Cordless Phone ICs

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
PCD5042HZ	NXP Semiconductors	CORDLESS TELEPHONE BURST MODE CONTROLLER	OTHER	GULL WING	80	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	.012 mA	3 V	3/5	FLATPACK, LOW PROFILE, FINE PITCH	QFP80,.55SQ,20	Cordless Telephone ICs	.5 mm	70 Cel	-25 Cel		QUAD	S-PQFP-G80		1.6 mm	12 mm	Not Qualified				12 mm
PCD5041HZ	NXP Semiconductors	CORDLESS TELEPHONE BURST MODE CONTROLLER	OTHER	GULL WING	80	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	70 Cel	-25 Cel		QUAD	S-PQFP-G80		1.6 mm	12 mm	Not Qualified				12 mm
TEA1118AT-T	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT	COMMERCIAL EXTENDED	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR		2.9 V		SMALL OUTLINE			1.27 mm	75 Cel	-25 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G14		1.75 mm	3.9 mm	Not Qualified	e4			8.65 mm
SAA1575HL/V2	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel		QUAD	S-PQFP-G100		1.6 mm	14 mm	Not Qualified				14 mm
935237450512	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT	COMMERCIAL EXTENDED	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			2.9 V		SMALL OUTLINE			1.27 mm	75 Cel	-25 Cel		DUAL	R-PDSO-G14		1.75 mm	3.9 mm	Not Qualified				8.65 mm
UAA2078M	NXP Semiconductors	CORDLESS TELEPHONE SUPPORT CIRCUIT	COMMERCIAL	GULL WING	16	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	70 Cel	-10 Cel		DUAL	R-PDSO-G16		1.5 mm	4.4 mm	Not Qualified				5.2 mm
UAA2077AM	NXP Semiconductors	CORDLESS TELEPHONE SUPPORT CIRCUIT	OTHER	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS		4 V	4	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	SSOP20,.25	Other Telecom ICs	.65 mm	85 Cel	-30 Cel		DUAL	R-PDSO-G20		1.5 mm	4.4 mm	Not Qualified				6.5 mm
PCD50912H	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT		GULL WING	80	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			3/3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP80,.55SQ,20	Other Telecom ICs	.5 mm			TIN	QUAD	S-PQFP-G80		1.6 mm	12 mm	Not Qualified	e3			12 mm
TEA1118ATD	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT	COMMERCIAL EXTENDED	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR		1.6 V		SMALL OUTLINE			1.27 mm	75 Cel	-25 Cel		DUAL	R-PDSO-G14		1.75 mm	3.9 mm	Not Qualified				8.65 mm
SA58640DK,112	NXP Semiconductors	CORDLESS TELEPHONE SUPPORT CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			5 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G20	1	1.5 mm	4.4 mm	Not Qualified	e4			6.5 mm
PCD5042HZ-T	NXP Semiconductors	CORDLESS TELEPHONE BURST MODE CONTROLLER	OTHER	GULL WING	80	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	70 Cel	-25 Cel		QUAD	S-PQFP-G80		1.6 mm	12 mm	Not Qualified				12 mm
PCD5091H	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT		GULL WING	100	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		3 V	3/3.3,5	FLATPACK	QFP100,.7X.9	Other Telecom ICs	.65 mm			TIN	QUAD	R-PQFP-G100		3.2 mm	14 mm	Not Qualified	e3			20 mm
PCD5092H	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT		GULL WING	100	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		3 V	3/3.3,5	FLATPACK	QFP100,.7X.9	Other Telecom ICs	.65 mm			TIN	QUAD	R-PQFP-G100		3.2 mm	14 mm	Not Qualified	e3			20 mm
CT914B/HM	NXP Semiconductors	CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT		UNSPECIFIED			UNSPECIFIED	UNSPECIFIED	NO	1					MICROELECTRONIC ASSEMBLY							UNSPECIFIED	X-XXMA-X				Not Qualified
UAA3545HL	NXP Semiconductors	CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT	COMMERCIAL	GULL WING	32	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS		3.2 V	3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP32,.28SQ,20	Cordless Telephone ICs	.5 mm	60 Cel	-10 Cel	MATTE TIN	QUAD	S-PQFP-G32		1.6 mm	5 mm	Not Qualified	e3			5 mm
PCD5090H	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT		GULL WING	100	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS				FLATPACK			.65 mm				QUAD	R-PQFP-G100		3.2 mm	14 mm	Not Qualified				20 mm
SA58641DK,112	NXP Semiconductors	CORDLESS TELEPHONE SUPPORT CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			5 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G20	1	1.5 mm	4.4 mm	Not Qualified	e4			6.5 mm
PCD50922H	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT		GULL WING	80	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			3/3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP80,.55SQ,20	Other Telecom ICs	.5 mm			TIN	QUAD	S-PQFP-G80		1.6 mm	12 mm	Not Qualified	e3			12 mm
