR

1.2 V

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

.65 mm

75 Cel

-25 Cel

DUAL

R-PDSO-G24

1.6 mm

5.6 mm

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

7.8 mm

TA31170FN-TP2

Toshiba

CORDLESS TELEPHONE SUPPORT CIRCUIT

COMMERCIAL

GULL WING

16

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

9 mA

3.2 V

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

.65 mm

70 Cel

-20 Cel

TIN LEAD

DUAL

R-PDSO-G16

1.6 mm

4.4 mm

Not Qualified

e0

5 mm

TA31132FN-TP2

Toshiba

CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT

OTHER

GULL WING

24

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 mA

3.5 V

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

.65 mm

85 Cel

-30 Cel

DUAL

R-PDSO-G24

1.6 mm

5.6 mm

Not Qualified

7.8 mm

TA2056FN

Toshiba

CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT

COMMERCIAL EXTENDED

GULL WING

24

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

BIPOLAR

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

.65 mm

TIN LEAD

DUAL

R-PDSO-G24

1.6 mm

5.6 mm

Not Qualified

e0

7.8 mm

TA31132F

Toshiba

CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT

OTHER

GULL WING

24

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 mA

3.5 V

SMALL OUTLINE, SHRINK PITCH

1 mm

85 Cel

-30 Cel

DUAL

R-PDSO-G24

2.2 mm

6 mm

Not Qualified

13 mm

TA31136FN(EL)

Toshiba

CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT

OTHER

GULL WING

16

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

.65 mm

85 Cel

-30 Cel

DUAL

R-PDSO-G16

1.6 mm

4.4 mm

Not Qualified

5 mm

TG2403CT

Toshiba

CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT

INDUSTRIAL

BUTT

20

HVBCC

RECTANGULAR

UNSPECIFIED

YES

1

3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

BOTTOM

R-XBCC-B20

.53 mm

2.9 mm

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

3.9 mm

TA31170FN

Toshiba

CORDLESS TELEPHONE SUPPORT CIRCUIT

COMMERCIAL

GULL WING

16

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

9 mA

3.2 V

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

.65 mm

70 Cel

-20 Cel

TIN LEAD

DUAL

R-PDSO-G16

1.6 mm

4.4 mm

Not Qualified

e0

5 mm

TA31170FN-TP1

Toshiba

CORDLESS TELEPHONE SUPPORT CIRCUIT

COMMERCIAL

GULL WING

16

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

9 mA

3.2 V

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

.65 mm

70 Cel

-20 Cel

TIN LEAD

DUAL

R-PDSO-G16

1.6 mm

4.4 mm

Not Qualified

e0

5 mm

Cordless Phone ICs

Cordless phone ICs (Integrated Circuits) are the electronic components that provide the processing power and functionality for modern cordless phones. They are responsible for a wide range of functions, including signal processing, data storage, and communication protocols.

Some common types of cordless phone ICs include:

1. Baseband processors: These ICs are responsible for handling the core functions of a cordless phone, such as making calls and sending messages. They also manage the phone's power consumption and system resources.

2. Radio frequency (RF) transceivers: These ICs are responsible for transmitting and receiving RF signals over the cordless phone's base station and handset. They also provide the ability to switch between different frequency bands and channels.

3. Audio codecs: These ICs are responsible for encoding and decoding audio signals for clear voice communication over the cordless phone.

4. Power management ICs: These ICs manage the power supply and battery life of a cordless phone. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

5. Memory ICs: These ICs provide storage for the cordless phone's operating system, contacts, and call history. They include flash memory, RAM, and other types of non-volatile memory.