CT914H/HM	NXP Semiconductors	CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT		UNSPECIFIED			UNSPECIFIED	UNSPECIFIED	NO	1					MICROELECTRONIC ASSEMBLY							UNSPECIFIED	X-XXMA-X				Not Qualified
935277007112	NXP Semiconductors	CORDLESS TELEPHONE SUPPORT CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			5 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G20		1.5 mm	4.4 mm					6.5 mm
PCD5090HZ	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT		GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS				FLATPACK, LOW PROFILE, FINE PITCH			.5 mm				QUAD	S-PQFP-G100		1.6 mm	14 mm	Not Qualified				14 mm
935220650518	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT	COMMERCIAL EXTENDED	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			2.9 V		SMALL OUTLINE			1.27 mm	75 Cel	-25 Cel		DUAL	R-PDSO-G14		1.75 mm	3.9 mm	Not Qualified				8.65 mm
CT914H	NXP Semiconductors	CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT		UNSPECIFIED			UNSPECIFIED	UNSPECIFIED	NO	1					MICROELECTRONIC ASSEMBLY							UNSPECIFIED	X-XXMA-X				Not Qualified
PCD5097H	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT		GULL WING	100	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS				FLATPACK			.65 mm				QUAD	R-PQFP-G100		3.2 mm	14 mm	Not Qualified				20 mm
UAA2067G-T	NXP Semiconductors	CORDLESS TELEPHONE SUPPORT CIRCUIT	OTHER	GULL WING	32	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS		3.6 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-30 Cel		QUAD	S-PQFP-G32		1.6 mm	5 mm	Not Qualified				5 mm
CT918H/HM	NXP Semiconductors	CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT		UNSPECIFIED			UNSPECIFIED	UNSPECIFIED	NO	1					MICROELECTRONIC ASSEMBLY							UNSPECIFIED	X-XXMA-X				Not Qualified
953237440118	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT	COMMERCIAL EXTENDED	GULL WING	16	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR		1.6 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	75 Cel	-25 Cel		DUAL	R-PDSO-G16		1.5 mm	4.4 mm	Not Qualified				5.2 mm
935260577557	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel		QUAD	S-PQFP-G100		1.6 mm	14 mm	Not Qualified				14 mm
TEA1118M	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT	COMMERCIAL EXTENDED	GULL WING	16	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR	.0014 mA	2.9 V	2.9	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	SSOP16,.25	Cordless Telephone ICs	.65 mm	75 Cel	-25 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	R-PDSO-G16		1.5 mm	4.4 mm	Not Qualified	e4			5.2 mm
TEA1118AT/C1	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT	COMMERCIAL EXTENDED	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR		1.6 V		SMALL OUTLINE			1.27 mm	75 Cel	-25 Cel		DUAL	R-PDSO-G14		1.75 mm	3.9 mm	Not Qualified				8.65 mm
PCD5041	NXP Semiconductors	CORDLESS TELEPHONE BURST MODE CONTROLLER		GULL WING	64	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS				FLATPACK			1 mm				QUAD	R-PQFP-G64		3.2 mm	14 mm	Not Qualified				20 mm
935202550557	NXP Semiconductors	CORDLESS TELEPHONE SUPPORT CIRCUIT	OTHER	GULL WING	32	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS		3.6 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-30 Cel	TIN	QUAD	S-PQFP-G32		1.6 mm	5 mm	Not Qualified	e3			5 mm
UAA3545HL/C1,118	NXP Semiconductors	CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT	COMMERCIAL	GULL WING	32	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS		3.2 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	60 Cel	-10 Cel		QUAD	S-PQFP-G32		1.6 mm	5 mm	Not Qualified		40	260	5 mm
PCD4440T	NXP Semiconductors	CORDLESS TELEPHONE SCRAMBLER/DESCRAMBLER	OTHER	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		5 V		SMALL OUTLINE			1.27 mm	70 Cel	-25 Cel		DUAL	R-PDSO-G8		2.65 mm	7.5 mm	Not Qualified				7.55 mm
SA58641DK	NXP Semiconductors	CORDLESS TELEPHONE SUPPORT CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			5 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	R-PDSO-G20	1	1.5 mm	4.4 mm	Not Qualified	e4	30	260	6.5 mm
TEA1118AM/C1	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT	COMMERCIAL EXTENDED	GULL WING	16	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR		1.6 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	75 Cel	-25 Cel		DUAL	R-PDSO-G16		1.5 mm	4.4 mm	Not Qualified				5.2 mm
PCD5042H	NXP Semiconductors	CORDLESS TELEPHONE BURST MODE CONTROLLER	OTHER	GULL WING	64	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	.012 mA	3 V	3/5	FLATPACK	QFP64,.7X.95,40	Cordless Telephone ICs	1 mm	70 Cel	-25 Cel		QUAD	R-PQFP-G64		3.2 mm	14 mm	Not Qualified				20 mm
953237440112	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT	COMMERCIAL EXTENDED	GULL WING	16	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR		1.6 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	75 Cel	-25 Cel		DUAL	R-PDSO-G16		1.5 mm	4.4 mm	Not Qualified				5.2 mm
CT914B	NXP Semiconductors	CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT		UNSPECIFIED			UNSPECIFIED	UNSPECIFIED	NO	1					MICROELECTRONIC ASSEMBLY							UNSPECIFIED	X-XXMA-X				Not Qualified
UBA1706TS	NXP Semiconductors	CORDLESS TELEPHONE SUPPORT CIRCUIT	COMMERCIAL EXTENDED	GULL WING	24	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS	.0032 mA	3.3 V	3.3/5	SMALL OUTLINE, SHRINK PITCH	SSOP24,.3	Digital Transmission Interfaces	.65 mm	75 Cel	-25 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G24		2 mm	5.3 mm	Not Qualified	e4			8.2 mm
UBA1707T/C2	NXP Semiconductors	CORDLESS TELEPHONE SUPPORT CIRCUIT	COMMERCIAL EXTENDED	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS				SMALL OUTLINE			1.27 mm	75 Cel	-25 Cel		DUAL	R-PDSO-G28		2.65 mm	7.5 mm	Not Qualified				17.9 mm
PCD5090HZ-T	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT		GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS				FLATPACK, LOW PROFILE, FINE PITCH			.5 mm				QUAD	S-PQFP-G100		1.6 mm	14 mm	Not Qualified				14 mm
PCD5040-T	NXP Semiconductors	CORDLESS TELEPHONE BURST MODE CONTROLLER		GULL WING	64	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS				FLATPACK			1 mm			TIN	QUAD	R-PQFP-G64		3.2 mm	14 mm	Not Qualified	e3			20 mm
UAA3540TS	NXP Semiconductors	CORDLESS TELEPHONE SUPPORT CIRCUIT	COMMERCIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3.2 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	60 Cel	-10 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G20		1.5 mm	4.4 mm	Not Qualified	e4			6.5 mm
935277007118	NXP Semiconductors	CORDLESS TELEPHONE SUPPORT CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			5 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G20		1.5 mm	4.4 mm					6.5 mm
PCD5095H	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT		GULL WING	100	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		3 V	3/3.3,5	FLATPACK	QFP100,.7X.9	Other Telecom ICs	.65 mm				QUAD	R-PQFP-G100		3.2 mm	14 mm	Not Qualified				20 mm
953237450512	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT	COMMERCIAL EXTENDED	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR		1.6 V		SMALL OUTLINE			1.27 mm	75 Cel	-25 Cel		DUAL	R-PDSO-G14		1.75 mm	3.9 mm	Not Qualified				8.65 mm
UBA1707TS	NXP Semiconductors	CORDLESS TELEPHONE SUPPORT CIRCUIT	COMMERCIAL EXTENDED	GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS			3.3/5	SMALL OUTLINE	SSOP28,.3	Digital Transmission Interfaces	.65 mm	75 Cel	-25 Cel		DUAL	R-PDSO-G28		2 mm	5.3 mm	Not Qualified				10.2 mm

Cordless Phone ICs

Cordless phone ICs (Integrated Circuits) are the electronic components that provide the processing power and functionality for modern cordless phones. They are responsible for a wide range of functions, including signal processing, data storage, and communication protocols.

Some common types of cordless phone ICs include:

1. Baseband processors: These ICs are responsible for handling the core functions of a cordless phone, such as making calls and sending messages. They also manage the phone's power consumption and system resources.

2. Radio frequency (RF) transceivers: These ICs are responsible for transmitting and receiving RF signals over the cordless phone's base station and handset. They also provide the ability to switch between different frequency bands and channels.

3. Audio codecs: These ICs are responsible for encoding and decoding audio signals for clear voice communication over the cordless phone.

4. Power management ICs: These ICs manage the power supply and battery life of a cordless phone. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

5. Memory ICs: These ICs provide storage for the cordless phone's operating system, contacts, and call history. They include flash memory, RAM, and other types of non-volatile memory.